DE68906475T2 - Verfahren zur beschichtung eines substrats mit einer metallschicht. - Google Patents

Verfahren zur beschichtung eines substrats mit einer metallschicht.

Info

Publication number
DE68906475T2
DE68906475T2 DE89110200T DE68906475T DE68906475T2 DE 68906475 T2 DE68906475 T2 DE 68906475T2 DE 89110200 T DE89110200 T DE 89110200T DE 68906475 T DE68906475 T DE 68906475T DE 68906475 T2 DE68906475 T2 DE 68906475T2
Authority
DE
Germany
Prior art keywords
coating
substrate
metal layer
metal
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89110200T
Other languages
English (en)
Other versions
DE68906475D1 (de
Inventor
Morris Anschel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68906475D1 publication Critical patent/DE68906475D1/de
Application granted granted Critical
Publication of DE68906475T2 publication Critical patent/DE68906475T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
DE89110200T 1988-07-06 1989-06-06 Verfahren zur beschichtung eines substrats mit einer metallschicht. Expired - Fee Related DE68906475T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21584788A 1988-07-06 1988-07-06

Publications (2)

Publication Number Publication Date
DE68906475D1 DE68906475D1 (de) 1993-06-17
DE68906475T2 true DE68906475T2 (de) 1993-11-04

Family

ID=22804647

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89110200T Expired - Fee Related DE68906475T2 (de) 1988-07-06 1989-06-06 Verfahren zur beschichtung eines substrats mit einer metallschicht.

Country Status (4)

Country Link
US (1) US5372685A (de)
EP (1) EP0351533B1 (de)
JP (1) JP2602329B2 (de)
DE (1) DE68906475T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0382188A (ja) * 1989-08-25 1991-04-08 Kyocera Corp セラミック配線基板の製造方法
US5461203A (en) * 1991-05-06 1995-10-24 International Business Machines Corporation Electronic package including lower water content polyimide film
DE4130518A1 (de) * 1991-09-13 1993-03-18 Hoechst Ag Verfahren zur herstellung eines haftfesten verbundes von kupferschichten und aluminiumoxidkeramik ohne einsatz von haftvermittlern
US5763024A (en) * 1995-02-28 1998-06-09 Transfer Print Foils, Inc. Trim component including a metalized polyester film and substrate having curled edges
US6171714B1 (en) 1996-04-18 2001-01-09 Gould Electronics Inc. Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
CA2327801A1 (en) * 2000-03-21 2001-09-21 Rocky L. Hilburn Copper on polymer component having improved adhesion
US6875318B1 (en) 2000-04-11 2005-04-05 Metalbond Technologies, Llc Method for leveling and coating a substrate and an article formed thereby
ES2239907B1 (es) 2004-03-26 2006-12-01 Analisi Tecnologica Innovadora Per A Processos Industrials Competitius, S.L. Procedimiento de cromado.
KR20140142123A (ko) * 2013-05-31 2014-12-11 삼성전자주식회사 다층박막의 제조방법, 다층박막이 형성된 부재, 및 이를 포함하는 전자제품.

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR793015A (fr) * 1934-10-16 1936-01-15 Dispersion Cathodique S A Perfectionnements apportés à la dispersion cathodique
DE1514668B2 (de) * 1966-01-19 1977-05-12 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von chrom- silber-kontakten auf halbleiterbauelementen
JPS56118209A (en) * 1980-02-20 1981-09-17 Hitachi Ltd Conductor
US4342632A (en) * 1981-05-01 1982-08-03 The United States Of America As Represented By The Secretary Of The Army Method of metallizing a ceramic substrate
US4386116A (en) * 1981-12-24 1983-05-31 International Business Machines Corporation Process for making multilayer integrated circuit substrate
US4444848A (en) * 1982-01-04 1984-04-24 Western Electric Co., Inc. Adherent metal coatings on rubber-modified epoxy resin surfaces
US4517051A (en) * 1982-12-27 1985-05-14 Ibm Corporation Multi-layer flexible film module
US4544571A (en) * 1984-02-13 1985-10-01 Pennwalt Corporation Method of manufacture of EMI/RFI vapor deposited composite shielding panel
US4666874A (en) * 1984-10-01 1987-05-19 Mobil Oil Corporation Stereodifferentiating hydrocarbon conversion zeolite catalysts
US4629662A (en) * 1984-11-19 1986-12-16 International Business Machines Corporation Bonding metal to ceramic like materials

Also Published As

Publication number Publication date
DE68906475D1 (de) 1993-06-17
EP0351533A1 (de) 1990-01-24
US5372685A (en) 1994-12-13
JP2602329B2 (ja) 1997-04-23
EP0351533B1 (de) 1993-05-12
JPH0247257A (ja) 1990-02-16

Similar Documents

Publication Publication Date Title
DE3579067D1 (de) Verfahren zur beschichtung eines substrates mit thermoplastischen ttinten, und beschichtungszusammensetzung.
DE3851191D1 (de) Verfahren zur Beschichtung eines Substrates.
DE69232607D1 (de) Verfahren zur Beschichtung eines Substrates mit einem Kiesel-Vorprodukt
DE69227373T2 (de) Verfahren zum beschichten eines substrats mit einer gegen umwelteinflüsse ätzresistenten zweikomponenten- beschichtungszusammensetzung, sowie daraus hergestellte beschichtung
DE69633423D1 (de) Verfahren zur Herstellung eines mit einer dünnen ferroelektrischen Schicht überdeckten Substrats
AT374923B (de) Verfahren zur herstellung einer freitragenden schicht auf einem plaettchenfoermigen, hochtemperaturbestaendigen substrat
DE69109224T2 (de) Verfahren zum Bedecken eines Substrates mit einer Oberflächenschicht aus der Dampfphase und Vorrichtung zum Anwenden eines derartigen Verfahrens.
DE69426791T2 (de) Verfahren zur Bearbeitung der Oberfläche eines beschichteten Substrats
DE3750217D1 (de) Verfahren zur Herstellung eines Halbleiterbauelementes durch Auftragen einer Metallschicht.
ATA368784A (de) Verfahren zum beschichten eines substrats mit einem film einer beschichtungsmasse
DE3480940D1 (de) Verfahren zur abscheidung eines metalles auf einer oberflaeche.
DE68917477T2 (de) Verfahren zur schaffung einer grenzschicht zwischen substrat und atmosphäre.
DE3781312D1 (de) Verfahren zur haftung einer schicht aus einem metall mit hohem schmelzpunkt auf einem substrat.
DE3678150D1 (de) Biegsame grundierfarbenzusammensetzung und verfahren zur beschichtung eines untergrundes mit einem biegsamen mehrschichtsystem.
DE69333173D1 (de) Verfahren zur Herstellung eines Substrates mit einer Halbleiterschicht auf einem Isolator
DE69317715D1 (de) Verfahren zur Wiedergewinnung eines mit einer Lackschicht beschichteten Kunststoffgegenstandes
DE3667498D1 (de) Verfahren zur metallbeschichtung eines organischen substrates.
DE68906475T2 (de) Verfahren zur beschichtung eines substrats mit einer metallschicht.
DE69114595D1 (de) Verfahren zur Bestimmung der vollständigen Abtragung einer Dünnschicht auf einem nichtplanaren Substrat.
DE69403748T2 (de) Verfahren zum Verbinden einer Tintenaufnahmeschicht auf einem vorgegebenen Substrat
DE69208109D1 (de) Verfahren zur Herstellung eines metallischen Trägers mit einer supraleitenden Schicht
DE69511572D1 (de) Verfahren zur beschichtung eines substrates mit einer pulverlackzusammensetzung
ATA80184A (de) Verfahren zum beschichten eines substrates mit einem film einer beschichtungsmasse
DE3482478D1 (de) Verfahren zum beschichten eines substrats mit einer silicon-trennbeschichtung.
DE68921253D1 (de) Verfahren zur Abscheidung einer dünnen Supraleiterschicht.

Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee