DE3688840T2 - Verfahren und vorrichtung zur elektroplattierung eines kupferblattes. - Google Patents
Verfahren und vorrichtung zur elektroplattierung eines kupferblattes.Info
- Publication number
- DE3688840T2 DE3688840T2 DE87900763T DE3688840T DE3688840T2 DE 3688840 T2 DE3688840 T2 DE 3688840T2 DE 87900763 T DE87900763 T DE 87900763T DE 3688840 T DE3688840 T DE 3688840T DE 3688840 T2 DE3688840 T2 DE 3688840T2
- Authority
- DE
- Germany
- Prior art keywords
- current density
- anode
- electrolyte
- primary
- cathodic surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 41
- 229910052802 copper Inorganic materials 0.000 title description 29
- 239000010949 copper Substances 0.000 title description 29
- 238000009713 electroplating Methods 0.000 title description 12
- 239000011888 foil Substances 0.000 claims abstract description 46
- 239000003792 electrolyte Substances 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 37
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 6
- 230000006911 nucleation Effects 0.000 claims description 6
- 238000010899 nucleation Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 claims description 5
- 229910021645 metal ion Inorganic materials 0.000 claims description 2
- 150000001455 metallic ions Chemical class 0.000 claims description 2
- 238000013019 agitation Methods 0.000 claims 2
- 150000002500 ions Chemical class 0.000 abstract description 2
- 239000010953 base metal Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 238000011282 treatment Methods 0.000 description 20
- 239000000758 substrate Substances 0.000 description 16
- 239000011889 copper foil Substances 0.000 description 12
- 230000004888 barrier function Effects 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 210000004027 cell Anatomy 0.000 description 5
- 239000011152 fibreglass Substances 0.000 description 5
- 239000011133 lead Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- -1 alkali metal zincate Chemical class 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 210000001787 dendrite Anatomy 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 235000014653 Carica parviflora Nutrition 0.000 description 2
- 241000243321 Cnidaria Species 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000024121 nodulation Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Physical Vapour Deposition (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Control Of El Displays (AREA)
- Spinning Or Twisting Of Yarns (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81309785A | 1985-12-24 | 1985-12-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3688840D1 DE3688840D1 (de) | 1993-09-09 |
| DE3688840T2 true DE3688840T2 (de) | 1993-11-25 |
Family
ID=25211440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE87900763T Expired - Fee Related DE3688840T2 (de) | 1985-12-24 | 1986-12-23 | Verfahren und vorrichtung zur elektroplattierung eines kupferblattes. |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US4898647A (enExample) |
| EP (1) | EP0252139B1 (enExample) |
| JP (1) | JPS63241193A (enExample) |
| AT (1) | ATE92544T1 (enExample) |
| AU (1) | AU602673B2 (enExample) |
| BR (1) | BR8607061A (enExample) |
| DE (1) | DE3688840T2 (enExample) |
| DK (1) | DK439887D0 (enExample) |
| FI (1) | FI873643L (enExample) |
| HU (1) | HU208556B (enExample) |
| IN (1) | IN166842B (enExample) |
| NO (1) | NO873533D0 (enExample) |
| WO (1) | WO1987003915A1 (enExample) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4661213A (en) * | 1986-02-13 | 1987-04-28 | Dorsett Terry E | Electroplate to moving metal |
| US5215645A (en) * | 1989-09-13 | 1993-06-01 | Gould Inc. | Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same |
| US5403465A (en) * | 1990-05-30 | 1995-04-04 | Gould Inc. | Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives |
| US5393396A (en) * | 1990-10-30 | 1995-02-28 | Gould Inc. | Apparatus for electrodepositing metal |
| US5228965A (en) * | 1990-10-30 | 1993-07-20 | Gould Inc. | Method and apparatus for applying surface treatment to metal foil |
| JP3207909B2 (ja) * | 1992-02-07 | 2001-09-10 | ティーディーケイ株式会社 | 電気めっき方法および電気めっき用分割型不溶性電極 |
| US5215646A (en) * | 1992-05-06 | 1993-06-01 | Circuit Foil Usa, Inc. | Low profile copper foil and process and apparatus for making bondable metal foils |
| US5685970A (en) | 1992-07-01 | 1997-11-11 | Gould Electronics Inc. | Method and apparatus for sequentially metalized polymeric films and products made thereby |
| US5646814A (en) | 1994-07-15 | 1997-07-08 | Applied Materials, Inc. | Multi-electrode electrostatic chuck |
| US5592358A (en) | 1994-07-18 | 1997-01-07 | Applied Materials, Inc. | Electrostatic chuck for magnetic flux processing |
| JP3281783B2 (ja) * | 1995-12-06 | 2002-05-13 | 三井金属鉱業株式会社 | プリント配線板用銅箔、その製造法及び電解装置 |
| US6730387B2 (en) | 1996-04-24 | 2004-05-04 | The Procter & Gamble Company | Absorbent materials having improved structural stability in dry and wet states and making methods therefor |
| JPH10195689A (ja) * | 1996-12-27 | 1998-07-28 | Fukuda Metal Foil & Powder Co Ltd | 微細孔明き金属箔の製造方法 |
| US5863410A (en) * | 1997-06-23 | 1999-01-26 | Circuit Foil Usa, Inc. | Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby |
| US7244677B2 (en) * | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
| EP1055020A2 (en) * | 1998-02-12 | 2000-11-29 | ACM Research, Inc. | Plating apparatus and method |
| US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| TWI223678B (en) * | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
| US6497801B1 (en) * | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
| KR20010031571A (ko) * | 1998-09-14 | 2001-04-16 | 미야무라 심뻬이 | 다공질 동박(多孔質 銅箔) 및 그 용도와 그 제조방법 |
| US6309969B1 (en) | 1998-11-03 | 2001-10-30 | The John Hopkins University | Copper metallization structure and method of construction |
| AU1298299A (en) * | 1998-11-03 | 2000-05-22 | Johns Hopkins University, The | Copper metallization structure and method of construction |
| US6368475B1 (en) * | 2000-03-21 | 2002-04-09 | Semitool, Inc. | Apparatus for electrochemically processing a microelectronic workpiece |
| WO2000061837A1 (en) * | 1999-04-13 | 2000-10-19 | Semitool, Inc. | Workpiece processor having processing chamber with improved processing fluid flow |
| US7264698B2 (en) * | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US20030038035A1 (en) * | 2001-05-30 | 2003-02-27 | Wilson Gregory J. | Methods and systems for controlling current in electrochemical processing of microelectronic workpieces |
| US7438788B2 (en) * | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7020537B2 (en) * | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7189318B2 (en) * | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US6916412B2 (en) | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
| US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7585398B2 (en) * | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| KR19990064747A (ko) * | 1999-05-06 | 1999-08-05 | 이종구 | Ｎｉ-Ｆｅ 합금 박판 제조방법 및 그 장치 |
| US6183607B1 (en) * | 1999-06-22 | 2001-02-06 | Ga-Tek Inc. | Anode structure for manufacture of metallic foil |
| US20050183959A1 (en) * | 2000-04-13 | 2005-08-25 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece |
| US6913680B1 (en) | 2000-05-02 | 2005-07-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition |
| WO2001090446A2 (en) * | 2000-05-23 | 2001-11-29 | Applied Materials, Inc. | Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
| AU2001259504A1 (en) * | 2000-05-24 | 2001-12-03 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| JP2004536217A (ja) * | 2000-10-03 | 2004-12-02 | アプライド マテリアルズ インコーポレイテッド | 金属蒸着のためのエントリーにあたって半導体基板を傾けるための方法と関連する装置 |
| US7090751B2 (en) | 2001-08-31 | 2006-08-15 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US6911136B2 (en) * | 2002-04-29 | 2005-06-28 | Applied Materials, Inc. | Method for regulating the electrical power applied to a substrate during an immersion process |
| US20040108212A1 (en) * | 2002-12-06 | 2004-06-10 | Lyndon Graham | Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces |
| US20040206628A1 (en) * | 2003-04-18 | 2004-10-21 | Applied Materials, Inc. | Electrical bias during wafer exit from electrolyte bath |
| DE602005022650D1 (de) * | 2004-04-26 | 2010-09-16 | Rohm & Haas Elect Mat | Verbessertes Plattierungsverfahren |
| US20060175201A1 (en) * | 2005-02-07 | 2006-08-10 | Hooman Hafezi | Immersion process for electroplating applications |
| CN102321895B (zh) * | 2011-09-01 | 2013-10-23 | 西安航天动力机械厂 | 一种整体式阳极槽 |
| CN104099652A (zh) * | 2014-07-09 | 2014-10-15 | 山东金宝电子股份有限公司 | 一种电子铜箔的表面处理粗化工艺 |
| KR102029139B1 (ko) * | 2015-11-09 | 2019-10-07 | 케이씨에프테크놀로지스 주식회사 | 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4318794A (en) * | 1980-11-17 | 1982-03-09 | Edward Adler | Anode for production of electrodeposited foil |
| US4490218A (en) * | 1983-11-07 | 1984-12-25 | Olin Corporation | Process and apparatus for producing surface treated metal foil |
| US4549941A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Electrochemical surface preparation for improving the adhesive properties of metallic surfaces |
| IT1182818B (it) * | 1985-08-12 | 1987-10-05 | Centro Speriment Metallurg | Dispositivo a cella radiale per elettrodeposizione |
-
1986
- 1986-12-23 WO PCT/US1986/002797 patent/WO1987003915A1/en not_active Ceased
- 1986-12-23 BR BR8607061A patent/BR8607061A/pt not_active Application Discontinuation
- 1986-12-23 EP EP87900763A patent/EP0252139B1/en not_active Expired - Lifetime
- 1986-12-23 HU HU87913D patent/HU208556B/hu not_active IP Right Cessation
- 1986-12-23 AU AU68981/87A patent/AU602673B2/en not_active Ceased
- 1986-12-23 AT AT87900763T patent/ATE92544T1/de not_active IP Right Cessation
- 1986-12-23 DE DE87900763T patent/DE3688840T2/de not_active Expired - Fee Related
- 1986-12-23 FI FI873643A patent/FI873643L/fi not_active Application Discontinuation
-
1987
- 1987-01-27 IN IN78/CAL/87A patent/IN166842B/en unknown
- 1987-08-21 NO NO873533A patent/NO873533D0/no unknown
- 1987-08-24 DK DK439887A patent/DK439887D0/da not_active Application Discontinuation
- 1987-12-23 JP JP62326681A patent/JPS63241193A/ja active Granted
-
1988
- 1988-12-22 US US07/288,472 patent/US4898647A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| NO873533L (no) | 1987-08-21 |
| BR8607061A (pt) | 1988-02-23 |
| DK439887A (da) | 1987-08-24 |
| DK439887D0 (da) | 1987-08-24 |
| HUT46083A (en) | 1988-09-28 |
| FI873643A0 (fi) | 1987-08-24 |
| JPH031391B2 (enExample) | 1991-01-10 |
| EP0252139A1 (en) | 1988-01-13 |
| FI873643A7 (fi) | 1987-08-24 |
| EP0252139B1 (en) | 1993-08-04 |
| AU6898187A (en) | 1987-07-15 |
| WO1987003915A1 (en) | 1987-07-02 |
| DE3688840D1 (de) | 1993-09-09 |
| ATE92544T1 (de) | 1993-08-15 |
| EP0252139A4 (en) | 1988-03-22 |
| JPS63241193A (ja) | 1988-10-06 |
| IN166842B (enExample) | 1990-07-28 |
| US4898647A (en) | 1990-02-06 |
| AU602673B2 (en) | 1990-10-25 |
| HU208556B (en) | 1993-11-29 |
| NO873533D0 (no) | 1987-08-21 |
| FI873643L (fi) | 1987-08-24 |
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