JPS62500830A - 超小型電子回路を有機部材で封止する方法およびこの方法に適した材料による回路素子 - Google Patents

超小型電子回路を有機部材で封止する方法およびこの方法に適した材料による回路素子

Info

Publication number
JPS62500830A
JPS62500830A JP60505299A JP50529985A JPS62500830A JP S62500830 A JPS62500830 A JP S62500830A JP 60505299 A JP60505299 A JP 60505299A JP 50529985 A JP50529985 A JP 50529985A JP S62500830 A JPS62500830 A JP S62500830A
Authority
JP
Japan
Prior art keywords
getter material
getter
microelectronic
sealed
sealing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60505299A
Other languages
English (en)
Japanese (ja)
Inventor
メーレル・ウエルネル
Original Assignee
メツセルシユミツト−ベルコウ−ブロ−ム・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by メツセルシユミツト−ベルコウ−ブロ−ム・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング filed Critical メツセルシユミツト−ベルコウ−ブロ−ム・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング
Publication of JPS62500830A publication Critical patent/JPS62500830A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60505299A 1984-11-17 1985-11-18 超小型電子回路を有機部材で封止する方法およびこの方法に適した材料による回路素子 Pending JPS62500830A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3442132.7 1984-11-17
DE19843442132 DE3442132A1 (de) 1984-11-17 1984-11-17 Verfahren zur verkapselung von mikroelektronikschaltungen mit organischen komponenten

Publications (1)

Publication Number Publication Date
JPS62500830A true JPS62500830A (ja) 1987-04-02

Family

ID=6250593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60505299A Pending JPS62500830A (ja) 1984-11-17 1985-11-18 超小型電子回路を有機部材で封止する方法およびこの方法に適した材料による回路素子

Country Status (5)

Country Link
US (1) US4768081A (https=)
EP (1) EP0200773B1 (https=)
JP (1) JPS62500830A (https=)
DE (1) DE3442132A1 (https=)
WO (1) WO1986003056A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003096301A (ja) * 2001-09-25 2003-04-03 Shin Etsu Chem Co Ltd 電気・電子部品封止・シール用シリコーンゴム組成物
JP2005113115A (ja) * 2003-09-17 2005-04-28 Shin Etsu Chem Co Ltd 精密電子部品封止・シール用オルガノポリシロキサン組成物、精密電子部品の腐蝕防止又は遅延方法、並びに銀含有精密電子部品
JP2008530282A (ja) * 2005-02-08 2008-08-07 ワッカー ケミー アクチエンゲゼルシャフト 有機ケイ素化合物をベースとする架橋可能なコンパウンド

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5032944A (en) * 1989-01-12 1991-07-16 Mitsubishi Denki Kabushiki Kaisha Membrane type magnetic head
DE3913066A1 (de) * 1989-04-21 1990-11-08 Schoppe & Faeser Gmbh Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse
JPH0448674A (ja) * 1990-06-14 1992-02-18 Rohm Co Ltd 半導体レーザ
JP2858166B2 (ja) * 1990-10-08 1999-02-17 株式会社日立製作所 半導体整流素子及びそれを使った全波整流装置
DE4111247C3 (de) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Schaltungsanordnung
KR0134902B1 (ko) * 1991-07-08 1998-04-20 다니엘 케이. 니콜스 칩 캐리어 패키지 및 집적 회로 패키지
US5276414A (en) * 1991-12-10 1994-01-04 Mitsubishi Denki Kabushiki Kaisha Moistureproof structure for module circuits
US5331205A (en) * 1992-02-21 1994-07-19 Motorola, Inc. Molded plastic package with wire protection
US5379186A (en) * 1993-07-06 1995-01-03 Motorola, Inc. Encapsulated electronic component having a heat diffusing layer
SE502877C2 (sv) * 1994-06-14 1996-02-05 Ericsson Telefon Ab L M Anordning som förhindrar brand i elektronik
US5436203A (en) * 1994-07-05 1995-07-25 Motorola, Inc. Shielded liquid encapsulated semiconductor device and method for making the same
US5600181A (en) * 1995-05-24 1997-02-04 Lockheed Martin Corporation Hermetically sealed high density multi-chip package
WO1997011905A1 (en) * 1995-09-28 1997-04-03 Alliedsignal Inc. Hydrogen and moisture getter and absorber for sealed devices
US5939785A (en) * 1996-04-12 1999-08-17 Texas Instruments Incorporated Micromechanical device including time-release passivant
US6962829B2 (en) * 1996-10-31 2005-11-08 Amkor Technology, Inc. Method of making near chip size integrated circuit package
US6150193A (en) * 1996-10-31 2000-11-21 Amkor Technology, Inc. RF shielded device
US5753563A (en) * 1997-07-30 1998-05-19 Chartered Semiconductor Manufacturing Ltd. Method of removing particles by adhesive
US6452268B1 (en) 2000-04-26 2002-09-17 Siliconware Precision Industries Co., Ltd. Integrated circuit package configuration having an encapsulating body with a flanged portion and an encapsulating mold for molding the encapsulating body
GB0018643D0 (en) 2000-07-31 2000-09-13 Koninkl Philips Electronics Nv Semiconductor devices
US7332797B2 (en) * 2003-06-30 2008-02-19 Intel Corporation Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold
US8173995B2 (en) 2005-12-23 2012-05-08 E. I. Du Pont De Nemours And Company Electronic device including an organic active layer and process for forming the electronic device
US20090057885A1 (en) * 2007-08-30 2009-03-05 Infineon Technologies Ag Semiconductor device
DE102008017553B4 (de) * 2008-04-07 2012-12-13 Siemens Aktiengesellschaft Elektronisches System
JP2011077108A (ja) * 2009-09-29 2011-04-14 Elpida Memory Inc 半導体装置
DE102010043811B4 (de) 2010-11-12 2023-09-28 Robert Bosch Gmbh Gelpassiviertes elektrisches Bauteil
DE102011056742B4 (de) 2011-05-09 2019-07-18 Conti Temic Microelectronic Gmbh Steuergerät mit einer Getterschicht in einem Kraftfahrzeug

