DE3302206A1 - Integrierte halbleiterschaltung - Google Patents

Integrierte halbleiterschaltung

Info

Publication number
DE3302206A1
DE3302206A1 DE19833302206 DE3302206A DE3302206A1 DE 3302206 A1 DE3302206 A1 DE 3302206A1 DE 19833302206 DE19833302206 DE 19833302206 DE 3302206 A DE3302206 A DE 3302206A DE 3302206 A1 DE3302206 A1 DE 3302206A1
Authority
DE
Germany
Prior art keywords
semiconductor
layer
semiconductor layer
conductor track
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19833302206
Other languages
German (de)
English (en)
Inventor
Shizuo Takasaki Gunma Kondoh
Setsuo Ogura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3302206A1 publication Critical patent/DE3302206A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/535Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/65Integrated injection logic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
DE19833302206 1982-01-25 1983-01-24 Integrierte halbleiterschaltung Withdrawn DE3302206A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57008932A JPS58127363A (ja) 1982-01-25 1982-01-25 半導体集積回路装置

Publications (1)

Publication Number Publication Date
DE3302206A1 true DE3302206A1 (de) 1983-08-04

Family

ID=11706432

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833302206 Withdrawn DE3302206A1 (de) 1982-01-25 1983-01-24 Integrierte halbleiterschaltung

Country Status (9)

Country Link
JP (1) JPS58127363A (enrdf_load_stackoverflow)
KR (1) KR910002036B1 (enrdf_load_stackoverflow)
DE (1) DE3302206A1 (enrdf_load_stackoverflow)
FR (1) FR2520555B1 (enrdf_load_stackoverflow)
GB (2) GB2113915B (enrdf_load_stackoverflow)
HK (2) HK70687A (enrdf_load_stackoverflow)
IT (1) IT1160470B (enrdf_load_stackoverflow)
MY (1) MY8700613A (enrdf_load_stackoverflow)
SG (1) SG36587G (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3926011B2 (ja) 1997-12-24 2007-06-06 株式会社ルネサステクノロジ 半導体装置の設計方法
JP4292668B2 (ja) * 2000-01-31 2009-07-08 富士ゼロックス株式会社 発光サイリスタアレイ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2313777A1 (fr) * 1975-04-03 1976-12-31 Ibm Agencement semi-conducteur integre
DE1949484B2 (de) * 1969-10-01 1978-02-23 Ibm Deutschland Gmbh, 7000 Stuttgart Leitungskreuzung fuer monolithisch integrierte halbleiterschaltungen und deren verwendung in einer speichermatrix
DE2800363A1 (de) * 1977-01-17 1978-07-20 Philips Nv Halbleiteranordnung und verfahren zu deren herstellung
DE3143565A1 (de) * 1981-11-03 1983-05-11 International Microcircuits Inc., 95051 Santa Clara, Calif. Integrierte schaltung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443176A (en) * 1966-03-31 1969-05-06 Ibm Low resistivity semiconductor underpass connector and fabrication method therefor
FR2244262B1 (enrdf_load_stackoverflow) * 1973-09-13 1978-09-29 Radiotechnique Compelec
JPS5264830A (en) * 1975-11-25 1977-05-28 Hitachi Ltd Power source supply system of integrated injection logical circuit
US4228450A (en) * 1977-10-25 1980-10-14 International Business Machines Corporation Buried high sheet resistance structure for high density integrated circuits with reach through contacts

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1949484B2 (de) * 1969-10-01 1978-02-23 Ibm Deutschland Gmbh, 7000 Stuttgart Leitungskreuzung fuer monolithisch integrierte halbleiterschaltungen und deren verwendung in einer speichermatrix
FR2313777A1 (fr) * 1975-04-03 1976-12-31 Ibm Agencement semi-conducteur integre
DE2800363A1 (de) * 1977-01-17 1978-07-20 Philips Nv Halbleiteranordnung und verfahren zu deren herstellung
DE3143565A1 (de) * 1981-11-03 1983-05-11 International Microcircuits Inc., 95051 Santa Clara, Calif. Integrierte schaltung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
US-Z: IBM Technical Disclosure Bulletin, Bd.19, Dez. 1976, S.2598-99 *

Also Published As

Publication number Publication date
GB8301731D0 (en) 1983-02-23
MY8700613A (en) 1987-12-31
GB8403188D0 (en) 1984-03-14
SG36587G (en) 1987-07-24
KR840003536A (ko) 1984-09-08
FR2520555A1 (fr) 1983-07-29
GB2113915B (en) 1985-11-20
HK70687A (en) 1987-10-09
GB2113915A (en) 1983-08-10
KR910002036B1 (ko) 1991-03-30
HK71287A (en) 1987-10-09
GB2133622A (en) 1984-07-25
JPH0334661B2 (enrdf_load_stackoverflow) 1991-05-23
JPS58127363A (ja) 1983-07-29
IT1160470B (it) 1987-03-11
GB2133622B (en) 1985-11-20
FR2520555B1 (fr) 1987-02-20
IT8319236A0 (it) 1983-01-21

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Legal Events

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OR8 Request for search as to paragraph 43 lit. 1 sentence 1 patent law
8141 Disposal/no request for examination