DE3153389C2 - - Google Patents

Info

Publication number
DE3153389C2
DE3153389C2 DE19813153389 DE3153389A DE3153389C2 DE 3153389 C2 DE3153389 C2 DE 3153389C2 DE 19813153389 DE19813153389 DE 19813153389 DE 3153389 A DE3153389 A DE 3153389A DE 3153389 C2 DE3153389 C2 DE 3153389C2
Authority
DE
Germany
Prior art keywords
arms
suction pipette
pairs
electronic component
ejector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19813153389
Other languages
German (de)
English (en)
Inventor
Josef Ing.(Grad.) 8137 Hoehenrain De Wacker
Johann 8193 Degerndorf De Melf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19813153389 priority Critical patent/DE3153389C2/de
Priority claimed from DE19813102206 external-priority patent/DE3102206A1/de
Application granted granted Critical
Publication of DE3153389C2 publication Critical patent/DE3153389C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
DE19813153389 1981-01-23 1981-01-23 Expired - Fee Related DE3153389C2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19813153389 DE3153389C2 (enrdf_load_stackoverflow) 1981-01-23 1981-01-23

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19813102206 DE3102206A1 (de) 1981-01-23 1981-01-23 Montagekopf zum montieren von elektronischen bauteilen
DE19813153389 DE3153389C2 (enrdf_load_stackoverflow) 1981-01-23 1981-01-23

Publications (1)

Publication Number Publication Date
DE3153389C2 true DE3153389C2 (enrdf_load_stackoverflow) 1992-09-17

Family

ID=25790756

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813153389 Expired - Fee Related DE3153389C2 (enrdf_load_stackoverflow) 1981-01-23 1981-01-23

Country Status (1)

Country Link
DE (1) DE3153389C2 (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2944810A1 (de) * 1978-11-09 1980-05-14 Tokyo Shibaura Electric Co Verfahren und vorrichtung zum montieren von elektronischen bauteilen
GB2049161A (en) * 1979-04-30 1980-12-17 Martin D Air circulating device for mixing room air

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2944810A1 (de) * 1978-11-09 1980-05-14 Tokyo Shibaura Electric Co Verfahren und vorrichtung zum montieren von elektronischen bauteilen
GB2049161A (en) * 1979-04-30 1980-12-17 Martin D Air circulating device for mixing room air

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