DE3701343A1 - Verfahren zur montage eines lsi- bzw. ic-bausteins auf einer verdrahtungsunterlage - Google Patents

Verfahren zur montage eines lsi- bzw. ic-bausteins auf einer verdrahtungsunterlage

Info

Publication number
DE3701343A1
DE3701343A1 DE19873701343 DE3701343A DE3701343A1 DE 3701343 A1 DE3701343 A1 DE 3701343A1 DE 19873701343 DE19873701343 DE 19873701343 DE 3701343 A DE3701343 A DE 3701343A DE 3701343 A1 DE3701343 A1 DE 3701343A1
Authority
DE
Germany
Prior art keywords
lsi
wiring
connections
module
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19873701343
Other languages
German (de)
English (en)
Other versions
DE3701343C2 (https=
Inventor
Ichirou Kohara
Kazuhito Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE3701343A1 publication Critical patent/DE3701343A1/de
Application granted granted Critical
Publication of DE3701343C2 publication Critical patent/DE3701343C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DE19873701343 1986-01-22 1987-01-19 Verfahren zur montage eines lsi- bzw. ic-bausteins auf einer verdrahtungsunterlage Granted DE3701343A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61012709A JPS62169434A (ja) 1986-01-22 1986-01-22 Ｌｓｉ搭載方式

Publications (2)

Publication Number Publication Date
DE3701343A1 true DE3701343A1 (de) 1987-07-23
DE3701343C2 DE3701343C2 (https=) 1993-07-22

Family

ID=11812940

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873701343 Granted DE3701343A1 (de) 1986-01-22 1987-01-19 Verfahren zur montage eines lsi- bzw. ic-bausteins auf einer verdrahtungsunterlage

Country Status (3)

Country Link
US (1) US4779338A (https=)
JP (1) JPS62169434A (https=)
DE (1) DE3701343A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0347974A3 (en) * 1988-06-23 1990-10-31 Teikoku Tsushin Kogyo Co. Ltd. Mount for electronic parts
DE19708325A1 (de) * 1997-03-03 1998-09-10 Manfred Dr Michalk Klebeverbindung von elektrisch leitenden Fügeteilen
DE4303743C2 (de) * 1992-02-10 2002-01-31 Matsushita Electric Industrial Co Ltd Verfahren zur Anbringung von elektronischen Bauelementen auf Leiterplatten
AT511655B1 (de) * 2011-10-20 2013-02-15 Prelonic Technologies Gmbh Verfahren zum verkleben von schaltungselementen und kleber

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4109363C2 (de) * 1991-03-22 2000-12-14 Bosch Gmbh Robert Klebverbindung zwischen einem elektronischen Bauteil und einem Substrat sowie Verfahren zur Herstellung der Klebverbindung
JPH06310839A (ja) * 1993-04-27 1994-11-04 Matsushita Electric Ind Co Ltd フレキシブル印刷回路板への電子部品の実装方法
US5596171A (en) * 1993-05-21 1997-01-21 Harris; James M. Package for a high frequency semiconductor device and methods for fabricating and connecting the same to an external circuit
US5386624A (en) * 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates
US5543585A (en) * 1994-02-02 1996-08-06 International Business Machines Corporation Direct chip attachment (DCA) with electrically conductive adhesives
KR101088824B1 (ko) * 2010-06-16 2011-12-06 주식회사 하이닉스반도체 모듈 기판, 이를 갖는 메모리 모듈 및 메모리 모듈 형성방법

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1591186B1 (de) * 1966-03-09 1971-01-14 Ibm Verfahren zum simultanen Herstellen von Zufuehrungs-verbindungen mittels Kontaktbruecken auf Festkoerperbauelementen mit Hilfe von abziehbildartigen Vorrichtungen
DE2056193A1 (de) * 1970-02-13 1971-08-19 Elektromat Veb Verfahren zum Kontaktieren von elektri sehen Klemstbauelementen
DE2536361A1 (de) * 1974-08-14 1976-02-26 Seikosha Kk Elektrisch leitender klebstoff
US4081898A (en) * 1976-04-19 1978-04-04 Texas Instruments Incorporated Method of manufacturing an electronic calculator utilizing a flexible carrier
AT346593B (de) * 1974-01-17 1978-11-10 Bayer Ag Rieselfaehige, schwundarm aushaertbare ungesaettigte polyesterformmassen
GB2068645A (en) * 1980-01-31 1981-08-12 Rogers Corp Electrical interconnection
DE2817480C2 (de) * 1977-05-02 1984-02-16 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Hybridschaltung, die mit einer Halbleiterschaltung versehen ist

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4381602A (en) * 1980-12-29 1983-05-03 Honeywell Information Systems Inc. Method of mounting an I.C. chip on a substrate
US4631820A (en) * 1984-08-23 1986-12-30 Canon Kabushiki Kaisha Mounting assembly and mounting method for an electronic component

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1591186B1 (de) * 1966-03-09 1971-01-14 Ibm Verfahren zum simultanen Herstellen von Zufuehrungs-verbindungen mittels Kontaktbruecken auf Festkoerperbauelementen mit Hilfe von abziehbildartigen Vorrichtungen
DE2056193A1 (de) * 1970-02-13 1971-08-19 Elektromat Veb Verfahren zum Kontaktieren von elektri sehen Klemstbauelementen
AT346593B (de) * 1974-01-17 1978-11-10 Bayer Ag Rieselfaehige, schwundarm aushaertbare ungesaettigte polyesterformmassen
DE2536361A1 (de) * 1974-08-14 1976-02-26 Seikosha Kk Elektrisch leitender klebstoff
US4081898A (en) * 1976-04-19 1978-04-04 Texas Instruments Incorporated Method of manufacturing an electronic calculator utilizing a flexible carrier
DE2817480C2 (de) * 1977-05-02 1984-02-16 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Hybridschaltung, die mit einer Halbleiterschaltung versehen ist
GB2068645A (en) * 1980-01-31 1981-08-12 Rogers Corp Electrical interconnection

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0347974A3 (en) * 1988-06-23 1990-10-31 Teikoku Tsushin Kogyo Co. Ltd. Mount for electronic parts
DE4303743C2 (de) * 1992-02-10 2002-01-31 Matsushita Electric Industrial Co Ltd Verfahren zur Anbringung von elektronischen Bauelementen auf Leiterplatten
DE19708325A1 (de) * 1997-03-03 1998-09-10 Manfred Dr Michalk Klebeverbindung von elektrisch leitenden Fügeteilen
DE19708325B4 (de) * 1997-03-03 2007-06-14 Sokymat Gmbh Klebeverbindung von elektrisch leitenden Fügeteilen
AT511655B1 (de) * 2011-10-20 2013-02-15 Prelonic Technologies Gmbh Verfahren zum verkleben von schaltungselementen und kleber

Also Published As

Publication number Publication date
JPH0455334B2 (https=) 1992-09-03
US4779338A (en) 1988-10-25
JPS62169434A (ja) 1987-07-25
DE3701343C2 (https=) 1993-07-22

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition