DE3678077D1 - Verfahren zur herstellung von mit organosilicium beendeten polyimidvorlaeufern und von polyimid. - Google Patents

Verfahren zur herstellung von mit organosilicium beendeten polyimidvorlaeufern und von polyimid.

Info

Publication number
DE3678077D1
DE3678077D1 DE8686106726T DE3678077T DE3678077D1 DE 3678077 D1 DE3678077 D1 DE 3678077D1 DE 8686106726 T DE8686106726 T DE 8686106726T DE 3678077 T DE3678077 T DE 3678077T DE 3678077 D1 DE3678077 D1 DE 3678077D1
Authority
DE
Germany
Prior art keywords
polyimide
organosilically
producing
finished
precursors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686106726T
Other languages
English (en)
Inventor
Fusaji Shoji
Haruhiko Matsuyama
Akio Fujiwara
Fumio Kataoka
Teruki Aizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE3678077D1 publication Critical patent/DE3678077D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
DE8686106726T 1985-09-25 1986-05-16 Verfahren zur herstellung von mit organosilicium beendeten polyimidvorlaeufern und von polyimid. Expired - Lifetime DE3678077D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60210063A JPH0768347B2 (ja) 1985-09-25 1985-09-25 有機ケイ素末端ポリイミド前駆体とポリイミドの製造方法

Publications (1)

Publication Number Publication Date
DE3678077D1 true DE3678077D1 (de) 1991-04-18

Family

ID=16583202

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686106726T Expired - Lifetime DE3678077D1 (de) 1985-09-25 1986-05-16 Verfahren zur herstellung von mit organosilicium beendeten polyimidvorlaeufern und von polyimid.

Country Status (4)

Country Link
US (1) US4748228A (de)
EP (1) EP0216007B1 (de)
JP (1) JPH0768347B2 (de)
DE (1) DE3678077D1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2561243B2 (ja) * 1986-05-08 1996-12-04 日本電気株式会社 半導体装置の配線層間膜およびその形成用塗布溶液
JP2561246B2 (ja) * 1986-05-08 1996-12-04 日本電気株式会社 半導体装置用塗布溶液及び半導体装置の製造方法
JP2594545B2 (ja) * 1986-05-08 1997-03-26 日本電気株式会社 半導体装置の製造方法
JP2561244B2 (ja) * 1986-05-08 1996-12-04 日本電気株式会社 半導体装置の製造方法
JPH0727966B2 (ja) * 1986-07-04 1995-03-29 日立化成工業株式会社 半導体装置
JPH0819234B2 (ja) * 1987-06-29 1996-02-28 チッソ株式会社 低熱膨脹性かつ高接着性のシリコン含有ポリイミド前駆体の製造法
US4923948A (en) * 1987-09-24 1990-05-08 Japan Synthetic Rubber Co., Ltd. Curable composition
EP0316154B1 (de) * 1987-11-10 1995-02-08 Chisso Corporation Silizium enthaltendes Polyimid-Prepolymer, davon abgeleitete ausgehärtete Produkte und Verfahren zu deren Herstellung
JPH0749482B2 (ja) * 1988-02-26 1995-05-31 チッソ株式会社 低吸湿性かつ高接着性のシリコン含有ポリイミド及びその前駆体の製造方法
JP2609140B2 (ja) * 1988-11-21 1997-05-14 チッソ株式会社 低弾性率ポリイミドおよびその製造法
JP2597706B2 (ja) * 1989-03-28 1997-04-09 株式会社日立製作所 耐熱性接着剤
JP2841095B2 (ja) * 1990-01-25 1998-12-24 チッソ株式会社 液晶配向膜及び液晶表示素子
US4960846A (en) * 1990-03-09 1990-10-02 Amoco Corporation Polyimide copolymers containing 4,4'-bis(p-aminophenoxy)biphenyl and siloxane diamine moieties
JP2606402B2 (ja) * 1990-03-23 1997-05-07 信越化学工業株式会社 硬化性樹脂及びその製造方法
JP2551214B2 (ja) * 1990-08-06 1996-11-06 信越化学工業株式会社 硬化性樹脂溶液組成物及びその製造方法並びに電子部品用保護膜
US5300627A (en) * 1991-10-17 1994-04-05 Chisso Corporation Adhesive polyimide film
US5241041A (en) * 1991-12-16 1993-08-31 Occidental Chemical Corporation Photocrosslinkable polyimide ammonium salts
JP2712993B2 (ja) * 1992-01-17 1998-02-16 信越化学工業株式会社 硬化性樹脂、その溶液及びその製造法並びに電子部品用保護膜
JP3324250B2 (ja) * 1993-02-25 2002-09-17 チッソ株式会社 感光性樹脂組成物
JP3004583U (ja) * 1994-02-15 1994-11-22 相云 李 石材研磨機
JP2000347054A (ja) * 1999-03-31 2000-12-15 Sharp Corp 光デバイス及びその製造方法、並びに、ポリイミド膜の製造方法
US6956098B2 (en) 2002-09-20 2005-10-18 E. I. Du Pont De Nemours And Company High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
US10737973B2 (en) 2012-02-28 2020-08-11 Corning Incorporated Pharmaceutical glass coating for achieving particle reduction
US11497681B2 (en) 2012-02-28 2022-11-15 Corning Incorporated Glass articles with low-friction coatings
WO2013130724A2 (en) 2012-02-28 2013-09-06 Corning Incorporated Glass articles with low-friction coatings
US10273048B2 (en) 2012-06-07 2019-04-30 Corning Incorporated Delamination resistant glass containers with heat-tolerant coatings
US9034442B2 (en) 2012-11-30 2015-05-19 Corning Incorporated Strengthened borosilicate glass containers with improved damage tolerance
US10117806B2 (en) 2012-11-30 2018-11-06 Corning Incorporated Strengthened glass containers resistant to delamination and damage
MX2017002898A (es) 2014-09-05 2017-10-11 Corning Inc Artículos de vidrio y métodos para mejorar la confiabilidad de artículos de vidrio.
CN107001102A (zh) 2014-11-26 2017-08-01 康宁股份有限公司 用于生产强化且耐用玻璃容器的方法
EP3150564B1 (de) 2015-09-30 2018-12-05 Corning Incorporated Halogenierte chemische polyimidsiloxanzusammensetzungen und glasgegenstände mit halogenierten polylmidsiloxanbeschichtungen mit geringer reibung
EP3368491B1 (de) 2015-10-30 2022-04-13 Corning Incorporated Glasartikel mit gemischtem polymere und metalloxidbeschichtungen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948835A (en) * 1973-06-07 1976-04-06 Ciba-Geigy Corporation Silicon-modified prepolymers
US4518735A (en) * 1981-10-29 1985-05-21 National Semiconductor Corporation High temperature stable adhesive for semiconductor device packages, low-cost semiconductor device package and process
JPS5952898A (ja) * 1982-09-20 1984-03-27 松下電器産業株式会社 収納ベルト
JPH0617474B2 (ja) * 1985-05-31 1994-03-09 チッソ株式会社 高接着性シリコン含有ポリアミド酸の製造法
JPS61293227A (ja) * 1985-06-21 1986-12-24 Chisso Corp ｓ−トリアジン環を有する可溶性ポリイミドシロキサン前駆体の製造法

Also Published As

Publication number Publication date
JPH0768347B2 (ja) 1995-07-26
EP0216007A3 (en) 1987-08-19
JPS6270423A (ja) 1987-03-31
US4748228A (en) 1988-05-31
EP0216007A2 (de) 1987-04-01
EP0216007B1 (de) 1991-03-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee