DE3041147A1 - Plaettchen-ausrichtvorrichtung - Google Patents

Plaettchen-ausrichtvorrichtung

Info

Publication number
DE3041147A1
DE3041147A1 DE19803041147 DE3041147A DE3041147A1 DE 3041147 A1 DE3041147 A1 DE 3041147A1 DE 19803041147 DE19803041147 DE 19803041147 DE 3041147 A DE3041147 A DE 3041147A DE 3041147 A1 DE3041147 A1 DE 3041147A1
Authority
DE
Germany
Prior art keywords
plate
alignment
roller
platelet
rollers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19803041147
Other languages
German (de)
English (en)
Inventor
Masao Yokohama Kanagawa Kosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE3041147A1 publication Critical patent/DE3041147A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H10P72/3602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Control Of Position Or Direction (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19803041147 1979-11-05 1980-10-31 Plaettchen-ausrichtvorrichtung Ceased DE3041147A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14293779A JPS5666036A (en) 1979-11-05 1979-11-05 Wafer positioner

Publications (1)

Publication Number Publication Date
DE3041147A1 true DE3041147A1 (de) 1981-05-14

Family

ID=15327105

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803041147 Ceased DE3041147A1 (de) 1979-11-05 1980-10-31 Plaettchen-ausrichtvorrichtung

Country Status (3)

Country Link
US (1) US4441853A (enExample)
JP (1) JPS5666036A (enExample)
DE (1) DE3041147A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3702775A1 (de) * 1987-01-30 1988-08-11 Leybold Ag Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
US5058228A (en) * 1990-10-15 1991-10-22 Illinois Tool Works Inc. Machine and methods for collating wire nails having shank keyways
EP0354586A3 (en) * 1988-08-12 1991-11-27 Shin-Etsu Handotai Company Limited Method of automatically chamfering a wafer and apparatus therefor

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189534U (ja) * 1982-06-10 1983-12-16 日立電子エンジニアリング株式会社 ウエハの位置合わせ装置
WO1984004739A1 (en) * 1983-05-23 1984-12-06 Asq Boats Inc Universal flat orienter for semiconductor wafers
US4662811A (en) * 1983-07-25 1987-05-05 Hayden Thomas J Method and apparatus for orienting semiconductor wafers
US4820930A (en) * 1984-06-20 1989-04-11 Canon Kabushiki Kaisha Photomask positioning device
US4887904A (en) * 1985-08-23 1989-12-19 Canon Kabushiki Kaisha Device for positioning a semi-conductor wafer
US4806057A (en) * 1986-04-22 1989-02-21 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
US4813840A (en) * 1987-08-11 1989-03-21 Applied Materials, Inc. Method of aligning wafers and device therefor
JPH01200028A (ja) * 1988-02-04 1989-08-11 Nippon Denso Co Ltd 燃料噴射時期調整装置
US4907931A (en) * 1988-05-18 1990-03-13 Prometrix Corporation Apparatus for handling semiconductor wafers
ES2043970T3 (es) * 1988-07-15 1994-01-01 Balzers Hochvakuum Dispositivo de fijacion para un disco, asi como su aplicacion.
US5052886A (en) * 1988-12-20 1991-10-01 Texas Instruments Incorporated Semiconductor wafer orientation device
JPH02178947A (ja) * 1988-12-29 1990-07-11 Fujitsu Ltd 半導体ウェーハのノッチ合わせ機構
US5466117A (en) * 1993-06-10 1995-11-14 Xilinx, Inc. Device and method for programming multiple arrays of semiconductor devices
US5551829A (en) * 1995-10-11 1996-09-03 H-Square Corporation Notch finder having a flexible alignment rod
US5662452A (en) * 1996-08-26 1997-09-02 H-Square Corporation Apparatus and method of aligning notches using a free-floating rod
TW412817B (en) 1998-06-19 2000-11-21 Matsushita Electric Industrial Co Ltd A bump bonding apparatus and method
US6204917B1 (en) 1998-09-22 2001-03-20 Kla-Tencor Corporation Backside contamination inspection device
FR2785886A1 (fr) 1998-11-13 2000-05-19 Cybernetix Rech Procede et dispositif d'orientation de disques en materiau semi-conducteur
US6270307B1 (en) * 1999-01-25 2001-08-07 Chartered Semiconductor Manufacturing Company Method for aligning wafers in a cassette
JP3245833B2 (ja) * 1999-07-08 2002-01-15 日本エー・エス・エム株式会社 半導体基板アライナー装置および方法
JP6842300B2 (ja) * 2013-03-15 2021-03-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板位置アライナ
US10133186B2 (en) * 2016-10-20 2018-11-20 Mapper Lithography Ip B.V. Method and apparatus for aligning substrates on a substrate support unit
CN107673045A (zh) * 2017-09-15 2018-02-09 杨春花 一种改进型翻转装置
JP6712698B2 (ja) * 2017-09-29 2020-06-24 株式会社むつ家電特機 縦ロープへの貝取付け方法と縦ロープへの貝取付け装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3297134A (en) * 1966-02-10 1967-01-10 Ronald F Pastuszak Orienting device for discs and the like articles
US3865254A (en) * 1973-05-21 1975-02-11 Kasker Instr Inc Prealignment system for an optical alignment and exposure instrument
US3982627A (en) * 1974-03-13 1976-09-28 Canon Kabushiki Kaisha Automatic wafer orienting apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3820647A (en) * 1973-09-14 1974-06-28 Texas Instruments Inc Slice pre aligner
JPS50122789A (enExample) * 1974-03-15 1975-09-26
JPS5749390Y2 (enExample) * 1977-03-30 1982-10-29
JPS53122369A (en) * 1977-04-01 1978-10-25 Hitachi Ltd Automatic alignment unit for wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3297134A (en) * 1966-02-10 1967-01-10 Ronald F Pastuszak Orienting device for discs and the like articles
US3865254A (en) * 1973-05-21 1975-02-11 Kasker Instr Inc Prealignment system for an optical alignment and exposure instrument
US3982627A (en) * 1974-03-13 1976-09-28 Canon Kabushiki Kaisha Automatic wafer orienting apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3702775A1 (de) * 1987-01-30 1988-08-11 Leybold Ag Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
EP0354586A3 (en) * 1988-08-12 1991-11-27 Shin-Etsu Handotai Company Limited Method of automatically chamfering a wafer and apparatus therefor
US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
US5058228A (en) * 1990-10-15 1991-10-22 Illinois Tool Works Inc. Machine and methods for collating wire nails having shank keyways

Also Published As

Publication number Publication date
US4441853A (en) 1984-04-10
JPS6333297B2 (enExample) 1988-07-05
JPS5666036A (en) 1981-06-04

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8131 Rejection