DE3586452D1 - Festkoerperbildsensor und verfahren zu seiner herstellung. - Google Patents

Festkoerperbildsensor und verfahren zu seiner herstellung.

Info

Publication number
DE3586452D1
DE3586452D1 DE8585113198T DE3586452T DE3586452D1 DE 3586452 D1 DE3586452 D1 DE 3586452D1 DE 8585113198 T DE8585113198 T DE 8585113198T DE 3586452 T DE3586452 T DE 3586452T DE 3586452 D1 DE3586452 D1 DE 3586452D1
Authority
DE
Germany
Prior art keywords
production
image sensor
solid image
solid
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585113198T
Other languages
English (en)
Other versions
DE3586452T2 (de
Inventor
Takao Kuroda
Toshihiro Kuriyama
Kenju Horii
Hiroyuki Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59220016A external-priority patent/JPS6197861A/ja
Priority claimed from JP60063369A external-priority patent/JPH0680812B2/ja
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Application granted granted Critical
Publication of DE3586452D1 publication Critical patent/DE3586452D1/de
Publication of DE3586452T2 publication Critical patent/DE3586452T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14887Blooming suppression
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14831Area CCD imagers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
DE8585113198T 1984-10-18 1985-10-17 Festkoerperbildsensor und verfahren zu seiner herstellung. Expired - Lifetime DE3586452T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59220016A JPS6197861A (ja) 1984-10-18 1984-10-18 固体撮像装置の製造方法
JP60063369A JPH0680812B2 (ja) 1985-03-29 1985-03-29 固体撮像装置

Publications (2)

Publication Number Publication Date
DE3586452D1 true DE3586452D1 (de) 1992-09-10
DE3586452T2 DE3586452T2 (de) 1993-03-18

Family

ID=26404482

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585113198T Expired - Lifetime DE3586452T2 (de) 1984-10-18 1985-10-17 Festkoerperbildsensor und verfahren zu seiner herstellung.

Country Status (3)

Country Link
US (2) US4947224A (de)
EP (1) EP0178664B1 (de)
DE (1) DE3586452T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02309877A (ja) * 1989-05-25 1990-12-25 Sony Corp 固体撮像装置
US5262661A (en) * 1990-06-25 1993-11-16 Matsushita Electric Industrial Co., Ltd. Solid-state image pickup device, having increased charge storage and improved electronic shutter operation
KR930008527B1 (ko) * 1990-10-13 1993-09-09 금성일렉트론 주식회사 Npn형 vccd 구조의 고체촬상 소자
JPH04286361A (ja) * 1991-03-15 1992-10-12 Sony Corp 固体撮像装置
US5288656A (en) * 1991-03-15 1994-02-22 Sony Corporation Method of manufacturing a CCD solid state image sensing device
KR940009648B1 (ko) * 1991-10-15 1994-10-15 금성일렉트론 주식회사 전하결합소자의 제조방법
JP2970307B2 (ja) * 1993-05-17 1999-11-02 日本電気株式会社 固体撮像装置の製造方法
JP2755176B2 (ja) * 1994-06-30 1998-05-20 日本電気株式会社 固体撮像素子
JP2797993B2 (ja) * 1995-02-21 1998-09-17 日本電気株式会社 固体撮像装置およびその製造方法
JP2003060192A (ja) * 2001-08-20 2003-02-28 Sony Corp 固体撮像装置の製造方法
JP3530159B2 (ja) * 2001-08-22 2004-05-24 松下電器産業株式会社 固体撮像装置およびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1199934A (en) * 1966-10-14 1970-07-22 Plessey Co Ltd Improvements in or relating to Photo-Electric Devices
US3838439A (en) * 1970-03-18 1974-09-24 Texas Instruments Inc Phototransistor having a buried base
GB1447410A (en) * 1973-10-20 1976-08-25 Ferranti Ltd Photocells
US4079358A (en) * 1976-10-04 1978-03-14 Micro-Bit Corporation Buried junction MOS memory capacitor target for electron beam addressable memory and method of using same
JPS5812744B2 (ja) * 1978-04-06 1983-03-10 シャープ株式会社 半導体装置
JPS55156358A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Semiconductor memory device
US4450464A (en) * 1980-07-23 1984-05-22 Matsushita Electric Industrial Co., Ltd. Solid state area imaging apparatus having a charge transfer arrangement
DE3168333D1 (en) * 1980-09-19 1985-02-28 Nec Corp Semiconductor photoelectric converter
JPS57125332A (en) * 1981-01-28 1982-08-04 Fujitsu Ltd Infrared rays detector
JPS5838081A (ja) * 1981-08-29 1983-03-05 Sony Corp 固体撮像装置
NL8202761A (nl) * 1982-07-08 1984-02-01 Stichting Fund Ond Material Halfgeleiderinrichting.
JPS5919480A (ja) * 1982-07-26 1984-01-31 Olympus Optical Co Ltd 固体撮像装置
JPS59196669A (ja) * 1983-04-22 1984-11-08 Matsushita Electronics Corp 固体撮像装置
JPS6097681A (ja) * 1983-10-31 1985-05-31 Matsushita Electric Works Ltd モノリシツク集積回路
NL8304035A (nl) * 1983-11-24 1985-06-17 Philips Nv Blooming ongevoelige beeldopneeminrichting en werkwijze ter vervaardiging daarvan.

Also Published As

Publication number Publication date
EP0178664A3 (en) 1986-10-15
US5041392A (en) 1991-08-20
EP0178664B1 (de) 1992-08-05
DE3586452T2 (de) 1993-03-18
US4947224A (en) 1990-08-07
EP0178664A2 (de) 1986-04-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., KADOMA,