DE3544533C2 - - Google Patents
Info
- Publication number
- DE3544533C2 DE3544533C2 DE19853544533 DE3544533A DE3544533C2 DE 3544533 C2 DE3544533 C2 DE 3544533C2 DE 19853544533 DE19853544533 DE 19853544533 DE 3544533 A DE3544533 A DE 3544533A DE 3544533 C2 DE3544533 C2 DE 3544533C2
- Authority
- DE
- Germany
- Prior art keywords
- relay
- spacer plate
- pins
- circuit board
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/58—Electric connections to or between contacts; Terminals
- H01H1/5805—Connections to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/023—Details concerning sealing, e.g. sealing casing with resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19853544533 DE3544533A1 (de) | 1985-12-17 | 1985-12-17 | Relais mit montage-erleichternder halterung auf einer platine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19853544533 DE3544533A1 (de) | 1985-12-17 | 1985-12-17 | Relais mit montage-erleichternder halterung auf einer platine |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3544533A1 DE3544533A1 (de) | 1987-06-19 |
DE3544533C2 true DE3544533C2 (US07714131-20100511-C00001.png) | 1992-10-08 |
Family
ID=6288614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19853544533 Granted DE3544533A1 (de) | 1985-12-17 | 1985-12-17 | Relais mit montage-erleichternder halterung auf einer platine |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3544533A1 (US07714131-20100511-C00001.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20109757U1 (de) | 2001-06-12 | 2001-08-16 | Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, 96450 Coburg | Vorrichtung mit einer Platine und einem elektrischen Bauteil |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH081775B2 (ja) * | 1990-11-28 | 1996-01-10 | 三菱電機株式会社 | 電磁接触器 |
DE19913904C1 (de) * | 1999-03-26 | 2001-02-01 | Tyco Electronics Logistics Ag | Verfahren zum Abdichten von Durchführungen und Vergußmasse zur Anwendung in diesem Verfahren |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2025134A1 (de) * | 1970-05-22 | 1971-12-02 | Sel | Gehäuse für Kleinrelais |
JPS54119657A (en) * | 1978-03-08 | 1979-09-17 | Idec Izumi Corp | Small relay |
DE7821508U1 (de) * | 1978-07-18 | 1978-10-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Elektromechanisches Bauelement, insbesondere Relais |
DE3026371C2 (de) * | 1980-07-11 | 1990-07-12 | Siemens AG, 1000 Berlin und 8000 München | Gehäuse für ein elektrisches Bauelement und Verfahren zu dessen Abdichtung |
DE3319329C2 (de) * | 1983-05-27 | 1985-05-30 | Haller-Relais GmbH, 7209 Wehingen | Relais mit waschdichter Bodenplatte |
DE3475026D1 (en) * | 1983-06-01 | 1988-12-08 | Hengstler Gmbh | Relay |
DE3425312A1 (de) * | 1984-07-10 | 1986-01-16 | Stribel GmbH, 7443 Frickenhausen | Elektromagnetisches relais |
-
1985
- 1985-12-17 DE DE19853544533 patent/DE3544533A1/de active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20109757U1 (de) | 2001-06-12 | 2001-08-16 | Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, 96450 Coburg | Vorrichtung mit einer Platine und einem elektrischen Bauteil |
Also Published As
Publication number | Publication date |
---|---|
DE3544533A1 (de) | 1987-06-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8110 | Request for examination paragraph 44 | ||
8127 | New person/name/address of the applicant |
Owner name: HENGSTLER BAUELEMENTE GMBH, 7209 WEHINGEN, DE |
|
D2 | Grant after examination | ||
8363 | Opposition against the patent | ||
8330 | Complete disclaimer |