DE3784706D1 - Verfahren und apparat zum packen integrierter schaltungschips mit einer polymerfilm-bedeckungsschicht. - Google Patents

Verfahren und apparat zum packen integrierter schaltungschips mit einer polymerfilm-bedeckungsschicht.

Info

Publication number
DE3784706D1
DE3784706D1 DE8787906964T DE3784706T DE3784706D1 DE 3784706 D1 DE3784706 D1 DE 3784706D1 DE 8787906964 T DE8787906964 T DE 8787906964T DE 3784706 T DE3784706 T DE 3784706T DE 3784706 D1 DE3784706 D1 DE 3784706D1
Authority
DE
Germany
Prior art keywords
integrated circuit
polymer film
cover layer
circuit chips
film cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787906964T
Other languages
English (en)
Other versions
DE3784706T2 (de
Inventor
William Eichelberger
John Wojnarowski
Brakeley Welles
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE3784706D1 publication Critical patent/DE3784706D1/de
Application granted granted Critical
Publication of DE3784706T2 publication Critical patent/DE3784706T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/01024—Chromium [Cr]
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    • H01L2924/0665—Epoxy resin
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wrappers (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
DE87906964T 1986-09-26 1987-09-28 Verfahren und apparat zum packen integrierter schaltungschips mit einer polymerfilm-bedeckungsschicht. Expired - Lifetime DE3784706T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US91245886A 1986-09-26 1986-09-26

Publications (2)

Publication Number Publication Date
DE3784706D1 true DE3784706D1 (de) 1993-04-15
DE3784706T2 DE3784706T2 (de) 1993-10-14

Family

ID=25431960

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87906964T Expired - Lifetime DE3784706T2 (de) 1986-09-26 1987-09-28 Verfahren und apparat zum packen integrierter schaltungschips mit einer polymerfilm-bedeckungsschicht.

Country Status (5)

Country Link
EP (1) EP0290501B1 (de)
JP (1) JP2562163B2 (de)
KR (1) KR960011853B1 (de)
DE (1) DE3784706T2 (de)
WO (1) WO1988002551A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2624460B2 (fr) * 1987-09-10 1991-04-12 Celette Sa Installation pour la reparation et le controle de carrosseries de vehicules accidentes
WO2006074062A2 (en) * 2004-12-30 2006-07-13 E.I. Dupont De Nemours And Company Encapsulation tool and methods
DE102006040724A1 (de) 2006-08-31 2008-03-06 Siemens Ag Verfahren und Vorrichtung zum Herstellen eines elektronischen Moduls und elektronisches Modul
CN102319956B (zh) * 2011-08-16 2015-04-22 北京博晖创新光电技术股份有限公司 膜动聚合物微流控芯片的基板与隔膜焊接方法
JP2013147589A (ja) * 2012-01-20 2013-08-01 Nitto Denko Corp 電子部品封止用樹脂組成物シートおよびそれを用いた電子部品装置の製法
US20150217529A1 (en) * 2012-10-12 2015-08-06 Sintokogio, Ltd. Decompressing jig and a method for applying pressure on a workpiece by using the decompressing jig
WO2015009238A1 (en) * 2013-07-16 2015-01-22 Agency For Science, Technology And Research Method and apparatus for chip-to-wafer integration
KR101859556B1 (ko) * 2015-09-16 2018-05-21 경희대학교 산학협력단 마우스피스 성형용 열가소성 시트의 가열기 및 이를 갖는 마우스피스 성형장치
US10720348B2 (en) 2018-05-18 2020-07-21 Applied Materials, Inc. Dual load lock chamber

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2210475A1 (de) * 1972-03-04 1973-10-25 Hilmar Herzog Verfahren und vorrichtung zum einhuellen von gegenstaenden aus kunstschaumstoff mit kunststoffolien und damit herzustellende belagplatte mit stufenfalz
US4052241A (en) * 1975-11-13 1977-10-04 Detroit Gasket And Manufacturing Company Method of forming a contoured laminate
DE2915923A1 (de) * 1979-04-20 1980-10-23 Illig Maschinenbau Adolf Vorrichtung zum ueberziehen von teilen mit thermoplastischer kunststoffolie
US4388132A (en) * 1981-06-01 1983-06-14 Burroughs Corporation Method of attaching a protective film to an integrated circuit
JPS59104907A (ja) * 1982-12-08 1984-06-18 Toppan Printing Co Ltd 密着成形装置および密着成形方法
JPS6015124A (ja) * 1983-07-06 1985-01-25 Rikitoshi Nakano 真空ラミネ−ト法
KR920001026B1 (ko) * 1984-02-09 1992-02-01 페어챠일드 카메라 앤드 인스트루먼트 코포레이션 알파입자 보호필름을 갖는 반도체 구조체 및 그 제조방법
JPS6156419A (ja) * 1984-07-27 1986-03-22 Fujitsu Ltd 半導体装置用シ−ト貼付装置

Also Published As

Publication number Publication date
WO1988002551A1 (en) 1988-04-07
KR880701966A (ko) 1988-11-07
EP0290501A1 (de) 1988-11-17
EP0290501B1 (de) 1993-03-10
KR960011853B1 (ko) 1996-09-03
DE3784706T2 (de) 1993-10-14
JP2562163B2 (ja) 1996-12-11
JPH01501032A (ja) 1989-04-06

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