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1103905A (en) * 1964-09-21 1968-02-21 Siemens Ag Improvements in or relating to the production of encapsulated electrical components

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1057694B (de) * 1957-08-01 1959-05-21 Siemens Ag Gekapseltes Halbleitergeraet mit einem oder mehreren p-n-UEbergaengen
FR1205359A (fr) * 1958-07-23 1960-02-02 Siemens Edison Swan Ltd Dispositifs semi-conducteurs hermétiquement fermés
US3007089A (en) * 1958-12-22 1961-10-31 Aden J King Semi-conductor
US3181229A (en) * 1962-01-08 1965-05-04 Mallory & Co Inc P R Hermetically sealed semiconductor device and method for producing it
FR1448423A (fr) * 1964-09-21 1966-08-05 Siemens Ag Fabrication de composants électriques, notamment à semi-conducteurs
GB1193610A (en) * 1967-04-17 1970-06-03 Mallory & Co Inc P R Desiccant for Electrical and Electronic Devices.
US3885304A (en) * 1972-03-23 1975-05-27 Bosch Gmbh Robert Electric circuit arrangement and method of making the same
NL7511482A (nl) * 1975-09-30 1977-04-01 Philips Nv Gasbindinrichting; werkwijze voor het vervaardi- gen van een kleurentelevisiebeeldbuis onder toe- passing van deze gasbindinrichting en aldus ver- vaardigde kleurentelevisiebeeldbuis.
US4163072A (en) * 1977-06-07 1979-07-31 Bell Telephone Laboratories, Incorporated Encapsulation of circuits
DE3070123D1 (en) * 1979-10-25 1985-03-21 Toshiba Kk Getter device
JPS5681956A (en) * 1979-12-07 1981-07-04 Toshiba Corp Semiconductor device
JPS60157241A (ja) * 1984-01-26 1985-08-17 Mitsubishi Electric Corp 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1103905A (en) * 1964-09-21 1968-02-21 Siemens Ag Improvements in or relating to the production of encapsulated electrical components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003096301A (ja) * 2001-09-25 2003-04-03 Shin Etsu Chem Co Ltd 電気・電子部品封止・シール用シリコーンゴム組成物
JP2005113115A (ja) * 2003-09-17 2005-04-28 Shin Etsu Chem Co Ltd 精密電子部品封止・シール用オルガノポリシロキサン組成物、精密電子部品の腐蝕防止又は遅延方法、並びに銀含有精密電子部品
JP2008530282A (ja) * 2005-02-08 2008-08-07 ワッカー ケミー アクチエンゲゼルシャフト 有機ケイ素化合物をベースとする架橋可能なコンパウンド

Also Published As

Publication number Publication date
DE3442132A1 (de) 1986-05-22
WO1986003056A1 (fr) 1986-05-22
DE3442132C2 (https=) 1988-06-23
EP0200773B1 (de) 1989-05-17
US4768081A (en) 1988-08-30
EP0200773A1 (de) 1986-11-12

Similar Documents

Publication Publication Date Title
JPS62500830A (ja) 超小型電子回路を有機部材で封止する方法およびこの方法に適した材料による回路素子
US5888925A (en) Hydrogen and moisture getter and absorber for sealed devices
US5591379A (en) Moisture getting composition for hermetic microelectronic devices
US3704806A (en) Dehumidifying composition and a method for preparing the same
US4109818A (en) Hermetic sealing cover for a container for semiconductor devices
JPS6255301B2 (https=)
JPS58128753A (ja) 電気構成部分のためのケ−シング
JPH06231739A (ja) 無機材料堆積層を有する可撓性高分子フィルムを用いた電池パッケージ及びその製造方法
JP2013520022A (ja) 低線量率での感度を低下させた電気的、電子的、電気機械的または電気光学的構成要素を含むデバイス
EP1617494B1 (en) Organic photovoltaic component with encapsulation
JPS61114492A (ja) 薄膜装置用密封包被体
US3466508A (en) Stabilization of solid electrolyte capacitors by means of atmospheric control
US4427992A (en) Method for incorporating a desiccant in a semiconductor package
CN1122167A (zh) 电子元件的外壳
US3174125A (en) Mechanical pressure sensor
US2928030A (en) Semiconductor devices
US3491269A (en) Construction for non-hermetic sealed solid electrolyte capacitor
JP2005353291A (ja) 気密端子及びその製造方法
US3226610A (en) Constant-current semiconductor device
USRE26899E (en) Encapsulation op electronic modules
JP2002134659A (ja) 電子素子用基板とその製造方法並びに電子素子とその製造方法
US3533965A (en) Low expansion material
JPS59208860A (ja) 半導体装置
Sinnadurai et al. Some problems and possible solutions for hybrid microcircuit reliability
US20240204694A1 (en) Electret Device