DE68914033T2 - Artikel mit einem Polyimid und einer Metallschicht und Verfahren zum Herstellen solcher Artikel. - Google Patents

Artikel mit einem Polyimid und einer Metallschicht und Verfahren zum Herstellen solcher Artikel.

Info

Publication number
DE68914033T2
DE68914033T2 DE68914033T DE68914033T DE68914033T2 DE 68914033 T2 DE68914033 T2 DE 68914033T2 DE 68914033 T DE68914033 T DE 68914033T DE 68914033 T DE68914033 T DE 68914033T DE 68914033 T2 DE68914033 T2 DE 68914033T2
Authority
DE
Germany
Prior art keywords
articles
polyimide
producing
metal layer
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68914033T
Other languages
English (en)
Other versions
DE68914033D1 (de
Inventor
Morris Anschel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE68914033D1 publication Critical patent/DE68914033D1/de
Publication of DE68914033T2 publication Critical patent/DE68914033T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894Materials of the insulating layers or coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481Insulating layers on insulating parts, with or without metallisation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0154Polyimide
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264Up to 3 mils
    • Y10T428/2651 mil or less
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31681Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31721Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
DE68914033T 1988-06-03 1989-05-13 Artikel mit einem Polyimid und einer Metallschicht und Verfahren zum Herstellen solcher Artikel. Expired - Fee Related DE68914033T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/201,989 US5104734A (en) 1988-06-03 1988-06-03 Method for improving adhesion between a polyimide layer and a metal and the article obtained

Publications (2)

Publication Number Publication Date
DE68914033D1 DE68914033D1 (de) 1994-04-28
DE68914033T2 true DE68914033T2 (de) 1994-10-20

Family

ID=22748118

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68914033T Expired - Fee Related DE68914033T2 (de) 1988-06-03 1989-05-13 Artikel mit einem Polyimid und einer Metallschicht und Verfahren zum Herstellen solcher Artikel.

Country Status (4)

Country Link
US (1) US5104734A (de)
EP (1) EP0344504B1 (de)
JP (1) JPH0639144B2 (de)
DE (1) DE68914033T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5326643A (en) * 1991-10-07 1994-07-05 International Business Machines Corporation Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
US5372848A (en) * 1992-12-24 1994-12-13 International Business Machines Corporation Process for creating organic polymeric substrate with copper
JPH0948864A (ja) * 1995-08-03 1997-02-18 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルムの接着性改善方法及び接着性を改善したポリイミドフィルム
KR100269830B1 (ko) * 1996-04-18 2000-10-16 포만 제프리 엘 구리표면 보호용 유기금속계 복합 피복물
US5773132A (en) * 1997-02-28 1998-06-30 International Business Machines Corporation Protecting copper dielectric interface from delamination
CN100355938C (zh) * 2005-11-17 2007-12-19 上海交通大学 聚酰亚胺薄膜上激光诱导选择性化学镀的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2638799C3 (de) * 1976-08-27 1981-12-03 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zur Verbesserung der Haftung von metallischen Leiterzügen auf Polyimidschichten in integrierten Schaltungen
US4109052A (en) * 1977-05-12 1978-08-22 E. I. Du Pont De Nemours And Company Electroconductive transparency
DE3149919A1 (de) * 1981-12-11 1983-06-23 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zum haftfesten metallisieren von polyimid
US4386116A (en) * 1981-12-24 1983-05-31 International Business Machines Corporation Process for making multilayer integrated circuit substrate
JPS58190091A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造方法
US4598022A (en) * 1983-11-22 1986-07-01 Olin Corporation One-step plasma treatment of copper foils to increase their laminate adhesion
US4526807A (en) * 1984-04-27 1985-07-02 General Electric Company Method for deposition of elemental metals and metalloids on substrates
JPS617654A (ja) * 1984-06-22 1986-01-14 Furukawa Electric Co Ltd:The レジンモ−ルド半導体の製造法
JP2605010B2 (ja) * 1985-01-11 1997-04-30 インターナショナル・ビジネス・マシーンズ・コーポレーション 有機基板への金属付着方法
JPS61287155A (ja) * 1985-06-14 1986-12-17 Hitachi Ltd 半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
US5104734A (en) 1992-04-14
JPH01319941A (ja) 1989-12-26
EP0344504B1 (de) 1994-03-23
JPH0639144B2 (ja) 1994-05-25
DE68914033D1 (de) 1994-04-28
EP0344504A2 (de) 1989-12-06
EP0344504A3 (de) 1991-05-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee