IT1296096B1 - Dispositivo per il sostegno di una piastra di supporto per circuiti stampati durante la fase di stampa serigrafica - Google Patents
Dispositivo per il sostegno di una piastra di supporto per circuiti stampati durante la fase di stampa serigraficaInfo
- Publication number
- IT1296096B1 IT1296096B1 ITMI972511A IT1296096B1 IT 1296096 B1 IT1296096 B1 IT 1296096B1 IT MI972511 A ITMI972511 A IT MI972511A IT 1296096 B1 IT1296096 B1 IT 1296096B1
- Authority
- IT
- Italy
- Prior art keywords
- supporting
- support plate
- screen printing
- printed circuits
- circuits during
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
- B41F15/26—Supports for workpieces for articles with flat surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT002511 IT1296096B1 (it) | 1997-11-11 | 1997-11-11 | Dispositivo per il sostegno di una piastra di supporto per circuiti stampati durante la fase di stampa serigrafica |
EP98118778A EP0917414A1 (en) | 1997-11-11 | 1998-10-05 | Device for holding a substrate board for printed circuits during the screen printing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT002511 IT1296096B1 (it) | 1997-11-11 | 1997-11-11 | Dispositivo per il sostegno di una piastra di supporto per circuiti stampati durante la fase di stampa serigrafica |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI972511A1 ITMI972511A1 (it) | 1999-05-11 |
IT1296096B1 true IT1296096B1 (it) | 1999-06-09 |
Family
ID=11378186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT002511 IT1296096B1 (it) | 1997-11-11 | 1997-11-11 | Dispositivo per il sostegno di una piastra di supporto per circuiti stampati durante la fase di stampa serigrafica |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0917414A1 (it) |
IT (1) | IT1296096B1 (it) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10117873B4 (de) * | 2001-04-10 | 2005-06-09 | Ekra Eduard Kraft Gmbh Maschinenfabrik | Transport- und Befestigungsvorrichtung für Substrate |
DE102004051935B4 (de) * | 2004-10-25 | 2006-09-28 | Metaq Gmbh | Druckschablone |
JP4857720B2 (ja) * | 2005-11-11 | 2012-01-18 | パナソニック株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
US8704623B2 (en) * | 2007-02-16 | 2014-04-22 | Sikorsky Aircraft Corporation | Reconfigurable harness board |
JP5095482B2 (ja) * | 2008-04-24 | 2012-12-12 | 富士機械製造株式会社 | 基板位置決め装置、基板処理装置、基板位置決め方法、基板処理方法 |
JP6569091B2 (ja) * | 2017-05-23 | 2019-09-04 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4937097A (en) * | 1987-11-19 | 1990-06-26 | Toshin Kogyo Co., Ltd. | Apparatus for and method of screen printing on boards |
DE4204392A1 (de) * | 1992-02-14 | 1993-09-23 | Rheinmetall Gmbh | Verfahren und vorrichtung zum siebdrucken |
JPH0852856A (ja) * | 1994-08-10 | 1996-02-27 | Kengo Hiruta | スクリーン印刷装置 |
US5682817A (en) * | 1996-07-01 | 1997-11-04 | Sony Corporation | Quick removing compact disc printing nest |
-
1997
- 1997-11-11 IT IT002511 patent/IT1296096B1/it active IP Right Grant
-
1998
- 1998-10-05 EP EP98118778A patent/EP0917414A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP0917414A1 (en) | 1999-05-19 |
ITMI972511A1 (it) | 1999-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |