DE3523532A1 - Vorrichtung und verfahren zum bearbeiten von substratflaechen in einem chemischen bearbeitungssystem zur herstellung elektronischer vorrichtungen - Google Patents

Vorrichtung und verfahren zum bearbeiten von substratflaechen in einem chemischen bearbeitungssystem zur herstellung elektronischer vorrichtungen

Info

Publication number
DE3523532A1
DE3523532A1 DE19853523532 DE3523532A DE3523532A1 DE 3523532 A1 DE3523532 A1 DE 3523532A1 DE 19853523532 DE19853523532 DE 19853523532 DE 3523532 A DE3523532 A DE 3523532A DE 3523532 A1 DE3523532 A1 DE 3523532A1
Authority
DE
Germany
Prior art keywords
liquid
spray
chemical
openings
chemicals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19853523532
Other languages
German (de)
English (en)
Inventor
Don C. Excelsior Minn. Burkman
Charlie A. Waconia Minn. Peterson
David D. Plymouth Minn. Schumacher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fsi Corp
Original Assignee
Fsi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fsi Corp filed Critical Fsi Corp
Publication of DE3523532A1 publication Critical patent/DE3523532A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Weting (AREA)
DE19853523532 1984-07-02 1985-07-01 Vorrichtung und verfahren zum bearbeiten von substratflaechen in einem chemischen bearbeitungssystem zur herstellung elektronischer vorrichtungen Ceased DE3523532A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/626,702 US4682615A (en) 1984-07-02 1984-07-02 Rinsing in acid processing of substrates

Publications (1)

Publication Number Publication Date
DE3523532A1 true DE3523532A1 (de) 1986-01-09

Family

ID=24511468

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853523532 Ceased DE3523532A1 (de) 1984-07-02 1985-07-01 Vorrichtung und verfahren zum bearbeiten von substratflaechen in einem chemischen bearbeitungssystem zur herstellung elektronischer vorrichtungen

Country Status (3)

Country Link
US (1) US4682615A (enExample)
JP (2) JPS6129130A (enExample)
DE (1) DE3523532A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0271958A3 (en) * 1986-12-19 1990-05-23 Philips Electronics Uk Limited Apparatus suitable for processing semiconductor slices
DE9013668U1 (de) * 1990-09-29 1992-01-30 HAMATECH Halbleiter-Maschinenbau und Technologie GmbH, 7137 Sternenfels Vorrichtung für die Halbleitertechnik
DE19600985A1 (de) * 1996-01-12 1997-07-17 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Behandeln von Substraten
US6875090B2 (en) 1999-12-01 2005-04-05 Gerber Coburn Optical, Inc. Apparatus for finishing optical surfaces, including a pad compensation device

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63271931A (ja) * 1987-04-28 1988-11-09 Tokyo Electron Ltd 現像装置
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
JPH0656833B2 (ja) * 1989-01-30 1994-07-27 大日本スクリーン製造株式会社 基板のレジスト除去洗浄方法及びその装置
US4900395A (en) * 1989-04-07 1990-02-13 Fsi International, Inc. HF gas etching of wafers in an acid processor
US5169408A (en) * 1990-01-26 1992-12-08 Fsi International, Inc. Apparatus for wafer processing with in situ rinse
US5246023A (en) * 1990-04-24 1993-09-21 Electronic Controls Design, Inc. Method and apparatus to clean and cleanliness test printed circuit boards
US5089084A (en) * 1990-12-03 1992-02-18 Micron Technology, Inc. Hydrofluoric acid etcher and cascade rinser
WO1992021451A1 (en) * 1991-06-05 1992-12-10 Manufacturing Concepts & Technologies, Inc. Printed circuit board cleaner
US5534078A (en) * 1994-01-27 1996-07-09 Breunsbach; Rex Method for cleaning electronic assemblies
JP3415670B2 (ja) * 1994-03-03 2003-06-09 三菱電機株式会社 ウエハ洗浄装置
JPH08323305A (ja) * 1995-05-31 1996-12-10 Mitsubishi Electric Corp 洗浄装置
DE69608669T2 (de) * 1995-12-19 2001-03-01 Cornell Research Foundation, Inc. Stromloses aufbringen von metallfilmen mit sprayprozessor
US5908041A (en) * 1996-07-17 1999-06-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method for cleaning a photoresist developer spray stream nozzle
US5861064A (en) * 1997-03-17 1999-01-19 Fsi Int Inc Process for enhanced photoresist removal in conjunction with various methods and chemistries
JPH10261687A (ja) * 1997-03-18 1998-09-29 Furontetsuku:Kk 半導体等製造装置
US6350322B1 (en) * 1997-03-21 2002-02-26 Micron Technology, Inc. Method of reducing water spotting and oxide growth on a semiconductor structure
US6340395B1 (en) * 2000-01-18 2002-01-22 Advanced Micro Devices, Inc. Salsa clean process
JP3662484B2 (ja) * 2000-08-09 2005-06-22 エム・エフエスアイ株式会社 ウェット処理方法及びウェット処理装置
US6951221B2 (en) * 2000-09-22 2005-10-04 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US7326305B2 (en) * 2004-01-30 2008-02-05 Intersil Americas, Inc. System and method for decapsulating an encapsulated object
KR101255048B1 (ko) 2005-04-01 2013-04-16 에프에스아이 인터내쇼날 인크. 하나 이상의 처리 유체를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는데 이용되는 장치용 배리어 구조 및 노즐 장치
DE102005059850A1 (de) * 2005-12-15 2007-06-28 Atmel Germany Gmbh Vorrichtung zum Reinigen und Trocknen von Wafern
JP5194259B2 (ja) * 2006-07-07 2013-05-08 ティーイーエル エフエスアイ，インコーポレイティド 液体エーロゾル式パーティクル除去方法
JP2009543338A (ja) 2006-07-07 2009-12-03 エフエスアイ インターナショナル インコーポレーテッド １つ以上の処理流体によりマイクロエレクトロニクス半製品を処理するために用いられる道具において使われる隔壁構造およびノズル装置
KR101060664B1 (ko) * 2007-08-07 2011-08-31 에프에스아이 인터내쇼날 인크. 하나 이상의 처리유체로 전자소자를 처리하는 장비의 배리어 판 및 벤튜리 시스템의 세정방법 및 관련 장치
US8235062B2 (en) * 2008-05-09 2012-08-07 Fsi International, Inc. Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation
US20100059084A1 (en) * 2008-09-10 2010-03-11 Austin American Technology Corporation Cleaning and testing ionic cleanliness of electronic assemblies
CN101654809B (zh) * 2009-09-25 2011-12-21 耿彪 槽式晶体硅湿法制绒设备

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3348774A (en) * 1965-03-18 1967-10-24 Gyromat Corp Semi-automatic color change system for paint spray installation
US3438583A (en) * 1966-04-18 1969-04-15 Heinicke Instr Co Cleaning apparatus
US3489608A (en) * 1965-10-26 1970-01-13 Kulicke & Soffa Ind Inc Method and apparatus for treating semiconductor wafers
DE1675147A1 (de) * 1968-03-07 1970-12-10 Hollnagel Harold Elmer Bremsbetaetigungsvorrichtung
GB1370468A (en) * 1970-09-04 1974-10-16 Nordson Corp Sequence control of colour change in spraying apparatus
DE3026859A1 (de) * 1979-07-26 1981-02-26 Fsi Corp Vorrichtung fuer das aufbringen von photolack auf siliziumwafer
DE3130096A1 (de) * 1980-08-04 1982-05-19 Ransburg Japan, Ltd., Tokyo Vorrichtung zum elektrischen beschichten sowie verfahren zum farbwechsel in einer derartigen vorrichtung
US4403736A (en) * 1981-11-30 1983-09-13 Ransburg Corporation Uncontaminated purge solvent recovery system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2369358A (en) * 1942-06-11 1945-02-13 Lathrop Paulson Co Washing mechanism
US2609827A (en) * 1947-07-30 1952-09-09 Champion Spark Plug Co Spark plug cleaning apparatus
US3012921A (en) * 1958-08-20 1961-12-12 Philco Corp Controlled jet etching of semiconductor units
DE1279605B (de) * 1964-12-21 1968-10-10 Roechlingsche Eisen & Stahl Mittel und Vorrichtung zum Kuehlen von zu Ringen gehaspeltem Walzdraht
US3719191A (en) * 1971-02-04 1973-03-06 Ladish Co Cleaning system
US4027686A (en) * 1973-01-02 1977-06-07 Texas Instruments Incorporated Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water
US3990462A (en) * 1975-05-19 1976-11-09 Fluoroware Systems Corporation Substrate stripping and cleaning apparatus
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
US4221228A (en) * 1978-09-15 1980-09-09 Advanced Curing Systems, Inc. Piece part washer
US4429983A (en) * 1982-03-22 1984-02-07 International Business Machines Corporation Developing apparatus for exposed photoresist coated wafers

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3348774A (en) * 1965-03-18 1967-10-24 Gyromat Corp Semi-automatic color change system for paint spray installation
US3489608A (en) * 1965-10-26 1970-01-13 Kulicke & Soffa Ind Inc Method and apparatus for treating semiconductor wafers
US3438583A (en) * 1966-04-18 1969-04-15 Heinicke Instr Co Cleaning apparatus
DE1675147A1 (de) * 1968-03-07 1970-12-10 Hollnagel Harold Elmer Bremsbetaetigungsvorrichtung
GB1370468A (en) * 1970-09-04 1974-10-16 Nordson Corp Sequence control of colour change in spraying apparatus
DE3026859A1 (de) * 1979-07-26 1981-02-26 Fsi Corp Vorrichtung fuer das aufbringen von photolack auf siliziumwafer
DE3130096A1 (de) * 1980-08-04 1982-05-19 Ransburg Japan, Ltd., Tokyo Vorrichtung zum elektrischen beschichten sowie verfahren zum farbwechsel in einer derartigen vorrichtung
US4403736A (en) * 1981-11-30 1983-09-13 Ransburg Corporation Uncontaminated purge solvent recovery system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0271958A3 (en) * 1986-12-19 1990-05-23 Philips Electronics Uk Limited Apparatus suitable for processing semiconductor slices
DE9013668U1 (de) * 1990-09-29 1992-01-30 HAMATECH Halbleiter-Maschinenbau und Technologie GmbH, 7137 Sternenfels Vorrichtung für die Halbleitertechnik
DE19600985A1 (de) * 1996-01-12 1997-07-17 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Behandeln von Substraten
US6875090B2 (en) 1999-12-01 2005-04-05 Gerber Coburn Optical, Inc. Apparatus for finishing optical surfaces, including a pad compensation device

Also Published As

Publication number Publication date
JPH01157533A (ja) 1989-06-20
JPH067546B2 (ja) 1994-01-26
JPH0234167B2 (enExample) 1990-08-01
US4682615A (en) 1987-07-28
JPS6129130A (ja) 1986-02-10

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8131 Rejection