DE3787856T2 - Verfahren zur herstellung eines mit kupfer plattierten laminats. - Google Patents

Verfahren zur herstellung eines mit kupfer plattierten laminats.

Info

Publication number
DE3787856T2
DE3787856T2 DE3787856T DE3787856T DE3787856T2 DE 3787856 T2 DE3787856 T2 DE 3787856T2 DE 3787856 T DE3787856 T DE 3787856T DE 3787856 T DE3787856 T DE 3787856T DE 3787856 T2 DE3787856 T2 DE 3787856T2
Authority
DE
Germany
Prior art keywords
copper
producing
plated
laminate
laminate plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3787856T
Other languages
English (en)
Other versions
DE3787856D1 (de
Inventor
Tatsuo - Wada
Keizo - Yamashita
Tasuku - Touyama
Teruaki - Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiko Electronics Co Ltd
Original Assignee
Meiko Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiko Electronics Co Ltd filed Critical Meiko Electronics Co Ltd
Application granted granted Critical
Publication of DE3787856D1 publication Critical patent/DE3787856D1/de
Publication of DE3787856T2 publication Critical patent/DE3787856T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B31/00—Rolling stand structures; Mounting, adjusting, or interchanging rolls, roll mountings, or stand frames
    • B21B31/08—Interchanging rolls, roll mountings, or stand frames, e.g. using C-hooks; Replacing roll chocks on roll shafts
    • B21B31/12—Interchanging rolls, roll mountings, or stand frames, e.g. using C-hooks; Replacing roll chocks on roll shafts by vertically displacing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B35/00—Drives for metal-rolling mills, e.g. hydraulic drives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
DE3787856T 1986-02-21 1987-02-21 Verfahren zur herstellung eines mit kupfer plattierten laminats. Expired - Lifetime DE3787856T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP3671086 1986-02-21
JP3670986 1986-02-21
JP3671186 1986-02-21
PCT/JP1987/000112 WO1987004977A1 (en) 1986-02-21 1987-02-21 Process for producing copper-clad laminate

Publications (2)

Publication Number Publication Date
DE3787856D1 DE3787856D1 (de) 1993-11-25
DE3787856T2 true DE3787856T2 (de) 1994-05-19

Family

ID=27289190

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3787856T Expired - Lifetime DE3787856T2 (de) 1986-02-21 1987-02-21 Verfahren zur herstellung eines mit kupfer plattierten laminats.

Country Status (6)

Country Link
US (1) US5049221A (de)
EP (1) EP0258452B1 (de)
JP (1) JPH0639155B2 (de)
KR (1) KR900005082B1 (de)
DE (1) DE3787856T2 (de)
WO (1) WO1987004977A1 (de)

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JP2655870B2 (ja) * 1988-03-31 1997-09-24 ヤマハ発動機株式会社 プリント配線基板及びその製造方法
DE69025500T2 (de) * 1989-06-23 1996-10-31 Toagosei Co Verfahren zur Herstellung eines kupferkaschierten Laminats
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
KR100275899B1 (ko) * 1990-05-30 2000-12-15 마이클 에이. 센타니 전착구리호일 및 클로라이드(chloride) 이온농도가 낮은 전해액을 사용하여 이를 제조하는 방법
DE69233801D1 (de) * 1991-07-24 2011-02-17 Denki Kagaku Kogyo Kk Verfahren zur Herstellung eines Schaltungssubstrates mit einem montierten Halbleiterelement
US5681441A (en) * 1992-12-22 1997-10-28 Elf Technologies, Inc. Method for electroplating a substrate containing an electroplateable pattern
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
US5785789A (en) * 1993-03-18 1998-07-28 Digital Equipment Corporation Low dielectric constant microsphere filled layers for multilayer electrical structures
JP3305192B2 (ja) * 1995-03-15 2002-07-22 セイコーエプソン株式会社 接着剤転写方法、及び転写装置
TW432124B (en) * 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
AU3735797A (en) * 1996-06-26 1998-01-14 Park Electrochemical Corporation A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates
US5792375A (en) * 1997-02-28 1998-08-11 International Business Machines Corporation Method for bonding copper-containing surfaces together
US6270889B1 (en) * 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6054659A (en) * 1998-03-09 2000-04-25 General Motors Corporation Integrated electrostatically-actuated micromachined all-metal micro-relays
JP2000311876A (ja) * 1999-04-27 2000-11-07 Hitachi Ltd 配線基板の製造方法および製造装置
US6431750B1 (en) 1999-12-14 2002-08-13 Sierra Lobo, Inc. Flexible temperature sensing probe
US6569543B2 (en) 2001-02-15 2003-05-27 Olin Corporation Copper foil with low profile bond enahncement
JP3396465B2 (ja) * 2000-08-25 2003-04-14 三井金属鉱業株式会社 銅張積層板
JP4091425B2 (ja) * 2000-11-10 2008-05-28 本田技研工業株式会社 燃料電池用ステンレス鋼材の表面処理方法
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
US6596384B1 (en) 2002-04-09 2003-07-22 International Business Machines Corporation Selectively roughening conductors for high frequency printed wiring boards
JP3954958B2 (ja) * 2002-11-26 2007-08-08 古河テクノリサーチ株式会社 抵抗層付き銅箔及び抵抗層付き回路基板材料
JP2004186307A (ja) * 2002-12-02 2004-07-02 Tdk Corp 電子部品の製造方法および、電子部品
DE602004023665D1 (de) * 2003-02-26 2009-12-03 Kyocera Corp Laminiertes elektronisches Bauelement
US20040200061A1 (en) * 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
US7930815B2 (en) * 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
DE04405784T1 (de) * 2004-12-20 2007-01-04 Rolex Sa Uhrzifferblatt und Herstellungsverfahren dieses Zifferblattes
US7287468B2 (en) * 2005-05-31 2007-10-30 International Business Machines Corporation Nickel alloy plated structure
TW200710570A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Composition for forming adhesive pattern, multilayer structure obtained by using same, and method for producing such multilayer structure
JP2008004596A (ja) * 2006-06-20 2008-01-10 Canon Inc 荷電粒子線描画方法、露光装置、及びデバイス製造方法
KR100793644B1 (ko) * 2007-05-02 2008-01-10 (주)알오호일 금속 극박판 제조 방법
TW200907117A (en) * 2007-08-10 2009-02-16 Yuen Neng Co Ltd Structure of high clean stainless steel cord and processing method thereof
JP5532706B2 (ja) * 2009-07-02 2014-06-25 住友金属鉱山株式会社 フレキシブル性銅張積層板の製造方法
JP6867102B2 (ja) * 2014-10-22 2021-04-28 Ｊｘ金属株式会社 銅放熱材、キャリア付銅箔、コネクタ、端子、積層体、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法
JP6152373B2 (ja) * 2014-11-14 2017-06-21 株式会社 サン・テクトロ 熱可塑性プリプレグ成形品の製造方法
FI128294B (en) * 2015-01-27 2020-02-28 Outokumpu Oy A process for preparing a sheet material for an electrochemical process
JP6236120B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
KR102197865B1 (ko) * 2018-11-29 2021-01-05 삼원액트 주식회사 Fccl 제조 방법
CN114786333B (zh) * 2022-05-07 2024-05-17 深圳市柳鑫实业股份有限公司 一种用于制作精细线路后半埋嵌线路的铜箔载体

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US1589564A (en) * 1924-06-27 1926-06-22 Anaconda Sales Co Process of electrodeposition
US4053370A (en) * 1975-09-18 1977-10-11 Koito Manufacturing Company Limited Process for the fabrication of printed circuits
US4240894A (en) * 1979-10-05 1980-12-23 Edward Adler Drum for electrodeposited copper foil production
US4503112A (en) * 1981-06-12 1985-03-05 Oak Industries Inc. Printed circuit material
GB8333753D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Dielectric boards
JPS60147192A (ja) * 1984-01-11 1985-08-03 株式会社日立製作所 プリント配線板の製造方法

Also Published As

Publication number Publication date
EP0258452B1 (de) 1993-10-20
EP0258452A4 (de) 1989-05-16
EP0258452A1 (de) 1988-03-09
US5049221A (en) 1991-09-17
KR880700736A (ko) 1988-04-11
JPH0639155B2 (ja) 1994-05-25
WO1987004977A1 (en) 1987-08-27
KR900005082B1 (ko) 1990-07-19
JPS62275750A (ja) 1987-11-30
DE3787856D1 (de) 1993-11-25

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Legal Events

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8364 No opposition during term of opposition