GB8824973D0 - Method of fabricating circuit - Google Patents

Method of fabricating circuit

Info

Publication number
GB8824973D0
GB8824973D0 GB888824973A GB8824973A GB8824973D0 GB 8824973 D0 GB8824973 D0 GB 8824973D0 GB 888824973 A GB888824973 A GB 888824973A GB 8824973 A GB8824973 A GB 8824973A GB 8824973 D0 GB8824973 D0 GB 8824973D0
Authority
GB
United Kingdom
Prior art keywords
fabricating circuit
fabricating
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB888824973A
Other versions
GB2215139A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marconi Instruments Ltd
Original Assignee
Marconi Instruments Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Instruments Ltd filed Critical Marconi Instruments Ltd
Publication of GB8824973D0 publication Critical patent/GB8824973D0/en
Publication of GB2215139A publication Critical patent/GB2215139A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
GB8824973A 1988-01-29 1988-10-25 A method of fabricating a circuit Withdrawn GB2215139A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB888802003A GB8802003D0 (en) 1988-01-29 1988-01-29 Method of fabricating circuit

Publications (2)

Publication Number Publication Date
GB8824973D0 true GB8824973D0 (en) 1988-11-30
GB2215139A GB2215139A (en) 1989-09-13

Family

ID=10630739

Family Applications (2)

Application Number Title Priority Date Filing Date
GB888802003A Pending GB8802003D0 (en) 1988-01-29 1988-01-29 Method of fabricating circuit
GB8824973A Withdrawn GB2215139A (en) 1988-01-29 1988-10-25 A method of fabricating a circuit

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB888802003A Pending GB8802003D0 (en) 1988-01-29 1988-01-29 Method of fabricating circuit

Country Status (1)

Country Link
GB (2) GB8802003D0 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2014793A1 (en) * 1989-08-21 1991-02-21 Frank L. Cloutier Method for applying a conductive trace pattern to a substrate
JPH03152992A (en) * 1989-10-27 1991-06-28 W R Grace & Co Printed circuit and its manufacture
DE102007027473A1 (en) * 2007-06-14 2008-12-18 Manroland Ag Technically produced functional components

Also Published As

Publication number Publication date
GB8802003D0 (en) 1988-02-24
GB2215139A (en) 1989-09-13

Similar Documents

Publication Publication Date Title
EP0361192A3 (en) Method of making circuit boards
GB2220108B (en) Method of forming conductors
DE3465834D1 (en) Method of making super-conductors
GB2202676B (en) Method of fabricating multilayer circuit structures
EP0405947A3 (en) Method of manufacturing thick-film devices
EP0285106A3 (en) Method of forming superconducting circuit
GB8804568D0 (en) Method of fabricating superconducting electronic devices
GB8614892D0 (en) Method of manufacturing
ZA891466B (en) Method of manufacturing powder-forged structural members
EP0413595A3 (en) Method of manufacturing electric devices
GB2191892B (en) A circuit unit for a timepiece and a method of making the same
GB2248096B (en) Method of manufacturing raw-edge V-belts
GB8802003D0 (en) Method of fabricating circuit
GB8823597D0 (en) Method of fabricating dart boards
GB2262105B (en) Method of manufacturing circuit components
HK119397A (en) Method of fabricating an integrated circuit
SU1546931A1 (en) Method of manufacturing two-subject vario-reproduction
PL272979A1 (en) Method of obtaining 2-amin-4-mitrophenol
EP0363936A3 (en) Method of manufacturing electric devices
GB2226517B (en) Manufacturing method
PL281889A1 (en) Method of manufacturing mullite-zircon
PL275483A2 (en) Method of manufacturing insulating boards
PL264504A1 (en) Method of manufacturing squirrel-cages
GB8818904D0 (en) Method of manufacturing fuse assembly
CS870188A1 (en) Method of 4-amino-1-phenyl-chloro-6-pyridazone

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)