DE3442132A1 - Verfahren zur verkapselung von mikroelektronikschaltungen mit organischen komponenten - Google Patents

Verfahren zur verkapselung von mikroelektronikschaltungen mit organischen komponenten

Info

Publication number
DE3442132A1
DE3442132A1 DE19843442132 DE3442132A DE3442132A1 DE 3442132 A1 DE3442132 A1 DE 3442132A1 DE 19843442132 DE19843442132 DE 19843442132 DE 3442132 A DE3442132 A DE 3442132A DE 3442132 A1 DE3442132 A1 DE 3442132A1
Authority
DE
Germany
Prior art keywords
getter material
getter
silicone rubber
encapsulated
microelectronic element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19843442132
Other languages
German (de)
English (en)
Other versions
DE3442132C2 (https=
Inventor
Werner Dipl.-Chem. Dr. 7900 Ulm Möller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Messerschmitt Bolkow Blohm AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Messerschmitt Bolkow Blohm AG filed Critical Messerschmitt Bolkow Blohm AG
Priority to DE19843442132 priority Critical patent/DE3442132A1/de
Priority to EP85905774A priority patent/EP0200773B1/de
Priority to JP60505299A priority patent/JPS62500830A/ja
Priority to US06/908,687 priority patent/US4768081A/en
Priority to PCT/DE1985/000473 priority patent/WO1986003056A1/de
Publication of DE3442132A1 publication Critical patent/DE3442132A1/de
Application granted granted Critical
Publication of DE3442132C2 publication Critical patent/DE3442132C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE19843442132 1984-11-17 1984-11-17 Verfahren zur verkapselung von mikroelektronikschaltungen mit organischen komponenten Granted DE3442132A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19843442132 DE3442132A1 (de) 1984-11-17 1984-11-17 Verfahren zur verkapselung von mikroelektronikschaltungen mit organischen komponenten
EP85905774A EP0200773B1 (de) 1984-11-17 1985-11-18 Verfahren zur verkapselung von mikroelektronikschaltungen mit organischen komponenten
JP60505299A JPS62500830A (ja) 1984-11-17 1985-11-18 超小型電子回路を有機部材で封止する方法およびこの方法に適した材料による回路素子
US06/908,687 US4768081A (en) 1984-11-17 1985-11-18 Process for encapsulating microelectronic circuits with organic components
PCT/DE1985/000473 WO1986003056A1 (fr) 1984-11-17 1985-11-18 Procede d'encapsulement des circuits microelectroniques avec des composants organiques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843442132 DE3442132A1 (de) 1984-11-17 1984-11-17 Verfahren zur verkapselung von mikroelektronikschaltungen mit organischen komponenten

Publications (2)

Publication Number Publication Date
DE3442132A1 true DE3442132A1 (de) 1986-05-22
DE3442132C2 DE3442132C2 (https=) 1988-06-23

Family

ID=6250593

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843442132 Granted DE3442132A1 (de) 1984-11-17 1984-11-17 Verfahren zur verkapselung von mikroelektronikschaltungen mit organischen komponenten

Country Status (5)

Country Link
US (1) US4768081A (https=)
EP (1) EP0200773B1 (https=)
JP (1) JPS62500830A (https=)
DE (1) DE3442132A1 (https=)
WO (1) WO1986003056A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9497875B2 (en) 2011-05-09 2016-11-15 Conti Temic Microelectronic Gmbh Control device with a getter layer for use in a motor vehicle

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US5032944A (en) * 1989-01-12 1991-07-16 Mitsubishi Denki Kabushiki Kaisha Membrane type magnetic head
DE3913066A1 (de) * 1989-04-21 1990-11-08 Schoppe & Faeser Gmbh Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse
JPH0448674A (ja) * 1990-06-14 1992-02-18 Rohm Co Ltd 半導体レーザ
JP2858166B2 (ja) * 1990-10-08 1999-02-17 株式会社日立製作所 半導体整流素子及びそれを使った全波整流装置
DE4111247C3 (de) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Schaltungsanordnung
KR0134902B1 (ko) * 1991-07-08 1998-04-20 다니엘 케이. 니콜스 칩 캐리어 패키지 및 집적 회로 패키지
US5276414A (en) * 1991-12-10 1994-01-04 Mitsubishi Denki Kabushiki Kaisha Moistureproof structure for module circuits
US5331205A (en) * 1992-02-21 1994-07-19 Motorola, Inc. Molded plastic package with wire protection
US5379186A (en) * 1993-07-06 1995-01-03 Motorola, Inc. Encapsulated electronic component having a heat diffusing layer
SE502877C2 (sv) * 1994-06-14 1996-02-05 Ericsson Telefon Ab L M Anordning som förhindrar brand i elektronik
US5436203A (en) * 1994-07-05 1995-07-25 Motorola, Inc. Shielded liquid encapsulated semiconductor device and method for making the same
US5600181A (en) * 1995-05-24 1997-02-04 Lockheed Martin Corporation Hermetically sealed high density multi-chip package
WO1997011905A1 (en) * 1995-09-28 1997-04-03 Alliedsignal Inc. Hydrogen and moisture getter and absorber for sealed devices
US5939785A (en) * 1996-04-12 1999-08-17 Texas Instruments Incorporated Micromechanical device including time-release passivant
US6962829B2 (en) * 1996-10-31 2005-11-08 Amkor Technology, Inc. Method of making near chip size integrated circuit package
US6150193A (en) * 1996-10-31 2000-11-21 Amkor Technology, Inc. RF shielded device
US5753563A (en) * 1997-07-30 1998-05-19 Chartered Semiconductor Manufacturing Ltd. Method of removing particles by adhesive
US6452268B1 (en) 2000-04-26 2002-09-17 Siliconware Precision Industries Co., Ltd. Integrated circuit package configuration having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body
GB0018643D0 (en) 2000-07-31 2000-09-13 Koninkl Philips Electronics Nv Semiconductor devices
JP4114037B2 (ja) * 2001-09-25 2008-07-09 信越化学工業株式会社 電気・電子部品の硫化防止又は遅延用シリコーンゴム封止・シール材及び硫化防止又は遅延方法
US7332797B2 (en) * 2003-06-30 2008-02-19 Intel Corporation Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold
JP4530137B2 (ja) * 2003-09-17 2010-08-25 信越化学工業株式会社 精密電子部品封止・シール用オルガノポリシロキサン組成物、精密電子部品の腐蝕防止又は遅延方法、並びに銀含有精密電子部品
DE102005005634A1 (de) * 2005-02-08 2006-08-24 Wacker Chemie Ag Vernetzbare Massen auf der Basis von Organosiliciumverbindungen
US8173995B2 (en) 2005-12-23 2012-05-08 E. I. Du Pont De Nemours And Company Electronic device including an organic active layer and process for forming the electronic device
US20090057885A1 (en) * 2007-08-30 2009-03-05 Infineon Technologies Ag Semiconductor device
DE102008017553B4 (de) * 2008-04-07 2012-12-13 Siemens Aktiengesellschaft Elektronisches System
JP2011077108A (ja) * 2009-09-29 2011-04-14 Elpida Memory Inc 半導体装置
DE102010043811B4 (de) 2010-11-12 2023-09-28 Robert Bosch Gmbh Gelpassiviertes elektrisches Bauteil

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1057694B (de) * 1957-08-01 1959-05-21 Siemens Ag Gekapseltes Halbleitergeraet mit einem oder mehreren p-n-UEbergaengen
US3007089A (en) * 1958-12-22 1961-10-31 Aden J King Semi-conductor
CH445648A (de) * 1964-09-21 1967-10-31 Siemens Ag Verfahren zum Herstellen eines elektrischen Halbleiterbauelementes mit Gehäuse

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FR1205359A (fr) * 1958-07-23 1960-02-02 Siemens Edison Swan Ltd Dispositifs semi-conducteurs hermétiquement fermés
US3181229A (en) * 1962-01-08 1965-05-04 Mallory & Co Inc P R Hermetically sealed semiconductor device and method for producing it
FR1448423A (fr) * 1964-09-21 1966-08-05 Siemens Ag Fabrication de composants électriques, notamment à semi-conducteurs
GB1193610A (en) * 1967-04-17 1970-06-03 Mallory & Co Inc P R Desiccant for Electrical and Electronic Devices.
US3885304A (en) * 1972-03-23 1975-05-27 Bosch Gmbh Robert Electric circuit arrangement and method of making the same
NL7511482A (nl) * 1975-09-30 1977-04-01 Philips Nv Gasbindinrichting; werkwijze voor het vervaardi- gen van een kleurentelevisiebeeldbuis onder toe- passing van deze gasbindinrichting en aldus ver- vaardigde kleurentelevisiebeeldbuis.
US4163072A (en) * 1977-06-07 1979-07-31 Bell Telephone Laboratories, Incorporated Encapsulation of circuits
DE3070123D1 (en) * 1979-10-25 1985-03-21 Toshiba Kk Getter device
JPS5681956A (en) * 1979-12-07 1981-07-04 Toshiba Corp Semiconductor device
JPS60157241A (ja) * 1984-01-26 1985-08-17 Mitsubishi Electric Corp 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1057694B (de) * 1957-08-01 1959-05-21 Siemens Ag Gekapseltes Halbleitergeraet mit einem oder mehreren p-n-UEbergaengen
US3007089A (en) * 1958-12-22 1961-10-31 Aden J King Semi-conductor
CH445648A (de) * 1964-09-21 1967-10-31 Siemens Ag Verfahren zum Herstellen eines elektrischen Halbleiterbauelementes mit Gehäuse

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Rompp's Chemielexikon - 7. Auflage (1973) Seite 1275 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9497875B2 (en) 2011-05-09 2016-11-15 Conti Temic Microelectronic Gmbh Control device with a getter layer for use in a motor vehicle

Also Published As

Publication number Publication date
WO1986003056A1 (fr) 1986-05-22
DE3442132C2 (https=) 1988-06-23
EP0200773B1 (de) 1989-05-17
US4768081A (en) 1988-08-30
JPS62500830A (ja) 1987-04-02
EP0200773A1 (de) 1986-11-12

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DEUTSCHE AEROSPACE AG, 8000 MUENCHEN, DE

8327 Change in the person/name/address of the patent owner

Owner name: TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILB

8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee