GB2180698B - A method of contacting (applying)chips onto conductor paths, apparatus for carrying out the method and a liquid-crystal cell having bonded-on chips - Google Patents

A method of contacting (applying)chips onto conductor paths, apparatus for carrying out the method and a liquid-crystal cell having bonded-on chips

Info

Publication number
GB2180698B
GB2180698B GB08622864A GB8622864A GB2180698B GB 2180698 B GB2180698 B GB 2180698B GB 08622864 A GB08622864 A GB 08622864A GB 8622864 A GB8622864 A GB 8622864A GB 2180698 B GB2180698 B GB 2180698B
Authority
GB
United Kingdom
Prior art keywords
chips
contacting
bonded
applying
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08622864A
Other languages
English (en)
Other versions
GB2180698A (en
GB8622864D0 (en
Inventor
Dr Rolf A Cremers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borg Instruments AG
Original Assignee
Borg Instruments AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borg Instruments AG filed Critical Borg Instruments AG
Publication of GB8622864D0 publication Critical patent/GB8622864D0/en
Publication of GB2180698A publication Critical patent/GB2180698A/en
Application granted granted Critical
Publication of GB2180698B publication Critical patent/GB2180698B/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB08622864A 1985-09-24 1986-09-23 A method of contacting (applying)chips onto conductor paths, apparatus for carrying out the method and a liquid-crystal cell having bonded-on chips Expired GB2180698B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853533993 DE3533993A1 (de) 1985-09-24 1985-09-24 Verfahren zum kontaktieren auf leiterbahnen, vorrichtung zum ausueben des verfahrens und fluessigkristallzelle mit aufgebondeten chip

Publications (3)

Publication Number Publication Date
GB8622864D0 GB8622864D0 (en) 1986-10-29
GB2180698A GB2180698A (en) 1987-04-01
GB2180698B true GB2180698B (en) 1988-12-14

Family

ID=6281772

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08622864A Expired GB2180698B (en) 1985-09-24 1986-09-23 A method of contacting (applying)chips onto conductor paths, apparatus for carrying out the method and a liquid-crystal cell having bonded-on chips

Country Status (3)

Country Link
JP (1) JPS6399540A (enExample)
DE (1) DE3533993A1 (enExample)
GB (1) GB2180698B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4917466A (en) * 1987-08-13 1990-04-17 Shin-Etsu Polymer Co., Ltd. Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
JP2855719B2 (ja) * 1989-03-20 1999-02-10 セイコーエプソン株式会社 半導体装置
US5365208A (en) * 1991-04-08 1994-11-15 Ngk Spark Plug Co., Ltd. Microwave stripline filter formed from a pair of dielectric substrates
GB2301938B (en) * 1994-02-28 1997-03-12 Mitsubishi Electric Corp Testing semiconductor elements

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4366342A (en) * 1978-06-21 1982-12-28 Minnesota Mining And Manufacturing Company Conductively coated embossed articles
CH624491A5 (enExample) * 1978-11-06 1981-07-31 Ebauches Electroniques Sa
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
DE3243227A1 (de) * 1982-11-23 1984-05-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum herstellen einer fluessigkristall-anzeigevorrichtung

Also Published As

Publication number Publication date
JPH0346975B2 (enExample) 1991-07-17
GB2180698A (en) 1987-04-01
JPS6399540A (ja) 1988-04-30
DE3533993A1 (de) 1987-04-02
DE3533993C2 (enExample) 1987-10-08
GB8622864D0 (en) 1986-10-29

Similar Documents

Publication Publication Date Title
AU585993B2 (en) Method and apparatus for manufacturing packaging pads
EP0198396A3 (en) Method and apparatus for data communication
EP0211634A3 (en) Method and apparatus for manufacturing semiconductor devices
EP0189848A3 (en) Method and apparatus for software debugging
AU5957386A (en) Method and apparatus for conducting chemical reactions at supercritical conditions
GB2145362B (en) Method of, and apparatus for, forming labels
GB2183126B (en) Method and apparatus for testing communication systems
AU5418886A (en) Method and apparatus for performing immunoassays
AU6048886A (en) Apparatus and method for applying transverse elastic segments
AU8279087A (en) Method and apparatus for adhesive transfer
GB2150602B (en) Method and apparatus for introducing normally solid materials into substrate surfaces
EP0478006A3 (en) Method and apparatus for searching data
EP0186100A3 (en) Analytical device and method for using same
DE3562709D1 (en) Apparatus for electrophoretically fractionating protein-containing solutions
AU1766183A (en) Labelling apparatus and method
DE3662335D1 (en) Apparatus and process for alpha-olefin polymerization
EP0183481A3 (en) Apparatus and method for locating dropouts
AU571736B2 (en) Process and apparatus for liquid-solid contacting
GB2180698B (en) A method of contacting (applying)chips onto conductor paths, apparatus for carrying out the method and a liquid-crystal cell having bonded-on chips
AU7510387A (en) Method and apparatus for drying metal chips
GB2173165B (en) Package forming apparatus and method, and carton for use therewith
EP0276900A3 (en) Apparatus and method for aligning two surfaces
EP0192099A3 (en) Method for coating objects, and apparatus for carrying out this method
GB2155204B (en) Method and apparatus for korsakovian dilution
AU1961383A (en) Labelling apparatus and method

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19990923