DE3570949D1 - Method of fabricating vlsi cmos devices - Google Patents

Method of fabricating vlsi cmos devices

Info

Publication number
DE3570949D1
DE3570949D1 DE8585901712T DE3570949T DE3570949D1 DE 3570949 D1 DE3570949 D1 DE 3570949D1 DE 8585901712 T DE8585901712 T DE 8585901712T DE 3570949 T DE3570949 T DE 3570949T DE 3570949 D1 DE3570949 D1 DE 3570949D1
Authority
DE
Germany
Prior art keywords
cmos devices
vlsi cmos
fabricating
fabricating vlsi
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585901712T
Other languages
German (de)
English (en)
Inventor
Hyman Levinstein
Sheila Vaidya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Application granted granted Critical
Publication of DE3570949D1 publication Critical patent/DE3570949D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/661—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/661—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
    • H10D64/662—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures
    • H10D64/663—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures the additional layers comprising a silicide layer contacting the layer of silicon, e.g. polycide gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0172—Manufacturing their gate conductors
    • H10D84/0177—Manufacturing their gate conductors the gate conductors having different materials or different implants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85—Complementary IGFETs, e.g. CMOS
    • H10D84/859—Complementary IGFETs, e.g. CMOS comprising both N-type and P-type wells, e.g. twin-tub
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/082—Ion implantation FETs/COMs
DE8585901712T 1984-03-19 1985-03-06 Method of fabricating vlsi cmos devices Expired DE3570949D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/591,274 US4555842A (en) 1984-03-19 1984-03-19 Method of fabricating VLSI CMOS devices having complementary threshold voltages
PCT/US1985/000377 WO1985004284A1 (en) 1984-03-19 1985-03-06 Method of fabricating vlsi cmos devices

Publications (1)

Publication Number Publication Date
DE3570949D1 true DE3570949D1 (en) 1989-07-13

Family

ID=24365820

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585901712T Expired DE3570949D1 (en) 1984-03-19 1985-03-06 Method of fabricating vlsi cmos devices

Country Status (6)

Country Link
US (1) US4555842A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0175751B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS61501532A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1218760A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3570949D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO1985004284A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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US4642878A (en) * 1984-08-28 1987-02-17 Kabushiki Kaisha Toshiba Method of making MOS device by sequentially depositing an oxidizable layer and a masking second layer over gated device regions
US4677739A (en) * 1984-11-29 1987-07-07 Texas Instruments Incorporated High density CMOS integrated circuit manufacturing process
JPS61191070A (ja) * 1985-02-20 1986-08-25 Toshiba Corp 半導体装置の製造方法
US4782033A (en) * 1985-11-27 1988-11-01 Siemens Aktiengesellschaft Process for producing CMOS having doped polysilicon gate by outdiffusion of boron from implanted silicide gate
US4722908A (en) * 1986-08-28 1988-02-02 Fairchild Semiconductor Corporation Fabrication of a bipolar transistor with a polysilicon ribbon
US4745079A (en) * 1987-03-30 1988-05-17 Motorola, Inc. Method for fabricating MOS transistors having gates with different work functions
US5354699A (en) * 1987-05-13 1994-10-11 Hitachi, Ltd. Method of manufacturing semiconductor integrated circuit device
US4764481A (en) * 1987-08-24 1988-08-16 Delco Electronics Corporation Grown side-wall silicided source/drain self-align CMOS fabrication process
KR900008868B1 (ko) * 1987-09-30 1990-12-11 삼성전자 주식회사 저항성 접촉을 갖는 반도체 장치의 제조방법
US4786611A (en) * 1987-10-19 1988-11-22 Motorola, Inc. Adjusting threshold voltages by diffusion through refractory metal silicides
JP2675076B2 (ja) * 1988-06-14 1997-11-12 富士通株式会社 半導体装置の製造方法
JP2672607B2 (ja) * 1988-11-22 1997-11-05 株式会社東芝 半導体装置の製造方法
JP2746959B2 (ja) * 1988-12-01 1998-05-06 株式会社東芝 半導体装置の製造方法
JPH02291150A (ja) * 1989-04-28 1990-11-30 Hitachi Ltd 半導体装置
US5021356A (en) * 1989-08-24 1991-06-04 Delco Electronics Corporation Method of making MOSFET depletion device
DE69006978T2 (de) * 1989-08-24 1994-06-09 Delco Electronics Corp MOSFET-Verarmungsanordnung.
US5164333A (en) * 1990-06-19 1992-11-17 Siemens Aktiengesellschaft Method for manufacturing a multi-layer gate electrode for a mos transistor
ATE139058T1 (de) * 1990-10-23 1996-06-15 Siemens Ag Verfahren zur herstellung einer dotierten polyzidschicht auf einem halbleitersubstrat
JP3277533B2 (ja) * 1992-01-08 2002-04-22 ソニー株式会社 半導体装置の製造方法
US5278085A (en) * 1992-08-11 1994-01-11 Micron Semiconductor, Inc. Single mask process for forming both n-type and p-type gates in a polycrystalline silicon layer during the formation of a semiconductor device
US5468669A (en) * 1993-10-29 1995-11-21 At&T Corp. Integrated circuit fabrication
ATE274240T1 (de) * 1993-12-07 2004-09-15 Infineon Technologies Ag Verfahren zur herstellung von mosfets mit verbesserten kurz-kanal effekten
KR0138959B1 (ko) * 1994-11-08 1998-04-30 김주용 상보형 모스 소자의 게이트 전극 형성 방법
GB2328558B (en) * 1994-11-08 1999-04-14 Hyundai Electronics Ind Cmos device
US6465295B1 (en) * 1995-03-24 2002-10-15 Seiko Instruments Inc. Method of fabricating a semiconductor device
FR2739491B1 (fr) * 1995-09-28 1997-12-12 Sgs Thomson Microelectronics Procede de modification du dopage d'une couche de silicium
KR970030891A (ko) * 1995-11-21 1997-06-26 윌리엄 이. 힐러 Mos 기술에서의 급속 열 어닐링 처리
JP3518122B2 (ja) 1996-01-12 2004-04-12 ソニー株式会社 半導体装置の製造方法
US5824576A (en) * 1996-02-23 1998-10-20 Micron Technology, Inc. Method of forming complementary type conductive regions on a substrate
US5780330A (en) * 1996-06-28 1998-07-14 Integrated Device Technology, Inc. Selective diffusion process for forming both n-type and p-type gates with a single masking step
TW342532B (en) * 1996-10-11 1998-10-11 United Microelectronics Corp Process for producing dual-gate CMOS component by compensating implantation
KR100244967B1 (ko) * 1996-12-26 2000-02-15 김영환 듀얼 게이트(dual-gate)의 반도체 장치 제조방법
JPH10209293A (ja) * 1997-01-22 1998-08-07 Sony Corp 半導体装置の製造方法
US6051459A (en) * 1997-02-21 2000-04-18 Advanced Micro Devices, Inc. Method of making N-channel and P-channel IGFETs using selective doping and activation for the N-channel gate
US5976925A (en) * 1997-12-01 1999-11-02 Advanced Micro Devices Process of fabricating a semiconductor devise having asymmetrically-doped active region and gate electrode
US6166417A (en) * 1998-06-30 2000-12-26 Intel Corporation Complementary metal gates and a process for implementation
US6130123A (en) 1998-06-30 2000-10-10 Intel Corporation Method for making a complementary metal gate electrode technology
KR100353551B1 (ko) * 2000-01-28 2002-09-27 주식회사 하이닉스반도체 실리사이드 형성방법
US6362056B1 (en) 2000-02-23 2002-03-26 International Business Machines Corporation Method of making alternative to dual gate oxide for MOSFETs
US6387784B1 (en) 2001-03-19 2002-05-14 Chartered Semiconductor Manufacturing Ltd. Method to reduce polysilicon depletion in MOS transistors
US6956281B2 (en) * 2002-08-21 2005-10-18 Freescale Semiconductor, Inc. Semiconductor device for reducing photovolatic current
US6690039B1 (en) 2002-10-01 2004-02-10 T-Ram, Inc. Thyristor-based device that inhibits undesirable conductive channel formation
US6686612B1 (en) 2002-10-01 2004-02-03 T-Ram, Inc. Thyristor-based device adapted to inhibit parasitic current
US6828181B2 (en) * 2003-05-08 2004-12-07 International Business Machines Corporation Dual gate material process for CMOS technologies
WO2007092777A2 (en) * 2006-02-02 2007-08-16 Wyeth Cloning, characterization, and application of tnfrsf19 in neurological disorders
JP2008135504A (ja) * 2006-11-28 2008-06-12 Elpida Memory Inc 半導体装置の製造方法
US9545543B2 (en) 2014-06-27 2017-01-17 Bridgestone Sports Co., Ltd. Golf ball manufacturing method

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US4062038A (en) * 1976-01-28 1977-12-06 International Business Machines Corporation Radiation responsive device
DE2720327A1 (de) * 1977-05-06 1978-11-09 Bbc Brown Boveri & Cie Verfahren zur herstellung von halbleiterbauelementen, insbesondere solarelementen
US4276557A (en) * 1978-12-29 1981-06-30 Bell Telephone Laboratories, Incorporated Integrated semiconductor circuit structure and method for making it
US4329706A (en) * 1979-03-01 1982-05-11 International Business Machines Corporation Doped polysilicon silicide semiconductor integrated circuit interconnections
JPS6043656B2 (ja) * 1979-06-06 1985-09-30 株式会社東芝 半導体装置の製造方法
JPS5936432B2 (ja) * 1980-08-25 1984-09-04 株式会社東芝 半導体装置の製造方法
DE3132809A1 (de) * 1981-08-19 1983-03-10 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von integrierten mos-feldeffekttransistoren, insbesondere von komplementaeren mos-feldeffekttransistorenschaltungen mit einer aus metallsiliziden bestehenden zusaetzlichen leiterbahnebene
US4422885A (en) * 1981-12-18 1983-12-27 Ncr Corporation Polysilicon-doped-first CMOS process
US4445267A (en) * 1981-12-30 1984-05-01 International Business Machines Corporation MOSFET Structure and process to form micrometer long source/drain spacing
US4411734A (en) * 1982-12-09 1983-10-25 Rca Corporation Etching of tantalum silicide/doped polysilicon structures
JPS59115554A (ja) * 1982-12-22 1984-07-04 Toshiba Corp 半導体装置の製造方法
JPS59197162A (ja) * 1983-04-22 1984-11-08 Nec Corp 半導体装置

Also Published As

Publication number Publication date
EP0175751B1 (en) 1989-06-07
JPS61501532A (ja) 1986-07-24
US4555842A (en) 1985-12-03
WO1985004284A1 (en) 1985-09-26
EP0175751A1 (en) 1986-04-02
JPH0582063B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-11-17
CA1218760A (en) 1987-03-03

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Legal Events

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8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: BLUMBACH, KRAMER & PARTNER, 65193 WIESBADEN

8339 Ceased/non-payment of the annual fee