DE3851668T2 - Zusammengesetzte supraleitende Schicht. - Google Patents
Zusammengesetzte supraleitende Schicht.Info
- Publication number
- DE3851668T2 DE3851668T2 DE19883851668 DE3851668T DE3851668T2 DE 3851668 T2 DE3851668 T2 DE 3851668T2 DE 19883851668 DE19883851668 DE 19883851668 DE 3851668 T DE3851668 T DE 3851668T DE 3851668 T2 DE3851668 T2 DE 3851668T2
- Authority
- DE
- Germany
- Prior art keywords
- superconducting layer
- compound superconducting
- compound
- layer
- superconducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming superconductor layers
- H10N60/0408—Processes for depositing or forming superconductor layers by sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming superconductor layers
- H10N60/0576—Processes for depositing or forming superconductor layers characterised by the substrate
- H10N60/0604—Monocrystalline substrates, e.g. epitaxial growth
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming superconductor layers
- H10N60/0576—Processes for depositing or forming superconductor layers characterised by the substrate
- H10N60/0632—Intermediate layers, e.g. for growth control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/93—Electric superconducting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
- Y10S505/701—Coated or thin film device, i.e. active or passive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
- Y10S505/701—Coated or thin film device, i.e. active or passive
- Y10S505/702—Josephson junction present
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
- Y10S505/701—Coated or thin film device, i.e. active or passive
- Y10S505/703—Microelectronic device with superconducting conduction line
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
- Y10S505/704—Wire, fiber, or cable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62186154A JPS6430112A (en) | 1987-07-24 | 1987-07-24 | Superconductor |
JP62186153A JP2802063B2 (ja) | 1987-07-24 | 1987-07-24 | 超電導体 |
JP62189279A JPS6433816A (en) | 1987-07-29 | 1987-07-29 | Superconductor |
JP62189280A JPS6433817A (en) | 1987-07-29 | 1987-07-29 | Superconductor |
Publications (3)
Publication Number | Publication Date |
---|---|
DE3851668D1 DE3851668D1 (de) | 1994-11-03 |
DE3851668T2 true DE3851668T2 (de) | 1995-05-04 |
DE3851668T3 DE3851668T3 (de) | 1999-03-04 |
Family
ID=27475261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19883851668 Expired - Fee Related DE3851668T3 (de) | 1987-07-24 | 1988-07-22 | Zusammengesetzte supraleitende Schicht. |
Country Status (3)
Country | Link |
---|---|
US (3) | US5661112A (de) |
EP (1) | EP0300499B2 (de) |
DE (1) | DE3851668T3 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3851668T3 (de) * | 1987-07-24 | 1999-03-04 | Matsushita Electric Ind Co Ltd | Zusammengesetzte supraleitende Schicht. |
US4980339A (en) * | 1987-07-29 | 1990-12-25 | Matsushita Electric Industrial Co., Ltd. | Superconductor structure |
CA1303252C (en) * | 1987-08-13 | 1992-06-09 | John A. Agostinelli | Circuit element with barrier layer for protecting crystalline oxide conductive layer |
JPH01171247A (ja) * | 1987-12-25 | 1989-07-06 | Mitsubishi Metal Corp | 超伝導体配線の構造 |
DE69018303T2 (de) * | 1989-04-17 | 1995-11-09 | Ngk Insulators Ltd | Supraleitende Struktur zur magnetischen Abschirmung. |
US5741377A (en) * | 1995-04-10 | 1998-04-21 | Martin Marietta Energy Systems, Inc. | Structures having enhanced biaxial texture and method of fabricating same |
DE19634424C2 (de) * | 1996-08-26 | 1998-07-02 | Abb Research Ltd | Verfahren zur Herstellung eines Strombegrenzers mit einem Hochtemperatursupraleiter |
US6387525B1 (en) * | 1997-04-14 | 2002-05-14 | Florida State University | Self insulating substrate tape |
DE19746976C2 (de) | 1997-10-24 | 2000-11-30 | Abb Research Ltd | Hochtemperatursupraleiter-Anordnung |
DE19748483C1 (de) | 1997-11-04 | 1999-03-04 | Siemens Ag | Aufbau mit Hoch-T¶c¶-Supraleitermaterial, Verfahren zur Herstellung und Verwendung des Aufbaus |
US6372356B1 (en) | 1998-06-04 | 2002-04-16 | Xerox Corporation | Compliant substrates for growing lattice mismatched films |
KR100309675B1 (ko) * | 1998-11-23 | 2001-12-17 | 오길록 | 고온초전도계단형모서리조셉슨접합제작방법 |
US6248459B1 (en) * | 1999-03-22 | 2001-06-19 | Motorola, Inc. | Semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon |
US6693033B2 (en) | 2000-02-10 | 2004-02-17 | Motorola, Inc. | Method of removing an amorphous oxide from a monocrystalline surface |
US6590236B1 (en) | 2000-07-24 | 2003-07-08 | Motorola, Inc. | Semiconductor structure for use with high-frequency signals |
US6555946B1 (en) | 2000-07-24 | 2003-04-29 | Motorola, Inc. | Acoustic wave device and process for forming the same |
US6638838B1 (en) | 2000-10-02 | 2003-10-28 | Motorola, Inc. | Semiconductor structure including a partially annealed layer and method of forming the same |
US20020089023A1 (en) * | 2001-01-05 | 2002-07-11 | Motorola, Inc. | Low leakage current metal oxide-nitrides and method of fabricating same |
US6673646B2 (en) | 2001-02-28 | 2004-01-06 | Motorola, Inc. | Growth of compound semiconductor structures on patterned oxide films and process for fabricating same |
US6709989B2 (en) | 2001-06-21 | 2004-03-23 | Motorola, Inc. | Method for fabricating a semiconductor structure including a metal oxide interface with silicon |
JP3506428B2 (ja) * | 2001-07-13 | 2004-03-15 | 株式会社東芝 | 高周波部材 |
US6646293B2 (en) | 2001-07-18 | 2003-11-11 | Motorola, Inc. | Structure for fabricating high electron mobility transistors utilizing the formation of complaint substrates |
US6693298B2 (en) | 2001-07-20 | 2004-02-17 | Motorola, Inc. | Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same |
US6667196B2 (en) | 2001-07-25 | 2003-12-23 | Motorola, Inc. | Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method |
US6589856B2 (en) | 2001-08-06 | 2003-07-08 | Motorola, Inc. | Method and apparatus for controlling anti-phase domains in semiconductor structures and devices |
US6639249B2 (en) | 2001-08-06 | 2003-10-28 | Motorola, Inc. | Structure and method for fabrication for a solid-state lighting device |
US6673667B2 (en) | 2001-08-15 | 2004-01-06 | Motorola, Inc. | Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials |
JP2007200870A (ja) * | 2006-01-26 | 2007-08-09 | Ls Cable Ltd | 超伝導ケーブル用基板の製造方法 |
DE102006036798B4 (de) * | 2006-08-07 | 2013-08-29 | Infineon Technologies Ag | Elektronisches Bauteil und Verfahren zum Herstellen |
US7615385B2 (en) | 2006-09-20 | 2009-11-10 | Hypres, Inc | Double-masking technique for increasing fabrication yield in superconducting electronics |
US8759257B2 (en) * | 2009-10-02 | 2014-06-24 | Ambature, Inc. | High temperature superconducting films and methods for modifying and creating same |
JP4503704B1 (ja) * | 2009-10-22 | 2010-07-14 | パナソニック株式会社 | 熱電変換材料および熱電変換素子 |
FR2967820A1 (fr) * | 2010-11-19 | 2012-05-25 | Nexans | Conducteur de transport d'energie electrique |
US9240317B2 (en) | 2013-03-28 | 2016-01-19 | Umm Al-Qura University | High temperature GaN based super semiconductor and fabrication process |
WO2017040598A1 (en) * | 2015-08-31 | 2017-03-09 | Massachusetts Institute Of Technology | Systems and methods for hybrid superconducting medium |
US10847706B2 (en) | 2015-09-01 | 2020-11-24 | Massachusetts Institute Of Technology | Systems and methods for hybrid superconducting medium comprising first and second layers with different superconductor to induce a proximity effect between thereof |
US11201273B2 (en) * | 2019-09-13 | 2021-12-14 | Microsoft Technology Licensing, Llc | Semiconductor-superconductor heterostructure |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU598113B2 (en) * | 1987-03-14 | 1990-06-14 | Sumitomo Electric Industries, Ltd. | Process for depositing a superconducting thin film |
DE3887910T2 (de) * | 1987-03-20 | 1994-08-04 | Fujikura Ltd | Verfahren zur Herstellung eines Drahtes aus supraleitendem Oxid und damit hergestellter Draht. |
US4826808A (en) * | 1987-03-27 | 1989-05-02 | Massachusetts Institute Of Technology | Preparation of superconducting oxides and oxide-metal composites |
US4952554A (en) * | 1987-04-01 | 1990-08-28 | At&T Bell Laboratories | Apparatus and systems comprising a clad superconductive oxide body, and method for producing such body |
US5122507A (en) * | 1987-05-01 | 1992-06-16 | Sumitomo Electric Industries, Ltd. | Process for manufacturing a superconducting composite |
US5017551A (en) * | 1987-05-04 | 1991-05-21 | Eastman Kodak Company | Barrier layer containing conductive articles |
US4880770A (en) * | 1987-05-04 | 1989-11-14 | Eastman Kodak Company | Metalorganic deposition process for preparing superconducting oxide films |
JPH0280303A (ja) * | 1987-06-04 | 1990-03-20 | Tonen Corp | 超伝導体薄膜の形成方法及びその為の装置 |
DE3851668T3 (de) * | 1987-07-24 | 1999-03-04 | Matsushita Electric Ind Co Ltd | Zusammengesetzte supraleitende Schicht. |
US4975413A (en) * | 1987-08-12 | 1990-12-04 | Amoco Corporation | Superconductor-coated carbon fiber composites |
-
1988
- 1988-07-22 DE DE19883851668 patent/DE3851668T3/de not_active Expired - Fee Related
- 1988-07-22 US US07/223,016 patent/US5661112A/en not_active Ceased
- 1988-07-22 EP EP19880111867 patent/EP0300499B2/de not_active Expired - Lifetime
-
1998
- 1998-03-06 US US09/035,783 patent/USRE36814E/en not_active Expired - Fee Related
- 1998-11-09 US US09/188,232 patent/US5998337A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
USRE36814E (en) | 2000-08-08 |
US5661112A (en) | 1997-08-26 |
EP0300499A2 (de) | 1989-01-25 |
EP0300499A3 (en) | 1990-12-19 |
EP0300499B2 (de) | 1998-08-19 |
DE3851668T3 (de) | 1999-03-04 |
EP0300499B1 (de) | 1994-09-28 |
US5998337A (en) | 1999-12-07 |
DE3851668D1 (de) | 1994-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8366 | Restricted maintained after opposition proceedings | ||
8339 | Ceased/non-payment of the annual fee |