IT1283702B1 - Procedimento per la fabbricazione di una disposizione di piastre a circuiti stampati - Google Patents

Procedimento per la fabbricazione di una disposizione di piastre a circuiti stampati

Info

Publication number
IT1283702B1
IT1283702B1 IT96MI000594A ITMI960594A IT1283702B1 IT 1283702 B1 IT1283702 B1 IT 1283702B1 IT 96MI000594 A IT96MI000594 A IT 96MI000594A IT MI960594 A ITMI960594 A IT MI960594A IT 1283702 B1 IT1283702 B1 IT 1283702B1
Authority
IT
Italy
Prior art keywords
procedure
manufacturing
printed circuit
circuit plate
plate arrangement
Prior art date
Application number
IT96MI000594A
Other languages
English (en)
Inventor
Willy Bentz
Ernst Waldemar
Heiko Buss
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI960594A0 publication Critical patent/ITMI960594A0/it
Publication of ITMI960594A1 publication Critical patent/ITMI960594A1/it
Application granted granted Critical
Publication of IT1283702B1 publication Critical patent/IT1283702B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Making Paper Articles (AREA)
IT96MI000594A 1995-03-29 1996-03-26 Procedimento per la fabbricazione di una disposizione di piastre a circuiti stampati IT1283702B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19511486A DE19511486A1 (de) 1995-03-29 1995-03-29 Verfahren zur Herstellung einer Leiterplattenanordnung

Publications (3)

Publication Number Publication Date
ITMI960594A0 ITMI960594A0 (it) 1996-03-26
ITMI960594A1 ITMI960594A1 (it) 1997-09-26
IT1283702B1 true IT1283702B1 (it) 1998-04-30

Family

ID=7758034

Family Applications (1)

Application Number Title Priority Date Filing Date
IT96MI000594A IT1283702B1 (it) 1995-03-29 1996-03-26 Procedimento per la fabbricazione di una disposizione di piastre a circuiti stampati

Country Status (3)

Country Link
DE (1) DE19511486A1 (it)
FR (1) FR2733656B1 (it)
IT (1) IT1283702B1 (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH691277A5 (de) * 2000-02-29 2001-06-15 Ascom Ag Verfahren zur Herstellung von Leiterplatten sowie Leiterplatte.
DE10160041A1 (de) * 2001-12-06 2003-09-25 Marconi Comm Gmbh Elektronisches Schaltungsmodul und Verfahren zu dessen Montage
FR2835689A1 (fr) * 2002-02-01 2003-08-08 Siemens Vdo Automotive Procede de collage d'un circuit imprime rigide sur une plaque d'aluminium
US7416011B2 (en) 2005-01-27 2008-08-26 Delphi Technologies, Inc. Electronic assembly having a substrate laminated within a backplate cavity
DE102005048702B4 (de) * 2005-10-11 2014-02-20 Continental Automotive Gmbh Elektrische Anordnung zweier elektrisch leitender Fügepartner und Verfahren zum Befestigen einer Platte auf einer Grundplatte

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02148788A (ja) * 1988-11-29 1990-06-07 Fuji Photo Film Co Ltd 金属プリント配線基板の加工方法
DE4035526A1 (de) * 1990-11-08 1992-05-14 Bosch Gmbh Robert Elektrisches geraet, insbesondere schalt- und steuergeraet fuer kraftfahrzeuge, und verfahren zur herstellung
EP0586841A1 (de) * 1992-07-30 1994-03-16 Reichle + De-Massari AG Elektro-Ingenieure Printplatte und Montagemodul für einen Anschluss abgeschirmter Leiter und Verteilersysteme im Schwachstrom-Anlagebau
JP2734318B2 (ja) * 1992-10-09 1998-03-30 太陽誘電株式会社 混成集積回路装置の製造方法

Also Published As

Publication number Publication date
FR2733656B1 (fr) 1999-06-25
ITMI960594A1 (it) 1997-09-26
ITMI960594A0 (it) 1996-03-26
DE19511486A1 (de) 1996-10-02
FR2733656A1 (fr) 1996-10-31

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Legal Events

Date Code Title Description
0001 Granted