DE3134918C2 - - Google Patents

Info

Publication number
DE3134918C2
DE3134918C2 DE19813134918 DE3134918A DE3134918C2 DE 3134918 C2 DE3134918 C2 DE 3134918C2 DE 19813134918 DE19813134918 DE 19813134918 DE 3134918 A DE3134918 A DE 3134918A DE 3134918 C2 DE3134918 C2 DE 3134918C2
Authority
DE
Germany
Prior art keywords
silver
electrode
metal
substrate
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19813134918
Other languages
German (de)
English (en)
Other versions
DE3134918A1 (de
Inventor
Katsuhiko Takatsuki Jp Honjo
Hiromitsu Taki
Noriya Miyazaki Jp Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to DE19813134918 priority Critical patent/DE3134918A1/de
Publication of DE3134918A1 publication Critical patent/DE3134918A1/de
Application granted granted Critical
Publication of DE3134918C2 publication Critical patent/DE3134918C2/de
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1865—Heat
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE19813134918 1981-09-03 1981-09-03 "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben" Granted DE3134918A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19813134918 DE3134918A1 (de) 1981-09-03 1981-09-03 "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben"

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813134918 DE3134918A1 (de) 1981-09-03 1981-09-03 "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben"

Publications (2)

Publication Number Publication Date
DE3134918A1 DE3134918A1 (de) 1983-03-17
DE3134918C2 true DE3134918C2 (cs) 1991-04-11

Family

ID=6140792

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813134918 Granted DE3134918A1 (de) 1981-09-03 1981-09-03 "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben"

Country Status (1)

Country Link
DE (1) DE3134918A1 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19643912B4 (de) * 1996-10-30 2004-07-08 Infineon Technologies Ag Folienkondensator zum Einbau in eine Chipkarte

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62205615A (ja) * 1986-03-05 1987-09-10 株式会社村田製作所 セラミツクスの金属化方法
DE3727826A1 (de) * 1987-08-20 1989-03-02 Siemens Ag Serienverschaltetes duennschicht-solarmodul aus kristallinem silizium
DE3727825A1 (de) * 1987-08-20 1989-03-02 Siemens Ag Serienverschaltetes duennschichtsolarmodul aus kristallinem silizium
JPH03281783A (ja) * 1990-03-29 1991-12-12 Vacuum Metallurgical Co Ltd 金属薄膜の形成方法
US5587111A (en) * 1990-03-29 1996-12-24 Vacuum Metallurgical Co., Ltd. Metal paste, process for producing same and method of making a metallic thin film using the metal paste

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE355443C (de) * 1921-11-10 1922-06-27 Quintin Marino Verfahren zum UEberziehen von keramischen und aehnlichen Waren mit einem festhaftenden metallischen UEberzug
DE828672C (de) * 1942-02-27 1952-01-21 Eugen Duerrwaechter Dr Ing Verfahren zur Herstellung von Versilberungspraeparaten
DE926459C (de) * 1952-10-06 1955-04-18 Philips Nv Verfahren zum Oberflaechen-Versilbern
US2968583A (en) * 1957-04-25 1961-01-17 Western Electric Co Capacitor sections and methods of making the same
JPS4122023B1 (cs) * 1963-02-14 1966-12-22
BE679454A (cs) * 1965-04-26 1966-09-16
US3450545A (en) * 1966-05-31 1969-06-17 Du Pont Noble metal metalizing compositions
US3859128A (en) * 1968-02-09 1975-01-07 Sprague Electric Co Composition for resistive material and method of making
DE2035945C3 (de) * 1970-07-20 1974-01-03 E.I. Du Pont De Nemours And Co., Wilmington, Del. (V.St.A.) Silbermasse und ihre Verwendung
US3801364A (en) * 1971-02-03 1974-04-02 Matsushita Electric Ind Co Ltd Method for making printed circuits which include printed resistors
DE2359432C3 (de) * 1973-11-29 1984-08-09 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Herstellung von mit Aluminium beschichteten Folien für Kondensatoren und Vorrichtung zur Durchführung des Verfahrens
US3948706A (en) * 1973-12-13 1976-04-06 International Business Machines Corporation Method for metallizing ceramic green sheets
DE2433419C3 (de) * 1974-07-11 1979-10-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Keramisches elektrisches Bauelement und Verfahren zu seiner Herstellung
DE2552181A1 (de) * 1975-11-21 1977-06-02 Licentia Gmbh Verfahren zum herstellen einer elektrisch leitenden kontaktierungsschicht
GB1556638A (en) * 1977-02-09 1979-11-28 Matsushita Electric Ind Co Ltd Method for manufacturing a ceramic electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19643912B4 (de) * 1996-10-30 2004-07-08 Infineon Technologies Ag Folienkondensator zum Einbau in eine Chipkarte

Also Published As

Publication number Publication date
DE3134918A1 (de) 1983-03-17

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8110 Request for examination paragraph 44
8128 New person/name/address of the agent

Representative=s name: RUSCHKE, H., DIPL.-ING., 8000 MUENCHEN RUSCHKE, O.

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee