KR880700736A - 구리로바론 적층판의 제조방법 - Google Patents

구리로바론 적층판의 제조방법

Info

Publication number
KR880700736A
KR880700736A KR870700851A KR870700851A KR880700736A KR 880700736 A KR880700736 A KR 880700736A KR 870700851 A KR870700851 A KR 870700851A KR 870700851 A KR870700851 A KR 870700851A KR 880700736 A KR880700736 A KR 880700736A
Authority
KR
South Korea
Prior art keywords
barron
laminate
copper
manufacturing
barron laminate
Prior art date
Application number
KR870700851A
Other languages
English (en)
Other versions
KR900005082B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR880700736A publication Critical patent/KR880700736A/ko
Application granted granted Critical
Publication of KR900005082B1 publication Critical patent/KR900005082B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B31/00—Rolling stand structures; Mounting, adjusting, or interchanging rolls, roll mountings, or stand frames
    • B21B31/08—Interchanging rolls, roll mountings, or stand frames, e.g. using C-hooks; Replacing roll chocks on roll shafts
    • B21B31/12—Interchanging rolls, roll mountings, or stand frames, e.g. using C-hooks; Replacing roll chocks on roll shafts by vertically displacing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B35/00—Drives for metal-rolling mills, e.g. hydraulic drives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
KR1019870700851A 1986-02-21 1987-02-21 구리로바른 적층판의 제조방법 KR900005082B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP61-036709 1986-02-21
JP61-036711 1986-02-21
JP3671186 1986-02-21
JP3670986 1986-02-21
JP61-036710 1986-02-21
JP3671086 1986-02-21
PCT/JP1987/000112 WO1987004977A1 (en) 1986-02-21 1987-02-21 Process for producing copper-clad laminate

Publications (2)

Publication Number Publication Date
KR880700736A true KR880700736A (ko) 1988-04-11
KR900005082B1 KR900005082B1 (ko) 1990-07-19

Family

ID=27289190

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870700851A KR900005082B1 (ko) 1986-02-21 1987-02-21 구리로바른 적층판의 제조방법

Country Status (6)

Country Link
US (1) US5049221A (ko)
EP (1) EP0258452B1 (ko)
JP (1) JPH0639155B2 (ko)
KR (1) KR900005082B1 (ko)
DE (1) DE3787856T2 (ko)
WO (1) WO1987004977A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100793644B1 (ko) * 2007-05-02 2008-01-10 (주)알오호일 금속 극박판 제조 방법

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JP2655870B2 (ja) * 1988-03-31 1997-09-24 ヤマハ発動機株式会社 プリント配線基板及びその製造方法
DE69025500T2 (de) * 1989-06-23 1996-10-31 Toagosei Co Verfahren zur Herstellung eines kupferkaschierten Laminats
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
DE69125573T2 (de) * 1990-05-30 1997-07-17 Gould Electronics Inc ELEKTROPLATTIERTE KUPFERFOLIE UND DEREN HERSTELLUNG UNTER VERWENDUNG ELEKTROLYTISCHER LöSUNGEN MIT NIEDRIGEN KONZENTRATIONEN VON CHLOR IONEN
DE69233801D1 (de) * 1991-07-24 2011-02-17 Denki Kagaku Kogyo Kk Verfahren zur Herstellung eines Schaltungssubstrates mit einem montierten Halbleiterelement
US5681441A (en) * 1992-12-22 1997-10-28 Elf Technologies, Inc. Method for electroplating a substrate containing an electroplateable pattern
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
US5785789A (en) * 1993-03-18 1998-07-28 Digital Equipment Corporation Low dielectric constant microsphere filled layers for multilayer electrical structures
JP3305192B2 (ja) * 1995-03-15 2002-07-22 セイコーエプソン株式会社 接着剤転写方法、及び転写装置
TW432124B (en) 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
WO1997049549A1 (en) * 1996-06-26 1997-12-31 Park Electrochemical Corporation A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates
US5792375A (en) * 1997-02-28 1998-08-11 International Business Machines Corporation Method for bonding copper-containing surfaces together
US6270889B1 (en) * 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6054659A (en) * 1998-03-09 2000-04-25 General Motors Corporation Integrated electrostatically-actuated micromachined all-metal micro-relays
JP2000311876A (ja) * 1999-04-27 2000-11-07 Hitachi Ltd 配線基板の製造方法および製造装置
US6431750B1 (en) 1999-12-14 2002-08-13 Sierra Lobo, Inc. Flexible temperature sensing probe
US6569543B2 (en) 2001-02-15 2003-05-27 Olin Corporation Copper foil with low profile bond enahncement
JP3396465B2 (ja) * 2000-08-25 2003-04-14 三井金属鉱業株式会社 銅張積層板
DE10194846B4 (de) * 2000-11-10 2008-02-28 Honda Giken Kogyo K.K. Verfahren zur Oberflächenbehandlung eines rostfreien Stahlprodukts für eine Brennstoffzelle
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
US6596384B1 (en) * 2002-04-09 2003-07-22 International Business Machines Corporation Selectively roughening conductors for high frequency printed wiring boards
JP3954958B2 (ja) * 2002-11-26 2007-08-08 古河テクノリサーチ株式会社 抵抗層付き銅箔及び抵抗層付き回路基板材料
JP2004186307A (ja) * 2002-12-02 2004-07-02 Tdk Corp 電子部品の製造方法および、電子部品
DE602004023665D1 (de) * 2003-02-26 2009-12-03 Kyocera Corp Laminiertes elektronisches Bauelement
US20040200061A1 (en) * 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
DE602004012585T2 (de) * 2004-12-20 2009-04-16 Rolex Sa Uhrzifferblatt und Herstellungsverfahren dieses Zifferblattes
TW200710570A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Composition for forming adhesive pattern, multilayer structure obtained by using same, and method for producing such multilayer structure
US7287468B2 (en) * 2005-05-31 2007-10-30 International Business Machines Corporation Nickel alloy plated structure
JP2008004596A (ja) * 2006-06-20 2008-01-10 Canon Inc 荷電粒子線描画方法、露光装置、及びデバイス製造方法
TW200907117A (en) * 2007-08-10 2009-02-16 Yuen Neng Co Ltd Structure of high clean stainless steel cord and processing method thereof
JP5532706B2 (ja) * 2009-07-02 2014-06-25 住友金属鉱山株式会社 フレキシブル性銅張積層板の製造方法
JP6867102B2 (ja) * 2014-10-22 2021-04-28 Ｊｘ金属株式会社 銅放熱材、キャリア付銅箔、コネクタ、端子、積層体、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法
JP6152373B2 (ja) * 2014-11-14 2017-06-21 株式会社 サン・テクトロ 熱可塑性プリプレグ成形品の製造方法
FI128294B (en) * 2015-01-27 2020-02-28 Outokumpu Oy A process for preparing a sheet material for an electrochemical process
JP6236120B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
KR102197865B1 (ko) * 2018-11-29 2021-01-05 삼원액트 주식회사 Fccl 제조 방법
CN114786333B (zh) * 2022-05-07 2024-05-17 深圳市柳鑫实业股份有限公司 一种用于制作精细线路后半埋嵌线路的铜箔载体

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US1589564A (en) * 1924-06-27 1926-06-22 Anaconda Sales Co Process of electrodeposition
US4053370A (en) * 1975-09-18 1977-10-11 Koito Manufacturing Company Limited Process for the fabrication of printed circuits
US4240894A (en) * 1979-10-05 1980-12-23 Edward Adler Drum for electrodeposited copper foil production
US4503112A (en) * 1981-06-12 1985-03-05 Oak Industries Inc. Printed circuit material
GB8333753D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Dielectric boards
JPS60147192A (ja) * 1984-01-11 1985-08-03 株式会社日立製作所 プリント配線板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100793644B1 (ko) * 2007-05-02 2008-01-10 (주)알오호일 금속 극박판 제조 방법

Also Published As

Publication number Publication date
DE3787856T2 (de) 1994-05-19
DE3787856D1 (de) 1993-11-25
EP0258452A1 (en) 1988-03-09
EP0258452B1 (en) 1993-10-20
JPS62275750A (ja) 1987-11-30
JPH0639155B2 (ja) 1994-05-25
EP0258452A4 (en) 1989-05-16
US5049221A (en) 1991-09-17
WO1987004977A1 (en) 1987-08-27
KR900005082B1 (ko) 1990-07-19

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