DE3767155D1 - Biegsame halbleiterplatte und verfahren zur herstellung. - Google Patents

Biegsame halbleiterplatte und verfahren zur herstellung.

Info

Publication number
DE3767155D1
DE3767155D1 DE8787906211T DE3767155T DE3767155D1 DE 3767155 D1 DE3767155 D1 DE 3767155D1 DE 8787906211 T DE8787906211 T DE 8787906211T DE 3767155 T DE3767155 T DE 3767155T DE 3767155 D1 DE3767155 D1 DE 3767155D1
Authority
DE
Germany
Prior art keywords
producing
semiconductor board
bending semiconductor
bending
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787906211T
Other languages
English (en)
Inventor
Hisashi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61228384A external-priority patent/JPS6384188A/ja
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Application granted granted Critical
Publication of DE3767155D1 publication Critical patent/DE3767155D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE8787906211T 1986-09-29 1987-09-25 Biegsame halbleiterplatte und verfahren zur herstellung. Expired - Lifetime DE3767155D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61228384A JPS6384188A (ja) 1986-09-29 1986-09-29 フレキシブルプリント基板の製造方法
JP27532586 1986-11-20
PCT/JP1987/000698 WO1988002591A1 (en) 1986-09-29 1987-09-25 Flexible printed circuit board and process for its production

Publications (1)

Publication Number Publication Date
DE3767155D1 true DE3767155D1 (de) 1991-02-07

Family

ID=26528218

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787906211T Expired - Lifetime DE3767155D1 (de) 1986-09-29 1987-09-25 Biegsame halbleiterplatte und verfahren zur herstellung.

Country Status (5)

Country Link
US (1) US4939039A (de)
EP (1) EP0297139B1 (de)
KR (1) KR920008946B1 (de)
DE (1) DE3767155D1 (de)
WO (1) WO1988002591A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
JPH02161740A (ja) * 1988-12-15 1990-06-21 Chisso Corp キャリヤーテープの製造方法
JPH0513902A (ja) * 1990-09-04 1993-01-22 Chisso Corp フレキシブルプリント基板及びその製造法
JPH04262593A (ja) * 1991-02-18 1992-09-17 Hitachi Ltd 多層配線構造体およびその製造方法とその用途
US5156710A (en) * 1991-05-06 1992-10-20 International Business Machines Corporation Method of laminating polyimide to thin sheet metal
US5374469A (en) * 1991-09-19 1994-12-20 Nitto Denko Corporation Flexible printed substrate
GB2265021B (en) * 1992-03-10 1996-02-14 Nippon Steel Chemical Co Photosensitive materials and their use in forming protective layers for printed circuit and process for preparation of printed circuit
US5952194A (en) * 1996-08-01 1999-09-14 Heska Corporation Flea nucleic acid sequences and uses thereof
CN100376386C (zh) * 2001-11-01 2008-03-26 荒川化学工业株式会社 聚酰亚胺-金属层压体和聚酰胺酰亚胺-金属层压体
JP2004098570A (ja) * 2002-09-11 2004-04-02 Amt Kenkyusho:Kk フィルム状積層体およびフレキシブル回路基板
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
US8049112B2 (en) * 2007-04-13 2011-11-01 3M Innovative Properties Company Flexible circuit with cover layer
US7829794B2 (en) * 2007-09-13 2010-11-09 3M Innovative Properties Company Partially rigid flexible circuits and method of making same
CN102001202A (zh) * 2010-09-10 2011-04-06 中山大学 一种聚酰胺酰亚胺覆铜板及其制备方法
CN105175723A (zh) * 2015-09-08 2015-12-23 中国科学院光电技术研究所 一种超低热膨胀系数、超高模量的聚酰亚胺薄膜制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1283378A (fr) * 1961-01-11 1962-02-02 Westinghouse Electric Corp Polyimides polymères linéaires
US3486934A (en) * 1966-08-01 1969-12-30 Minnesota Mining & Mfg Process for the production of a metal-polyimide composite and the resulting article
JPS49129862A (de) * 1973-04-20 1974-12-12
JPS6099133A (ja) * 1983-11-04 1985-06-03 Agency Of Ind Science & Technol ポリアミドイミド成型品
JPS61152733A (ja) * 1984-12-27 1986-07-11 Showa Electric Wire & Cable Co Ltd ポリアミドイミド樹脂組成物およびその製造方法
JPH0732894B2 (ja) * 1991-09-24 1995-04-12 不二塗装株式会社 木質感を有する塗膜の形成方法

Also Published As

Publication number Publication date
EP0297139A1 (de) 1989-01-04
KR880702040A (ko) 1988-11-07
EP0297139B1 (de) 1990-12-27
EP0297139A4 (de) 1989-03-22
WO1988002591A1 (en) 1988-04-07
US4939039A (en) 1990-07-03
KR920008946B1 (ko) 1992-10-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee