DE3006763A1 - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
DE3006763A1
DE3006763A1 DE19803006763 DE3006763A DE3006763A1 DE 3006763 A1 DE3006763 A1 DE 3006763A1 DE 19803006763 DE19803006763 DE 19803006763 DE 3006763 A DE3006763 A DE 3006763A DE 3006763 A1 DE3006763 A1 DE 3006763A1
Authority
DE
Germany
Prior art keywords
area
base plate
plastic
pair
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19803006763
Other languages
German (de)
English (en)
Inventor
Susumu Okikawa
Hiromichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3006763A1 publication Critical patent/DE3006763A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/433—Shapes or dispositions of deformation-absorbing parts, e.g. leads having meandering shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19803006763 1979-02-23 1980-02-22 Halbleiteranordnung Withdrawn DE3006763A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983079A JPS55113349A (en) 1979-02-23 1979-02-23 Semiconductor device

Publications (1)

Publication Number Publication Date
DE3006763A1 true DE3006763A1 (de) 1980-09-04

Family

ID=12010196

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803006763 Withdrawn DE3006763A1 (de) 1979-02-23 1980-02-22 Halbleiteranordnung

Country Status (5)

Country Link
US (1) US4326215A (enExample)
JP (1) JPS55113349A (enExample)
DE (1) DE3006763A1 (enExample)
GB (1) GB2043343B (enExample)
IT (1) IT1141373B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133655A (en) * 1981-02-10 1982-08-18 Pioneer Electronic Corp Lead frame
JPS58187172U (ja) * 1982-06-08 1983-12-12 三菱電機株式会社 混成集積回路
IT8224533A0 (it) * 1982-12-01 1982-12-01 Ora Sgs Microelettronica Spa S Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore.
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
IT1201836B (it) * 1986-07-17 1989-02-02 Sgs Microelettronica Spa Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico
IT1250405B (it) * 1991-01-31 1995-04-07 Sgs Thomson Microelectronics Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa
KR930009031A (ko) * 1991-10-18 1993-05-22 김광호 반도체 패키지
US5444909A (en) * 1993-12-29 1995-08-29 Intel Corporation Method of making a drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
TW265430B (en) * 1994-06-30 1995-12-11 Intel Corp Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
JP7607430B2 (ja) * 2020-10-12 2024-12-27 株式会社マキタ 作業機

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
DE1764382A1 (de) * 1967-06-21 1971-07-08 Nippon Denso Co Halbleitergleichrichter
US3679946A (en) * 1970-07-06 1972-07-25 Gen Motors Corp Strip mounted semiconductor device
US3729573A (en) * 1971-01-25 1973-04-24 Motorola Inc Plastic encapsulation of semiconductor devices
US3751724A (en) * 1972-04-28 1973-08-07 C Mcgrath Encapsulated electrical component
US3836825A (en) * 1972-10-06 1974-09-17 Rca Corp Heat dissipation for power integrated circuit devices
US3786317A (en) * 1972-11-09 1974-01-15 Bell Telephone Labor Inc Microelectronic circuit package
US4125740A (en) * 1973-09-26 1978-11-14 Sgs-Ates Componenti Elettronici S.P.A. Resin-encased microelectronic module
US4048670A (en) * 1975-06-30 1977-09-13 Sprague Electric Company Stress-free hall-cell package
JPS5253665A (en) * 1975-10-29 1977-04-30 Hitachi Ltd Semiconductor device
JPS52129379A (en) * 1976-04-23 1977-10-29 Hitachi Ltd Plastic molded semiconductor device
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby

Also Published As

Publication number Publication date
IT8020125A0 (it) 1980-02-22
GB2043343A (en) 1980-10-01
JPS6150387B2 (enExample) 1986-11-04
US4326215A (en) 1982-04-20
GB2043343B (en) 1983-02-02
IT1141373B (it) 1986-10-01
JPS55113349A (en) 1980-09-01

Similar Documents

Publication Publication Date Title
DE4445541B4 (de) Kühlkörperbefestigungseinrichtung
DE3913221C2 (de) Halbleiteranordnung mit Leiterrahmen und Formharzgehäuse
DE102006047989B4 (de) Leistungshalbleitervorrichtung und Verfahren zu deren Herstellung
DE102014104399B4 (de) Halbleiterchipgehäuse umfassend einen Leadframe
DE69304304T2 (de) Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke
DE69421592T2 (de) Verfahren zur Herstellung einer Halbleitervorrichtung
DE102008046095B4 (de) Verfahren zum vereinzeln eines halbleiterbausteins
DE10392365T5 (de) Halbleitervorrichtung mit einem Halbleiterchip
DE2636450A1 (de) Halbleiter-leitungsrahmen
DE10129388A1 (de) Elektronisches Bauteil und Verfahren zu seiner Herstellung
DE3605491A1 (de) Reihenanordnung elektronischer bauelemente
DE3300693A1 (de) Halbleiteranordnung und verfahren zu ihrer herstellung
DE69212902T2 (de) Halbleiteranordnung mit Halterung und Verfahren zum Montieren von Halbleiteranordnungen mit Halterung
DE2314247B2 (de) Halbleiteranordnung mit einer biegsamen isolierenden Folie
DE1951583A1 (de) Halbleitervorrichtungen mit einem laenglichen Koerper aus formbarem Material
DE3006763A1 (de) Halbleiteranordnung
DE10335622A1 (de) Harzversiegelte Halbleiterbaugruppe
DE112016007485T5 (de) Halbleitervorrichtung, Steuervorrichtung, und Verfahren zur Herstellung der Halbleitervorrichtung
DE4130899C2 (de) Halbleitervorrichtung
DE4430022C2 (de) Elektronisches Bauelement in Kunstharzgehäuse
DE69322140T2 (de) Halbleiterpackung
DE102020211500A1 (de) Halbleitervorrichtung
CH675033A5 (enExample)
DE10053389A1 (de) Verbindungsstruktur für elektrische Komponenten einer Leiterplatte
DE10297264B4 (de) Halbleitervorrichtung und Verfahren zu deren Herstellung

Legal Events

Date Code Title Description
OAM Search report available
OC Search report available
8128 New person/name/address of the agent

Representative=s name: STREHL, P., DIPL.-ING. DIPL.-WIRTSCH.-ING. SCHUEBE

8141 Disposal/no request for examination