DE3616969C2 - - Google Patents

Info

Publication number
DE3616969C2
DE3616969C2 DE3616969A DE3616969A DE3616969C2 DE 3616969 C2 DE3616969 C2 DE 3616969C2 DE 3616969 A DE3616969 A DE 3616969A DE 3616969 A DE3616969 A DE 3616969A DE 3616969 C2 DE3616969 C2 DE 3616969C2
Authority
DE
Germany
Prior art keywords
base plate
integrated circuit
semiconductor component
housing
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3616969A
Other languages
German (de)
English (en)
Other versions
DE3616969A1 (de
Inventor
Wolfgang Dipl.-Phys. Dr. 7022 Leinfelden De Hauger
Lothar Dipl.-Ing. 7407 Rottenburg De Gademann
Rolf 7410 Reutlingen De Benz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19863616969 priority Critical patent/DE3616969A1/de
Publication of DE3616969A1 publication Critical patent/DE3616969A1/de
Application granted granted Critical
Publication of DE3616969C2 publication Critical patent/DE3616969C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
DE19863616969 1986-05-20 1986-05-20 Gehaeuse fuer integrierte schaltkreise Granted DE3616969A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19863616969 DE3616969A1 (de) 1986-05-20 1986-05-20 Gehaeuse fuer integrierte schaltkreise

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863616969 DE3616969A1 (de) 1986-05-20 1986-05-20 Gehaeuse fuer integrierte schaltkreise

Publications (2)

Publication Number Publication Date
DE3616969A1 DE3616969A1 (de) 1987-11-26
DE3616969C2 true DE3616969C2 (OSRAM) 1989-06-01

Family

ID=6301233

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863616969 Granted DE3616969A1 (de) 1986-05-20 1986-05-20 Gehaeuse fuer integrierte schaltkreise

Country Status (1)

Country Link
DE (1) DE3616969A1 (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6841857B2 (en) * 2001-07-18 2005-01-11 Infineon Technologies Ag Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip
DE10223035A1 (de) 2002-05-22 2003-12-04 Infineon Technologies Ag Elektronisches Bauteil mit Hohlraumgehäuse, insbesondere Hochfrequenz-Leistungsmodul
DE102012202342B4 (de) * 2012-02-16 2017-10-12 Osram Gmbh Leuchtvorrichtung mit Leiterplatte und Strukturbauteil

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2122819A5 (OSRAM) * 1971-01-20 1972-09-01 Conso Adrien
US3909838A (en) * 1973-08-01 1975-09-30 Signetics Corp Encapsulated integrated circuit and method
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
FR2526585A1 (fr) * 1982-05-07 1983-11-10 Thomson Csf Boitier d'encapsulation de circuit microelectronique a haute dissipation thermique et son procede de fabrication
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.

Also Published As

Publication number Publication date
DE3616969A1 (de) 1987-11-26

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee