DE3785226D1 - Kontinuierliches verfahren zur herstellung von leiterplatten. - Google Patents
Kontinuierliches verfahren zur herstellung von leiterplatten.Info
- Publication number
- DE3785226D1 DE3785226D1 DE8787100003T DE3785226T DE3785226D1 DE 3785226 D1 DE3785226 D1 DE 3785226D1 DE 8787100003 T DE8787100003 T DE 8787100003T DE 3785226 T DE3785226 T DE 3785226T DE 3785226 D1 DE3785226 D1 DE 3785226D1
- Authority
- DE
- Germany
- Prior art keywords
- continuous method
- producing pcb
- pcb
- producing
- continuous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000011437 continuous method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1027—Pressing using at least one press band
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/825,562 US4659425A (en) | 1986-02-03 | 1986-02-03 | Continuous process for the manufacture of printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3785226D1 true DE3785226D1 (de) | 1993-05-13 |
DE3785226T2 DE3785226T2 (de) | 1993-11-04 |
Family
ID=25244317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE87100003T Expired - Fee Related DE3785226T2 (de) | 1986-02-03 | 1987-01-02 | Kontinuierliches verfahren zur herstellung von leiterplatten. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4659425A (de) |
EP (1) | EP0231737B1 (de) |
JP (1) | JPS62179931A (de) |
DE (1) | DE3785226T2 (de) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4794855A (en) * | 1986-08-05 | 1989-01-03 | Mitsubishi Rayon Engineering Co., Ltd. | Continuous press machine |
US5201979A (en) * | 1987-05-08 | 1993-04-13 | Research Association For New Technology Development Of High Performance Polymer | Method of manufacturing a sheet-prepreg reinforced with fibers |
US5445701A (en) * | 1987-05-08 | 1995-08-29 | Research Association For New Technology Development Of High Performance Polymer | Apparatus of manufacturing a sheet-prepreg reinforced with fibers |
EP0291629A3 (de) * | 1987-05-16 | 1990-02-28 | Aeg Isolier- Und Kunststoff Gmbh | Verfahren zum kontinuierlichen Herstellen von bandförmigem Basismaterial |
US4909886A (en) * | 1987-12-02 | 1990-03-20 | Mitsubishi Gas Chemical Company, Inc. | Process for producing copper-clad laminate |
DE3811467A1 (de) * | 1988-04-06 | 1989-10-19 | Siempelkamp Gmbh & Co | Verfahren und anlage zur kontinuierlichen herstellung von bahnfoermigem basismaterial fuer leiterplatten |
US5167997A (en) * | 1989-05-05 | 1992-12-01 | Gould Inc. | Protected conductive foil assemblage and procedure for preparing same using static electrical forces |
JP2733346B2 (ja) * | 1989-11-15 | 1998-03-30 | 松下電工株式会社 | 積層板の製造方法 |
JP2708914B2 (ja) * | 1989-11-15 | 1998-02-04 | 松下電工株式会社 | 積層板の製造方法 |
CA2045987A1 (en) * | 1990-08-06 | 1992-02-07 | Haruhiko Maki | Continuous production of metal clad laminates |
US5269863A (en) * | 1990-09-24 | 1993-12-14 | Akzo Nv | Continuous process for the manufacture of substrates for printed wire boards |
DE4036801A1 (de) * | 1990-11-19 | 1992-05-21 | Huels Troisdorf | Verfahren zur kontinuierlichen herstellung von kupferkaschierten basismaterialtafeln |
TW210422B (de) * | 1991-06-04 | 1993-08-01 | Akzo Nv | |
US5268064A (en) * | 1992-02-04 | 1993-12-07 | Trimble Navigation Limited | Copper clad epoxy printed circuit board suitable for microwave frequencies encountered in GPS receivers |
TW244340B (de) * | 1992-07-21 | 1995-04-01 | Akzo Nv | |
TW259925B (de) * | 1994-01-26 | 1995-10-11 | Akzo Nobel Nv | |
US6016598A (en) * | 1995-02-13 | 2000-01-25 | Akzo Nobel N.V. | Method of manufacturing a multilayer printed wire board |
US5672234A (en) * | 1995-04-28 | 1997-09-30 | Park-Air Corporation | Zipper fusing machine for attaching zipper material to a plastic web |
US5655291A (en) * | 1995-06-26 | 1997-08-12 | Ford Motor Company | Forming rigid circuit board |
JP3901798B2 (ja) * | 1997-06-12 | 2007-04-04 | 大日本印刷株式会社 | プリント配線板の製造装置 |
US5976391A (en) * | 1998-01-13 | 1999-11-02 | Ford Motor Company | Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same |
JP2911445B1 (ja) * | 1998-06-26 | 1999-06-23 | 忠男 宇野 | 身分証明用冊子の個人データ記録面に保護フィルムを貼布する装置 |
SE513341C2 (sv) | 1998-10-06 | 2000-08-28 | Ericsson Telefon Ab L M | Arrangemang med tryckta kretskort samt metod för tillverkning därav |
NL1010620C2 (nl) * | 1998-11-20 | 2000-05-23 | Klieverik Heli Bv | Laminator. |
US6220328B1 (en) * | 1999-09-23 | 2001-04-24 | Textile Systems & Supply, Inc. | Lamination machine |
DE60131408T2 (de) * | 2000-07-14 | 2008-09-18 | Mitsubishi Rayon Co., Ltd. | Verfahren zur herstellung einer kohlenstoffartigen folie |
US6454878B1 (en) * | 2000-11-01 | 2002-09-24 | Visteon Global Technologies, Inc. | Cladded material construction for etched-tri-metal circuits |
JP3963662B2 (ja) * | 2001-05-24 | 2007-08-22 | 住友ベークライト株式会社 | 積層板の製造方法 |
US6506062B1 (en) | 2001-08-01 | 2003-01-14 | Visteon Global Technologies, Inc. | Circuit board having an integrated circuit board connector and method of making the same |
JP4025177B2 (ja) * | 2001-11-26 | 2007-12-19 | 三井金属鉱業株式会社 | 絶縁層付銅箔の製造方法 |
JP4136509B2 (ja) * | 2001-12-18 | 2008-08-20 | 三井金属鉱業株式会社 | プリプレグの製造方法並びにプリプレグの製造装置並びに絶縁層付銅箔の製造方法 |
KR100468748B1 (ko) * | 2002-07-12 | 2005-01-29 | 삼성전자주식회사 | 프리컷 다이싱 테이프와 범용 다이싱 테이프를 웨이퍼에 마운팅할 수 있는 다이싱 테이프 부착 장비 및 이를포함하는 인라인 시스템 |
US20050028925A1 (en) * | 2002-09-04 | 2005-02-10 | Fernandes Karim B. | Method for making a prepreg |
DE102004058335A1 (de) * | 2004-11-29 | 2006-06-14 | Schulz-Harder, Jürgen, Dr.-Ing. | Substrat |
US7293355B2 (en) * | 2005-04-21 | 2007-11-13 | Endicott Interconnect Technologies, Inc. | Apparatus and method for making circuitized substrates in a continuous manner |
US7827682B2 (en) * | 2005-04-21 | 2010-11-09 | Endicott Interconnect Technologies, Inc. | Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner |
US7627947B2 (en) | 2005-04-21 | 2009-12-08 | Endicott Interconnect Technologies, Inc. | Method for making a multilayered circuitized substrate |
JP4908266B2 (ja) * | 2007-03-05 | 2012-04-04 | 株式会社ジャムコ | 段階状の断面厚さを有する複合材の連続成形方法 |
CN102347433A (zh) * | 2010-07-29 | 2012-02-08 | 展晶科技(深圳)有限公司 | 发光二极管 |
US20130019470A1 (en) * | 2011-07-22 | 2013-01-24 | Ict-Lanto Limited | Method of manufacturing three-dimensional circuit |
GB2498994B (en) * | 2012-02-02 | 2014-03-19 | Trackwise Designs Ltd | Method of making a flexible circuit |
EP2842880A1 (de) | 2013-08-28 | 2015-03-04 | Eurokeg B.V. | Behälter für Flüssigkeiten |
EP3178638A1 (de) * | 2015-12-11 | 2017-06-14 | Voestalpine Stahl GmbH | Verfahren zur herstellung eines halbzeugs oder bauteils aus metall und faserverbund |
US11059206B2 (en) * | 2016-02-05 | 2021-07-13 | Rohr, Inc | Method for fabricating composite structures using combined resin film and dry fabric |
JP6584444B2 (ja) * | 2017-03-22 | 2019-10-02 | アイシン高丘株式会社 | 複合構造体の製造方法 |
ES2954177T3 (es) * | 2017-12-29 | 2023-11-20 | Xylo Tech Ag | Laminado con estructura síncrona |
US10785867B2 (en) * | 2018-09-25 | 2020-09-22 | International Business Machines Corporation | Automatic determination of power plane shape in printed circuit board |
KR20200038814A (ko) * | 2018-10-04 | 2020-04-14 | 주식회사 엘지화학 | 회로 기판 제조용 연속 시트의 제조 방법 및 이로부터 제조된 회로 기판 제조용 연속 시트 |
US12006411B1 (en) * | 2020-08-19 | 2024-06-11 | Systima Technologies, Inc. | Method of making carbonized composites |
CN113024792B (zh) * | 2021-04-06 | 2023-03-24 | 杭州安誉科技有限公司 | 一种荧光检测用滤光片及其在实时荧光定量pcr仪仪器中的用途 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4191800A (en) * | 1976-05-27 | 1980-03-04 | Bell Telephone Laboratories, Incorporated | Devices employing flexible substrates and method for making same |
JPS568227A (en) * | 1979-06-29 | 1981-01-28 | Kanegafuchi Chem Ind Co Ltd | Continuous preparation of laminate covered by metal foil |
JPS5951913B2 (ja) * | 1979-07-11 | 1984-12-17 | 鐘淵化学工業株式会社 | 積層体の連続製造方法 |
JPS55126418A (en) * | 1979-03-26 | 1980-09-30 | Kanegafuchi Chem Ind Co Ltd | Method and apparatus for continuous preparation of laminated material |
JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
US4284753A (en) * | 1980-04-14 | 1981-08-18 | Shell Oil Company | Heat curable polyepoxide-unsaturated aromatic monomer resin compositions |
CA1167364A (en) * | 1980-09-22 | 1984-05-15 | Masayuki Oizumi | Production of bubble-free electrical laminates |
US4420509A (en) * | 1981-08-11 | 1983-12-13 | Glasteel Tennessee, Inc. | Copper-clad polyester-glass fiber laminates |
DE3307057C2 (de) * | 1983-03-01 | 1991-02-14 | Held, Kurt, 7218 Trossingen | Vorrichtung zur kontinuierlichen Herstellung kupferkaschierter Elektrolaminate |
-
1986
- 1986-02-03 US US06/825,562 patent/US4659425A/en not_active Expired - Lifetime
- 1986-12-16 JP JP61297874A patent/JPS62179931A/ja active Granted
-
1987
- 1987-01-02 DE DE87100003T patent/DE3785226T2/de not_active Expired - Fee Related
- 1987-01-02 EP EP87100003A patent/EP0231737B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3785226T2 (de) | 1993-11-04 |
EP0231737A3 (en) | 1989-03-22 |
EP0231737B1 (de) | 1993-04-07 |
JPH0262385B2 (de) | 1990-12-25 |
JPS62179931A (ja) | 1987-08-07 |
EP0231737A2 (de) | 1987-08-12 |
US4659425A (en) | 1987-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |