KR880701966A - 중합체 필름 오버레이 층을 채용하는 집적회로칩 패키징 방법 및 장치 - Google Patents

중합체 필름 오버레이 층을 채용하는 집적회로칩 패키징 방법 및 장치

Info

Publication number
KR880701966A
KR880701966A KR1019880700589A KR880700589A KR880701966A KR 880701966 A KR880701966 A KR 880701966A KR 1019880700589 A KR1019880700589 A KR 1019880700589A KR 880700589 A KR880700589 A KR 880700589A KR 880701966 A KR880701966 A KR 880701966A
Authority
KR
South Korea
Prior art keywords
film
workpiece
holder assembly
polymer film
disposed
Prior art date
Application number
KR1019880700589A
Other languages
English (en)
Other versions
KR960011853B1 (ko
Inventor
찰스 윌리암 에이첼버거
스키 로버트 존 워드나로우
케니쓰 브래클리 Ⅱ 윌리스
Original Assignee
아더 엠.킹
제네럴 일렉트릭 컴패니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아더 엠.킹, 제네럴 일렉트릭 컴패니 filed Critical 아더 엠.킹
Publication of KR880701966A publication Critical patent/KR880701966A/ko
Application granted granted Critical
Publication of KR960011853B1 publication Critical patent/KR960011853B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/76—Apparatus for connecting with build-up interconnects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/2401—Structure
    • H01L2224/2402—Laminated, e.g. MCM-L type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Wrappers (AREA)

Abstract

내용 없음

Description

중합체 필름 오버레이 층을 채용하는 집적회로칩 패키징 방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 장치의 횡단면도이고; 제2A도는 중합체 필름과 적층시킬 기판과의 접촉전의 관계를 나타내는 제1도의 요부 구성을 보다 상세히 도시한 횡단면도; 제2B도는 필름이 기판의 표면에 접촉 및 적용된 상태를 도시한 제2A도에 유사한 횡단면도.

Claims (22)

  1. 불규칙한 기판에 중합체 필름을 적용시키기 위한 장치로서, 상기 작업편 및 상기 작업편 상부에서 상기 중합체필름을 지지하기 위한 대체로 평평한 기판 호울더 조립체와; 상기 호울더 조립체의 제1면 및 상기 중합체 필름에 대해 밀봉 가능한 이동성 체임버와; 상기 필름을 상기 기판상부에 그러나 그것과 실질적인 접촉은 이루지 않도록 지지하기 위해 상기 호울더 조립체의 상기 제1면상에 배치된 필름길이와; 상기 호울더 조립체 및 상기 중합체 필름으로 구획된 용적실을 진공상태로 만들기 위한 수단 및 상기 필름을 가열하기 위한 수단을 구비하는 것을 특징으로 하는 장치.
  2. 제1항에 있어서, 상기 가열을 위한 수단은 상기 이동성 체임버내의 적외선 투과창을 포함하는 것을 특징으로 하는 장치.
  3. 제1항에 있어서, 상기 진공 상태로 만들기 위한 수단은 상기 필름길이와 대향하는 지점에서 상기 호울더 조립체의 제2면에 대해 밀봉 가능한 제2 체임버를 포함하고, 상기 제2 체임버 및 상기 호울더 조립체에 의해 구획된 용접실은 상기 중합체 필름 및 상기 호울더 조립체에 의해 구획된 용적실과 적어도 격리되어 서로 유체가 교환될 수 있도록 한 것을 특징으로 하는 장치.
  4. 제3항에 있어서, 상기 필름을 가열하기 위한 상기 수단은 제2 체임버 내에 배치된 히이터로 포함하는 것을 특징으로 하는 장치.
  5. 제1항에 있어서, 상기 호울더 조립체는 상기 작업편이 상부에 배치될 수 있는 적외선 투과창을 포함하는 것을 특징으로 하는 장치.
  6. 제1항에 있어서, 상기 호울더 조립체는 상기 작업편이 상부에 배치될 숭 있는 제2 물질 부분을 포함하는 것을 특징으로 하는 장치.
  7. 제1항에 있어서, 상기 작업편이 내부에 배치될 수 있는 리세스를 형성하도록 상기 호울더 조립체 상에 배치된 대체로 평평한 냉각성 삽입체들을 추가로 포함하는 것을 특징으로 하는 장치.
  8. 불규칙한 형상의 작업편에 중합체 필름을 적용시키기 위한 방법으로서, 상기 필름을 상기 작업편 상부에 그러나 그것과 실질적인 접촉은 이루지 않도록 배치시키는 단계와 상기 비접촉 상태를 유지시키기 위하여 상기 필름의 상·하부를 진공상태로 만든 단계와 가스 방출물들을 제거하기 위해 상기 진공 상태를 유지하면서 상기 필름을 가열하는 단계와 상기 필름을 상기 작업편과 접촉시키기 위하여 상기 필름 상부에 유체 압력조건을 가하는 단계로 이루어지는 것을 특징으로 하는 방법.
  9. 제8항에 있어서, 상기 작업편 상부에 상기 필름을 배치시키기에 앞서 상기 필름과 상기 작업편 사이에 접착제를 배치시키는 단계가 추가로 이루어지는 것을 특징으로 하는 장치.
  10. 제9항에 있어서, 상기 접착제는 열가소성 플라스틱 물질인 것을 특징으로 하는 방법.
  11. 제9항에 있어서, 상기 접착제는 열경화성 물질인 것을 특징으로 하는 방법.
  12. 제9항에 있어서, 상기 접착제는 자외선 경화성 물질인 것을 특징으로 하는 방법.
  13. 제8항에 있어서, 상기 필름은 열가소성 플라스틱 물질이고, 상기 열가소성 플라스택 물질 상부에 해제층을 배치시키는 단계가 추가로 이루어지며, 상기 해제층 상부에 상기 압력 조건이 가해지도록 한 것을 특징으로 하는 방법.
  14. 제13항에 있어서, 상기 필름은 열가소성 플라스틱이고, 그 위에는 금속 해제층이 배치되는 것을 특징으로 하는 장치.
  15. 제8항에 있어서, 상기 중합체 필름은 캐리어층, 포토레지스트층 및 접착제 층을 각각 포함하고, 상기 접착제층이 상기 작업편에 밀접 배치되며, 상기 캐리어층 상부에는 해제층이 배치되는 것을 특징으로 하는 방법.
  16. 제8항에 있어서, 상기 작업편을 에워싸는 영역내에서 상기 중합체 필름을 냉각시키는 단계가 추가로 이루어지는 것을 특징으로 하는 방법.
  17. 제8항에 있어서, 상기 작업편 하부에 해제필름을 배치시키는 단계가 추가로 이루어지는 것을 특징으로 하는 방법.
  18. 제17항에 있어서, 상기 해제필름은 금속 포일인 것을 특징으로 하는 장치.
  19. 제18항에 있어서, 상기 금속 포일은 알루미늄인 것을 특징으로 하는 장치.
  20. 제17항에 있어서, 하부로 부터 상기 작업편을 가열하기 위해 상기 해제 필름내에 적어도 하나의 흠을 제공하는 단계가 추가로 이루어지는 것을 특징으로 하는 방법.
  21. 기판상에 적어도 하나의 회로 칩에 중합체 필름을 적용시키기 위한 장치로서, 상기 기판 및 상기 적어도 하나의 회로칩 상부에서 상기 중합체 필름을 지지하기 위한 대체로 평평한 기판 호울더 조립체와; 상기 호울더 조립체의 제1면 및 상기 중합체 필름에 대해 밀봉 가능한 이동성 체임버와 상기 필름을 상기 적어도 하나의 칩 상부에 그러나 그것과 실질적인 접촉은 이루지 않도록 지지하기 위해 상기 호울더 조리체의 상기 제1면 상에 배치된 필름 길이와; 상기 호울더 조립체 및 상기 중합체 필름에 의해 구획된 용적실을 진공 상태로 만들기 위한 수단 및 상기 필름을 가열하기 위한 수단을 구비하는 것을 특징으로 하는 방법.
  22. 기판상에 배치된 적어도 하나의 회로칩에 중합체 필름을 적용시키기 위한 방법으로서, 상기 필름을 상기 적어도 하나의 회로칩 상부에 그러나 그것과 접촉되지는 않도록 배치시키는 단계와; 상기 비접촉 상태를 유지시키기 위해 상기 필름의 상·하부를 진공상태로 만드는 단계와 가스 방출물들을 제거하기 위해 상기 진공 상태를 유지하면서 상기 필름을 가열하는 단계와; 상기 필름을 상기 적어도 하나의 칩과 접촉시키기 위하여 상기 필름 상부에 유체 압력 조건을 가하는 단계로 이루어 지는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원내용에 의하여 공개하는 것임.
KR1019880700589A 1986-09-26 1987-09-28 중합체막 오버레이층을 이용한 집적회로칩 패키징 방법 및 장치 KR960011853B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US91245886A 1986-09-26 1986-09-26
US912,458 1986-09-26
US912458 1986-09-26
PCT/US1987/002501 WO1988002551A1 (en) 1986-09-26 1987-09-28 Method and apparatus for packaging integrated circuit chips employing a polymer film overlay layer

Publications (2)

Publication Number Publication Date
KR880701966A true KR880701966A (ko) 1988-11-07
KR960011853B1 KR960011853B1 (ko) 1996-09-03

Family

ID=25431960

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880700589A KR960011853B1 (ko) 1986-09-26 1987-09-28 중합체막 오버레이층을 이용한 집적회로칩 패키징 방법 및 장치

Country Status (5)

Country Link
EP (1) EP0290501B1 (ko)
JP (1) JP2562163B2 (ko)
KR (1) KR960011853B1 (ko)
DE (1) DE3784706T2 (ko)
WO (1) WO1988002551A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2624460B2 (fr) * 1987-09-10 1991-04-12 Celette Sa Installation pour la reparation et le controle de carrosseries de vehicules accidentes
KR20070095371A (ko) * 2004-12-30 2007-09-28 이 아이 듀폰 디 네모아 앤드 캄파니 봉입 용구 및 방법
DE102006040724A1 (de) 2006-08-31 2008-03-06 Siemens Ag Verfahren und Vorrichtung zum Herstellen eines elektronischen Moduls und elektronisches Modul
CN102319956B (zh) * 2011-08-16 2015-04-22 北京博晖创新光电技术股份有限公司 膜动聚合物微流控芯片的基板与隔膜焊接方法
JP2013147589A (ja) * 2012-01-20 2013-08-01 Nitto Denko Corp 電子部品封止用樹脂組成物シートおよびそれを用いた電子部品装置の製法
WO2014057769A1 (ja) * 2012-10-12 2014-04-17 新東工業株式会社 減圧治具及び減圧治具を用いた被加圧物の加圧方法
JP6446450B2 (ja) * 2013-07-16 2018-12-26 シンガポール科学技術研究庁Ａｇｅｎｃｙ ｆｏｒ Ｓｃｉｅｎｃｅ， Ｔｅｃｈｎｏｌｏｇｙ ａｎｄ Ｒｅｓｅａｒｃｈ チップをウェハに対し集積する方法及びその装置
KR101859556B1 (ko) * 2015-09-16 2018-05-21 경희대학교 산학협력단 마우스피스 성형용 열가소성 시트의 가열기 및 이를 갖는 마우스피스 성형장치
US10720348B2 (en) * 2018-05-18 2020-07-21 Applied Materials, Inc. Dual load lock chamber

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2210475A1 (de) * 1972-03-04 1973-10-25 Hilmar Herzog Verfahren und vorrichtung zum einhuellen von gegenstaenden aus kunstschaumstoff mit kunststoffolien und damit herzustellende belagplatte mit stufenfalz
US4052241A (en) * 1975-11-13 1977-10-04 Detroit Gasket And Manufacturing Company Method of forming a contoured laminate
DE2915923A1 (de) * 1979-04-20 1980-10-23 Illig Maschinenbau Adolf Vorrichtung zum ueberziehen von teilen mit thermoplastischer kunststoffolie
US4388132A (en) * 1981-06-01 1983-06-14 Burroughs Corporation Method of attaching a protective film to an integrated circuit
JPS59104907A (ja) * 1982-12-08 1984-06-18 Toppan Printing Co Ltd 密着成形装置および密着成形方法
JPS6015124A (ja) * 1983-07-06 1985-01-25 Rikitoshi Nakano 真空ラミネ−ト法
KR920001026B1 (ko) * 1984-02-09 1992-02-01 페어챠일드 카메라 앤드 인스트루먼트 코포레이션 알파입자 보호필름을 갖는 반도체 구조체 및 그 제조방법
JPS6156419A (ja) * 1984-07-27 1986-03-22 Fujitsu Ltd 半導体装置用シ−ト貼付装置

Also Published As

Publication number Publication date
EP0290501A1 (en) 1988-11-17
JP2562163B2 (ja) 1996-12-11
DE3784706D1 (de) 1993-04-15
JPH01501032A (ja) 1989-04-06
EP0290501B1 (en) 1993-03-10
KR960011853B1 (ko) 1996-09-03
DE3784706T2 (de) 1993-10-14
WO1988002551A1 (en) 1988-04-07

Similar Documents

Publication Publication Date Title
DK83782A (da) Polyethylen/metallaminater og fremgangsmaade til fremstilling deraf
DE3864213D1 (de) Thermoplastische fluessigkeitsdurchlaessige schicht.
PT96014A (pt) Processo e peca de ligacao que utilizam uma resistencia electrica para a soldadura de elementos de materia plastica
KR880701966A (ko) 중합체 필름 오버레이 층을 채용하는 집적회로칩 패키징 방법 및 장치
NO179783C (no) Fremgangsmåte for fremstilling av komposittplate samt anvendelse av sådan plate
FI952237A0 (fi) Monikerroksinen kiriste/kutistekalvo
ES293216U (es) Una bolsa de aislamiento termico para envasar al vacio materriales en micropolvo.
KR880000037A (ko) 조절가능한 열효과를 갖는 마이크로웨이브 요리용 포장
ATE61307T1 (de) Zum erhitzen im mikrowellenherd geeignete verpackung.
MX9303475A (es) Aparato para distribuccion de calor.
US3466212A (en) Quilted film process
JPS60148408A (ja) 包装容器のシール方法及び装置
NO820286L (no) Fremgangsmaate og anordning for preging og perforering av en myk plastduk
KR850007317A (ko) 미리 형성된 패터언을 가진 장치기판 장치-부착 점착제 트랜스퍼 장치
SE8406362D0 (sv) Heat bonding methodd and device
KR850003058A (ko) 반도체 웨이퍼(Wafer)에 붙여진 시이트상 부재를 절단하는 장치
KR850006304A (ko) 전도성 다이 어태치 테이프
EP1598176A4 (en) LAMINATE MATERIAL, PRODUCTION PROCESS FOR LAMINATE MATERIAL, LAMINATE MATERIAL AND PACKAGING CONTAINER
US3491509A (en) Method of sealing containers
JP2000135749A (ja) 段ボール製トレー、その製造方法及び製造装置
KR970053693A (ko) 테 부재로 봉합된 교화체로 약한 장치를 패키지하는 방법
KR860000967A (ko) 표면특성의 복제방법
KR830007254A (ko) 캔(Can)의 상부면에 개구용 스코어(score) 및 손잡이를 설치하는 방법
CN212667841U (zh) 一种新型热封板结构
RU2406665C2 (ru) Упаковочная машина для изготовления усадочных упаковок и способ изготовления упаковки путем термического запечатывания упаковочного лотка верхней пленкой

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20100826

Year of fee payment: 15

EXPY Expiration of term