DE3030270C2 - - Google Patents

Info

Publication number
DE3030270C2
DE3030270C2 DE19803030270 DE3030270A DE3030270C2 DE 3030270 C2 DE3030270 C2 DE 3030270C2 DE 19803030270 DE19803030270 DE 19803030270 DE 3030270 A DE3030270 A DE 3030270A DE 3030270 C2 DE3030270 C2 DE 3030270C2
Authority
DE
Germany
Prior art keywords
deposition
acid
nickel
complexing agent
cobalt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19803030270
Other languages
German (de)
English (en)
Other versions
DE3030270A1 (de
Inventor
Rolf 8941 Buxheim De Knoblauch
Robert Dr.-Ing. 7900 Ulm De Ostwald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19803030270 priority Critical patent/DE3030270A1/de
Publication of DE3030270A1 publication Critical patent/DE3030270A1/de
Application granted granted Critical
Publication of DE3030270C2 publication Critical patent/DE3030270C2/de
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE19803030270 1980-08-09 1980-08-09 Verfahren zur chemisch-stromlosen abscheidung ternaerer nickel-kobalt-phosphor-schichten Granted DE3030270A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19803030270 DE3030270A1 (de) 1980-08-09 1980-08-09 Verfahren zur chemisch-stromlosen abscheidung ternaerer nickel-kobalt-phosphor-schichten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803030270 DE3030270A1 (de) 1980-08-09 1980-08-09 Verfahren zur chemisch-stromlosen abscheidung ternaerer nickel-kobalt-phosphor-schichten

Publications (2)

Publication Number Publication Date
DE3030270A1 DE3030270A1 (de) 1982-04-01
DE3030270C2 true DE3030270C2 (enExample) 1988-04-07

Family

ID=6109324

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803030270 Granted DE3030270A1 (de) 1980-08-09 1980-08-09 Verfahren zur chemisch-stromlosen abscheidung ternaerer nickel-kobalt-phosphor-schichten

Country Status (1)

Country Link
DE (1) DE3030270A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023101628B4 (de) 2023-01-24 2024-08-08 Carl Zeiss Microscopy Gmbh Teilchenstrahlmikroskop
DE102023103317A1 (de) * 2023-02-10 2024-08-14 Plasma Innovations GmbH Verfahren zur Herstellung einer lötfähigen Leiterplatte mit Anschlussflächen aus Aluminium

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1280622B (de) * 1962-05-25 1968-10-17 Ibm Verfahren zur Herstellung einer Magnetschicht aus einer Kobalt-Nickel-Legierung auf einem Traeger durch stromlose Abscheidung
JPS5428831B2 (enExample) * 1973-05-18 1979-09-19
US3932694A (en) * 1974-04-04 1976-01-13 Tatsuta Densen Kabushiki Kaisha Pre-treatment method for electroless plating for producing a metal film as resistor
DE2634232C2 (de) * 1976-07-30 1984-10-18 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur stromlosen reduktiven Abscheidung von Nickel-Phosphor-Schichten, insbesondere für elektrische Widerstände

Also Published As

Publication number Publication date
DE3030270A1 (de) 1982-04-01

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Legal Events

Date Code Title Description
8101 Request for examination as to novelty
8105 Search report available
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee