DE3640801C2 - - Google Patents
Info
- Publication number
- DE3640801C2 DE3640801C2 DE3640801A DE3640801A DE3640801C2 DE 3640801 C2 DE3640801 C2 DE 3640801C2 DE 3640801 A DE3640801 A DE 3640801A DE 3640801 A DE3640801 A DE 3640801A DE 3640801 C2 DE3640801 C2 DE 3640801C2
- Authority
- DE
- Germany
- Prior art keywords
- electrodes
- component
- semiconductor element
- cylindrical
- threaded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60270387A JPS62128547A (ja) | 1985-11-29 | 1985-11-29 | 半導体装置 |
JP60270388A JPS62128548A (ja) | 1985-11-29 | 1985-11-29 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3640801A1 DE3640801A1 (de) | 1987-06-04 |
DE3640801C2 true DE3640801C2 (US06521211-20030218-C00004.png) | 1989-09-14 |
Family
ID=26549194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19863640801 Granted DE3640801A1 (de) | 1985-11-29 | 1986-11-28 | Halbleiterbauelement |
Country Status (2)
Country | Link |
---|---|
US (1) | US4829364A (US06521211-20030218-C00004.png) |
DE (1) | DE3640801A1 (US06521211-20030218-C00004.png) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3826820A1 (de) * | 1987-09-28 | 1989-04-06 | Asea Brown Boveri | Leistungshalbleiterelement |
US5248902A (en) * | 1991-08-30 | 1993-09-28 | General Instrument Corporation | Surface mounting diode |
JP2845739B2 (ja) * | 1993-11-29 | 1999-01-13 | 三菱電機株式会社 | 圧接型半導体装置及びその製造方法 |
USPP15094P3 (en) * | 2001-12-28 | 2004-08-24 | Suntory Flowers Limited | Petunia plant named ‘Sunbelkos’ |
DE10242521A1 (de) * | 2002-09-12 | 2004-03-25 | Robert Bosch Gmbh | Diode |
DE102009034138B4 (de) * | 2009-07-22 | 2011-06-01 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement |
JP5187343B2 (ja) * | 2010-04-27 | 2013-04-24 | 三菱電機株式会社 | 圧接型半導体装置 |
GB201201441D0 (en) * | 2012-01-27 | 2012-03-14 | Rsl Steeper Group Ltd | A myoelectric electrode assembly |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2438893A (en) * | 1943-12-29 | 1948-04-06 | Bell Telephone Labor Inc | Translating device |
NL147218C (US06521211-20030218-C00004.png) * | 1948-08-14 | |||
US2728881A (en) * | 1950-03-31 | 1955-12-27 | Gen Electric | Asymmetrically conductive devices |
DE1069296B (US06521211-20030218-C00004.png) * | 1954-04-12 | 1959-11-19 | ||
CH427045A (de) * | 1965-04-12 | 1966-12-31 | Transistor Ag | Halbleiterbauelement |
DE2118356A1 (de) * | 1971-04-15 | 1972-10-26 | Siemens AG, 1000 Berlin u. 8000 München | Scheibenförmiges Halbleiterbauelement |
DE2364728A1 (de) * | 1973-12-27 | 1975-07-03 | Licentia Gmbh | Scheibenfoermiges halbleiterbauelement grosser leistungsfaehigkeit mit kunststoffummantelung |
DE2630320A1 (de) * | 1976-07-06 | 1978-01-12 | Licentia Gmbh | Scheibenfoermige halbleiterzelle mit einem ringfoermigen gehaeuse |
JPS5354971A (en) * | 1976-10-28 | 1978-05-18 | Mitsubishi Electric Corp | Semiconductor device |
DE2654532C3 (de) * | 1976-12-02 | 1982-03-11 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Scheibenförmige Halbleiterzelle |
US4099201A (en) * | 1977-04-11 | 1978-07-04 | General Electric Company | Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc |
DE2719400C2 (de) * | 1977-04-30 | 1982-09-30 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Scheibenförmige Halbleiterzelle |
JPS5635443A (en) * | 1979-08-31 | 1981-04-08 | Toshiba Corp | Semiconductor device |
US4646131A (en) * | 1983-01-28 | 1987-02-24 | Mitsubishi Denki Kabushiki Kaisha | Rectifier device |
-
1986
- 1986-11-21 US US06/933,389 patent/US4829364A/en not_active Ceased
- 1986-11-28 DE DE19863640801 patent/DE3640801A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
US4829364A (en) | 1989-05-09 |
DE3640801A1 (de) | 1987-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8328 | Change in the person/name/address of the agent |
Free format text: PATENTANWAELTE REICHEL UND REICHEL, 60322 FRANKFURT |
|
8339 | Ceased/non-payment of the annual fee |