DE3533993A1 - Verfahren zum kontaktieren auf leiterbahnen, vorrichtung zum ausueben des verfahrens und fluessigkristallzelle mit aufgebondeten chip - Google Patents

Verfahren zum kontaktieren auf leiterbahnen, vorrichtung zum ausueben des verfahrens und fluessigkristallzelle mit aufgebondeten chip

Info

Publication number
DE3533993A1
DE3533993A1 DE19853533993 DE3533993A DE3533993A1 DE 3533993 A1 DE3533993 A1 DE 3533993A1 DE 19853533993 DE19853533993 DE 19853533993 DE 3533993 A DE3533993 A DE 3533993A DE 3533993 A1 DE3533993 A1 DE 3533993A1
Authority
DE
Germany
Prior art keywords
adhesive
conductor tracks
substrate
chip
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19853533993
Other languages
German (de)
English (en)
Other versions
DE3533993C2 (enExample
Inventor
Rolf A Dr Cremers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borg Instruments AG
Original Assignee
Borg Instruments AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borg Instruments AG filed Critical Borg Instruments AG
Priority to DE19853533993 priority Critical patent/DE3533993A1/de
Priority to JP61221748A priority patent/JPS6399540A/ja
Priority to GB08622864A priority patent/GB2180698B/en
Publication of DE3533993A1 publication Critical patent/DE3533993A1/de
Application granted granted Critical
Publication of DE3533993C2 publication Critical patent/DE3533993C2/de
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE19853533993 1985-09-24 1985-09-24 Verfahren zum kontaktieren auf leiterbahnen, vorrichtung zum ausueben des verfahrens und fluessigkristallzelle mit aufgebondeten chip Granted DE3533993A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE19853533993 DE3533993A1 (de) 1985-09-24 1985-09-24 Verfahren zum kontaktieren auf leiterbahnen, vorrichtung zum ausueben des verfahrens und fluessigkristallzelle mit aufgebondeten chip
JP61221748A JPS6399540A (ja) 1985-09-24 1986-09-19 リードトラック上へのチップの接続方法およびこの方法を実施する装置
GB08622864A GB2180698B (en) 1985-09-24 1986-09-23 A method of contacting (applying)chips onto conductor paths, apparatus for carrying out the method and a liquid-crystal cell having bonded-on chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853533993 DE3533993A1 (de) 1985-09-24 1985-09-24 Verfahren zum kontaktieren auf leiterbahnen, vorrichtung zum ausueben des verfahrens und fluessigkristallzelle mit aufgebondeten chip

Publications (2)

Publication Number Publication Date
DE3533993A1 true DE3533993A1 (de) 1987-04-02
DE3533993C2 DE3533993C2 (enExample) 1987-10-08

Family

ID=6281772

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853533993 Granted DE3533993A1 (de) 1985-09-24 1985-09-24 Verfahren zum kontaktieren auf leiterbahnen, vorrichtung zum ausueben des verfahrens und fluessigkristallzelle mit aufgebondeten chip

Country Status (3)

Country Link
JP (1) JPS6399540A (enExample)
DE (1) DE3533993A1 (enExample)
GB (1) GB2180698B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4917466A (en) * 1987-08-13 1990-04-17 Shin-Etsu Polymer Co., Ltd. Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
JP2855719B2 (ja) * 1989-03-20 1999-02-10 セイコーエプソン株式会社 半導体装置
US5365208A (en) * 1991-04-08 1994-11-15 Ngk Spark Plug Co., Ltd. Microwave stripline filter formed from a pair of dielectric substrates
GB2301938B (en) * 1994-02-28 1997-03-12 Mitsubishi Electric Corp Testing semiconductor elements

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2921097A1 (de) * 1978-11-06 1980-05-14 Ebauches Electroniques Sa Verfahren zur herstellung einer gruppe von passiven elektrooptischen anzeigezellen
DE3217723A1 (de) * 1981-05-11 1982-12-02 Sumitomo Chemical Co., Ltd., Osaka Leitfaehige klebepaste
US4366342A (en) * 1978-06-21 1982-12-28 Minnesota Mining And Manufacturing Company Conductively coated embossed articles
EP0111734A2 (de) * 1982-11-23 1984-06-27 Licentia Patent-Verwaltungs-GmbH Verfahren zum Herstellen einer Flüssigkristall-Anzeigevorrichtung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4366342A (en) * 1978-06-21 1982-12-28 Minnesota Mining And Manufacturing Company Conductively coated embossed articles
DE2921097A1 (de) * 1978-11-06 1980-05-14 Ebauches Electroniques Sa Verfahren zur herstellung einer gruppe von passiven elektrooptischen anzeigezellen
DE3217723A1 (de) * 1981-05-11 1982-12-02 Sumitomo Chemical Co., Ltd., Osaka Leitfaehige klebepaste
EP0111734A2 (de) * 1982-11-23 1984-06-27 Licentia Patent-Verwaltungs-GmbH Verfahren zum Herstellen einer Flüssigkristall-Anzeigevorrichtung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE-Z.: "Elektronik", H. 7, 1973, S. 264-266 *

Also Published As

Publication number Publication date
JPH0346975B2 (enExample) 1991-07-17
GB2180698A (en) 1987-04-01
JPS6399540A (ja) 1988-04-30
DE3533993C2 (enExample) 1987-10-08
GB8622864D0 (en) 1986-10-29
GB2180698B (en) 1988-12-14

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: BORG INSTRUMENTS VERWALTUNG-GMBH, 7537 REMCHINGEN,

8327 Change in the person/name/address of the patent owner

Owner name: VALEO BORG INSTRUMENTS VERWALTUNG GMBH, 75196 REMC

8339 Ceased/non-payment of the annual fee