DE3328339C2 - - Google Patents
Info
- Publication number
- DE3328339C2 DE3328339C2 DE19833328339 DE3328339A DE3328339C2 DE 3328339 C2 DE3328339 C2 DE 3328339C2 DE 19833328339 DE19833328339 DE 19833328339 DE 3328339 A DE3328339 A DE 3328339A DE 3328339 C2 DE3328339 C2 DE 3328339C2
- Authority
- DE
- Germany
- Prior art keywords
- plastic
- plastic surface
- roughened
- metal coating
- brought
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 19
- 239000004033 plastic Substances 0.000 claims description 17
- 229920003023 plastic Polymers 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 244000052616 bacterial pathogen Species 0.000 claims description 2
- 230000003197 catalytic effect Effects 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims 2
- 238000005554 pickling Methods 0.000 claims 1
- 229920006255 plastic film Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000005496 tempering Methods 0.000 description 3
- 238000005422 blasting Methods 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 239000010431 corundum Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241000530268 Lycaena heteronea Species 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833328339 DE3328339A1 (de) | 1983-08-05 | 1983-08-05 | Verfahren zur metallisierung einer kunststoffoberflaeche |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833328339 DE3328339A1 (de) | 1983-08-05 | 1983-08-05 | Verfahren zur metallisierung einer kunststoffoberflaeche |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3328339A1 DE3328339A1 (de) | 1985-02-14 |
| DE3328339C2 true DE3328339C2 (enrdf_load_stackoverflow) | 1991-06-27 |
Family
ID=6205890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19833328339 Granted DE3328339A1 (de) | 1983-08-05 | 1983-08-05 | Verfahren zur metallisierung einer kunststoffoberflaeche |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3328339A1 (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19620935A1 (de) * | 1996-05-24 | 1997-11-27 | Daimler Benz Ag | Verfahren zur haftfesten Beschichtung von Polymeren |
| DE19642488A1 (de) * | 1996-10-15 | 1998-04-16 | Bernd Klose | Verfahren zur Kontaktierung von Mikrochips und zur Herstellung von Mehrlagen-Dünnschichtleiterplatten, insbesondere für superflache Multichip-Modul- und Chipcard-Anwendungen |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19922369B4 (de) * | 1999-05-14 | 2004-09-02 | Trw Automotive Electronics & Components Gmbh & Co. Kg | Flüssigkristallanzeige |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1543792A (fr) * | 1966-12-29 | 1900-01-01 | Ibm | Métallisation de matières plastiques |
| US3562038A (en) * | 1968-05-15 | 1971-02-09 | Shipley Co | Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited |
| FR2037988A5 (en) * | 1969-03-13 | 1970-12-31 | Ampex | Surface treatment of hydro-phobic plastics - surfaces to make them hydrophilic and plat |
| DE2101049A1 (de) * | 1971-01-11 | 1972-08-03 | Siemens Ag | Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall |
| BE789587A (fr) * | 1971-10-02 | 1973-04-02 | Philips Nv | Procede permettant la metallisation d'un ecran muni d'une couche luminescente |
| US3821016A (en) * | 1972-05-19 | 1974-06-28 | Western Electric Co | Method of forming an adherent metallic pattern on a polyimide surface |
| NL7500616A (nl) * | 1975-01-20 | 1976-07-22 | Philips Nv | Werkwijze voor het selektief metalliseren van het beeldscherm van een kathodestraalbuis en kathodestraalbuis vervaardigd volgens deze werkwijze. |
| GB1570380A (en) * | 1978-05-30 | 1980-07-02 | Standard Telephones Cables Ltd | Electroless plating |
| DE2844425C3 (de) * | 1978-10-12 | 1981-05-14 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Aktivierung von Kunststoffoberflächen |
| DE2950589A1 (de) * | 1979-12-15 | 1981-06-19 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur haftfesten chemischen metallisierung von hochpolymeren organischen werkstoffen |
| IT1153991B (it) * | 1980-10-29 | 1987-01-21 | Rca Corp | Metodo per creare una struttura a metallizzazione dielettrico |
| DE3121785A1 (de) * | 1981-06-02 | 1982-12-16 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum entspiegeln einer glasoberflaeche |
| DE3149919A1 (de) * | 1981-12-11 | 1983-06-23 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zum haftfesten metallisieren von polyimid |
-
1983
- 1983-08-05 DE DE19833328339 patent/DE3328339A1/de active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19620935A1 (de) * | 1996-05-24 | 1997-11-27 | Daimler Benz Ag | Verfahren zur haftfesten Beschichtung von Polymeren |
| DE19642488A1 (de) * | 1996-10-15 | 1998-04-16 | Bernd Klose | Verfahren zur Kontaktierung von Mikrochips und zur Herstellung von Mehrlagen-Dünnschichtleiterplatten, insbesondere für superflache Multichip-Modul- und Chipcard-Anwendungen |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3328339A1 (de) | 1985-02-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8320 | Willingness to grant licenses declared (paragraph 23) | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: DAIMLER-BENZ AKTIENGESELLSCHAFT, 70567 STUTTGART, |
|
| 8327 | Change in the person/name/address of the patent owner |
Owner name: DAIMLERCHRYSLER AG, 70567 STUTTGART, DE |
|
| 8339 | Ceased/non-payment of the annual fee |