DE3133584A1 - "elektrische kreiskomponente" - Google Patents
"elektrische kreiskomponente"Info
- Publication number
- DE3133584A1 DE3133584A1 DE19813133584 DE3133584A DE3133584A1 DE 3133584 A1 DE3133584 A1 DE 3133584A1 DE 19813133584 DE19813133584 DE 19813133584 DE 3133584 A DE3133584 A DE 3133584A DE 3133584 A1 DE3133584 A1 DE 3133584A1
- Authority
- DE
- Germany
- Prior art keywords
- edge
- substrate
- adjacent
- notch
- notches
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H10W90/00—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09163—Slotted edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18132980A | 1980-08-25 | 1980-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3133584A1 true DE3133584A1 (de) | 1982-07-01 |
Family
ID=22663824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19813133584 Withdrawn DE3133584A1 (de) | 1980-08-25 | 1981-08-25 | "elektrische kreiskomponente" |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5745962A (ref) |
| CA (1) | CA1151257A (ref) |
| DE (1) | DE3133584A1 (ref) |
| FR (1) | FR2489044A1 (ref) |
| GB (1) | GB2082843B (ref) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3406537A1 (de) * | 1984-02-23 | 1985-08-29 | Brown, Boveri & Cie Ag, 6800 Mannheim | Anordnung eines leistungshalbleiterbauelementes auf einem isolierenden und mit leiterbahnen versehenen substrat |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2248345B (en) * | 1990-09-27 | 1994-06-22 | Stc Plc | Edge soldering of electronic components |
| CN112074095B (zh) * | 2020-10-10 | 2021-08-31 | 黄石星河电路有限公司 | 一种四周设计0.4mm金属半孔的薄板加工方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3873890A (en) * | 1973-08-20 | 1975-03-25 | Allen Bradley Co | Terminal construction for electrical circuit device |
| JPS5089874A (ref) * | 1973-12-12 | 1975-07-18 | ||
| CA1055134A (en) * | 1975-09-02 | 1979-05-22 | Lawrence D. Radosevich | Terminal lead construction for electrical circuit substrate |
-
1981
- 1981-05-26 CA CA000378327A patent/CA1151257A/en not_active Expired
- 1981-06-16 JP JP56091668A patent/JPS5745962A/ja active Pending
- 1981-08-18 GB GB8125160A patent/GB2082843B/en not_active Expired
- 1981-08-18 FR FR8115884A patent/FR2489044A1/fr active Granted
- 1981-08-25 DE DE19813133584 patent/DE3133584A1/de not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3406537A1 (de) * | 1984-02-23 | 1985-08-29 | Brown, Boveri & Cie Ag, 6800 Mannheim | Anordnung eines leistungshalbleiterbauelementes auf einem isolierenden und mit leiterbahnen versehenen substrat |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2082843B (en) | 1984-09-19 |
| CA1151257A (en) | 1983-08-02 |
| GB2082843A (en) | 1982-03-10 |
| FR2489044B3 (ref) | 1983-06-17 |
| FR2489044A1 (fr) | 1982-02-26 |
| JPS5745962A (en) | 1982-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OAV | Publication of unexamined application with consent of applicant | ||
| 8141 | Disposal/no request for examination |