DE3463588D1 - Process for forming passivation film on photoelectric conversion device and the device produced thereby - Google Patents
Process for forming passivation film on photoelectric conversion device and the device produced therebyInfo
- Publication number
- DE3463588D1 DE3463588D1 DE8484100494T DE3463588T DE3463588D1 DE 3463588 D1 DE3463588 D1 DE 3463588D1 DE 8484100494 T DE8484100494 T DE 8484100494T DE 3463588 T DE3463588 T DE 3463588T DE 3463588 D1 DE3463588 D1 DE 3463588D1
- Authority
- DE
- Germany
- Prior art keywords
- photoelectric conversion
- passivation film
- forming passivation
- conversion device
- produced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000006243 chemical reaction Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000002161 passivation Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31608—Deposition of SiO2
- H01L21/31612—Deposition of SiO2 on a silicon body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022475—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of indium tin oxide [ITO]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/958—Passivation layer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Photovoltaic Devices (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58015832A JPH0614552B2 (ja) | 1983-02-02 | 1983-02-02 | 光電変換素子の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3463588D1 true DE3463588D1 (en) | 1987-06-11 |
Family
ID=11899811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484100494T Expired DE3463588D1 (en) | 1983-02-02 | 1984-01-18 | Process for forming passivation film on photoelectric conversion device and the device produced thereby |
Country Status (4)
Country | Link |
---|---|
US (1) | US4527007A (de) |
EP (1) | EP0117980B1 (de) |
JP (1) | JPH0614552B2 (de) |
DE (1) | DE3463588D1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60220967A (ja) * | 1984-04-18 | 1985-11-05 | Fuji Xerox Co Ltd | 半導体装置 |
US4727407A (en) * | 1984-07-13 | 1988-02-23 | Fuji Xerox Co., Ltd. | Image sensor |
US5084399A (en) * | 1984-10-01 | 1992-01-28 | Fuji Xerox Co., Ltd. | Semi conductor device and process for fabrication of same |
JPS61253870A (ja) * | 1985-05-07 | 1986-11-11 | Hitachi Ltd | 光起電力素子 |
JPH0673372B2 (ja) * | 1985-06-24 | 1994-09-14 | 三菱電機株式会社 | 光読み取り装置及びその製造方法 |
JPS62136871A (ja) * | 1985-12-11 | 1987-06-19 | Canon Inc | 光センサ−、その製造方法及びその製造装置 |
JP2566914B2 (ja) * | 1985-12-28 | 1996-12-25 | キヤノン株式会社 | 薄膜半導体素子及びその形成法 |
DE3650362T2 (de) * | 1986-01-06 | 1996-01-25 | Semiconductor Energy Lab | Photoelektrische Umwandlungsvorrichtung mit hoher Ansprechgeschwindigkeit und Herstellungsverfahren. |
JPS62172755A (ja) * | 1986-01-27 | 1987-07-29 | Canon Inc | フオトセンサの作製方法 |
KR910003742B1 (ko) * | 1986-09-09 | 1991-06-10 | 세미콘덕터 에너지 라보라터리 캄파니 리미티드 | Cvd장치 |
US4901153A (en) * | 1988-08-10 | 1990-02-13 | Seiko Instruments Inc. | Image sensor with reduced surface reflection interference |
US5318857A (en) * | 1989-11-06 | 1994-06-07 | Dow Corning Corporation | Low temperature ozonolysis of silicon and ceramic oxide precursor polymers to ceramic coatings |
TW371796B (en) * | 1995-09-08 | 1999-10-11 | Semiconductor Energy Lab Co Ltd | Method and apparatus for manufacturing a semiconductor device |
US5736423A (en) * | 1995-11-16 | 1998-04-07 | Advanced Micro Devices, Inc. | Method for depositing very thin PECVD SiO2 in 0.5 micron and 0.35 micron technologies |
JP3164019B2 (ja) * | 1997-05-21 | 2001-05-08 | 日本電気株式会社 | 酸化シリコン膜およびその形成方法と成膜装置 |
US6326231B1 (en) * | 1998-12-08 | 2001-12-04 | Advanced Micro Devices, Inc. | Use of silicon oxynitride ARC for metal layers |
US6618409B1 (en) * | 2000-05-03 | 2003-09-09 | Corning Incorporated | Passivation of semiconductor laser facets |
EP1351858B1 (de) * | 2001-11-07 | 2004-08-25 | Hassia Verpackungsmaschinen GmbH | Verfahren zum vorsterilisieren einer schlauchbeutel-verpackungsmaschine |
WO2004107450A1 (ja) * | 2003-05-30 | 2004-12-09 | Fujitsu Limited | 半導体装置と半導体装置の製造方法 |
JP4961111B2 (ja) * | 2005-02-28 | 2012-06-27 | 富士フイルム株式会社 | 光電変換膜積層型固体撮像素子とその製造方法 |
JP5819799B2 (ja) * | 2011-10-31 | 2015-11-24 | 富士フイルム株式会社 | 光電変換素子及び撮像素子 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5824951B2 (ja) * | 1974-10-09 | 1983-05-24 | ソニー株式会社 | コウガクソウチ |
JPS558092A (en) * | 1978-07-04 | 1980-01-21 | Nec Corp | Fine film solar cell and its production method |
JPS55151329A (en) * | 1979-05-14 | 1980-11-25 | Shunpei Yamazaki | Fabricating method of semiconductor device |
JPS5643776A (en) * | 1979-09-18 | 1981-04-22 | Seiko Epson Corp | Production of solar battery |
DE3066027D1 (en) * | 1979-12-17 | 1984-02-02 | Hughes Aircraft Co | Low temperature process for depositing oxide layers by photochemical vapor deposition |
JPS56157075A (en) * | 1980-05-09 | 1981-12-04 | Hitachi Ltd | Photoelectric transducing device |
US4410558A (en) * | 1980-05-19 | 1983-10-18 | Energy Conversion Devices, Inc. | Continuous amorphous solar cell production system |
JPS5747711A (en) * | 1980-08-08 | 1982-03-18 | Fujitsu Ltd | Chemical plasma growing method in vapor phase |
JPS57124983A (en) * | 1981-01-28 | 1982-08-04 | Hitachi Ltd | Color solid-state image pickup element |
JPS57190455A (en) * | 1981-05-19 | 1982-11-24 | Nippon Telegr & Teleph Corp <Ntt> | Adhesion type image sensor |
US4379943A (en) * | 1981-12-14 | 1983-04-12 | Energy Conversion Devices, Inc. | Current enhanced photovoltaic device |
-
1983
- 1983-02-02 JP JP58015832A patent/JPH0614552B2/ja not_active Expired - Lifetime
-
1984
- 1984-01-18 DE DE8484100494T patent/DE3463588D1/de not_active Expired
- 1984-01-18 EP EP84100494A patent/EP0117980B1/de not_active Expired
- 1984-01-25 US US06/573,875 patent/US4527007A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0117980A1 (de) | 1984-09-12 |
EP0117980B1 (de) | 1987-05-06 |
JPS59141278A (ja) | 1984-08-13 |
US4527007A (en) | 1985-07-02 |
JPH0614552B2 (ja) | 1994-02-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |