Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
  • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
  • H10W76/42—Fillings
  • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
  • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
  • H10W70/68—Shapes or dispositions thereof
  • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/50—Bond wires
  • H10W72/531—Shapes of wire connectors
  • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/50—Bond wires
  • H10W72/551—Materials of bond wires
  • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
  • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/50—Bond wires
  • H10W72/551—Materials of bond wires
  • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
  • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

• the invention relates to a method for encapsulating microelectronic circuits with organic components, a getter being included to accommodate corrosive gases in the interior.
• the desiccants known from electronics for example from DE-OS 31 12 564, or the molecular sieves based on zeolite, the use of which is known, for example, from EP-AI 0113 282, absorb only the moisture and give it when heating, ie under critical circuit conditions, again.
• the getter material is dispersed as a fine-grained powder in a gas-permeable, inert silicone rubber.
• Fig. 2 is a differential thermal analysis diagram for silicone gel without getter material
• Fig. 3 is a differential thermal analysis diagram for
• Fig. 4 is a differential thermal analysis diagram for silicone gel with BaAl in air with moisture
• Fig. 5 is a differential thermal analysis diagram for S Siiliilkon gel with BaAl- in moistened Urage- 4 exercise.
• 1a to 1d show the basic structure of a circuit encapsulated by the method according to the invention.
• La adheres to a substrate S, which suitably consists of AL U 3 , for example with Si-N.
• Passivated microelectronic component B which is electrically connected to the conductor tracks LB in a known manner with bond wires D, which consist of gold or other highly conductive metal.
• Module B and the bond wires are located within a soft plastic layer G, which consists of silicone gel with BaAl 4 filling. This is covered with a film F, which contains a metal layer.
• the whole is encapsulated with epoxy resin H with SiO 2 filling.
• the soft plastic layer G serves on the one hand for mechanical padding of the components and bond wires, but on the other hand also as a carrier for the getter material. For this reason, it consists of a substance of the type described in the introduction and specified in more detail in the exemplary embodiments.
• Figures la to ld show known structures with rigid housings.
• FIG. 1b it is a widely used plastic or ceramic housing and in the embodiments according to FIGS. 1c to 1d it is metal or ceramic housing.
• the two halves of the housing according to FIG. 1b are connected, for example, with glass GL. 1c and 1d are welded or soldered; the welds are with SN and the solder joints with L. All of these structures have in common that the empty interior, which is available per se, is at least partially filled with the getter material according to the invention.
• the vertical axis represents the heat in mcal / sec. Temperatures in ° K are entered on the abscissa.
• a linear curve means that the heat flow is constant and that there is no reaction or conversion heat, sagging means that heat is released in this area, e.g. by reaction of the getter with the moisture.
• the getter is vulcanized for 1 - 2 hours at room temperature or in about 5 minutes at 100 °.
• Example 3 The Sil-Gel-604 components A and B are mixed in a ratio of 15: 1. Otherwise, the conditions are as in Example 1. As a result of the hardener deficit, the getter remains more gas-permeable and sticky. It acts as a dust getter or for trapping disruptive particles.
• Example 3
• Sil-Gel-604 Sil-Gel 600 and 601, which are vulcanized by heat, are used, so that the getter is already activated.
• similar products of different provenance can also be used, e.g. the types of DOW CORNING:

Landscapes

• Solid-Sorbent Or Filter-Aiding Compositions (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=6250593

Family Applications (1)

Country Status (5)

Cited By (1)

Families Citing this family (28)

Citations (3)

Family Cites Families (10)

• 1984
  • 1984-11-17 DE DE19843442132 patent/DE3442132A1/de active Granted
• 1985
  • 1985-11-18 WO PCT/DE1985/000473 patent/WO1986003056A1/de not_active Ceased
  • 1985-11-18 US US06/908,687 patent/US4768081A/en not_active Expired - Fee Related
  • 1985-11-18 EP EP85905774A patent/EP0200773B1/de not_active Expired
  • 1985-11-18 JP JP60505299A patent/JPS62500830A/ja active Pending

Patent Citations (3)

Non-Patent Citations (1)

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