JPS52129379A - Plastic molded semiconductor device - Google Patents

Plastic molded semiconductor device

Info

Publication number
JPS52129379A
JPS52129379A JP4549876A JP4549876A JPS52129379A JP S52129379 A JPS52129379 A JP S52129379A JP 4549876 A JP4549876 A JP 4549876A JP 4549876 A JP4549876 A JP 4549876A JP S52129379 A JPS52129379 A JP S52129379A
Authority
JP
Japan
Prior art keywords
semiconductor device
plastic molded
molded semiconductor
wires
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4549876A
Other languages
Japanese (ja)
Inventor
Masao Yamaguchi
Joga Imai
Kazuo Kanbayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4549876A priority Critical patent/JPS52129379A/en
Publication of JPS52129379A publication Critical patent/JPS52129379A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To evade the breakdown of pellets and the disconnection of wires by so designing a metal support plate as to restrain the resin around semiconductor pellet and the vicinity of wires thereby reducing the displacement owing to thermal expansion of the resin.
JP4549876A 1976-04-23 1976-04-23 Plastic molded semiconductor device Pending JPS52129379A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4549876A JPS52129379A (en) 1976-04-23 1976-04-23 Plastic molded semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4549876A JPS52129379A (en) 1976-04-23 1976-04-23 Plastic molded semiconductor device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP59186307A Division JPS60105257A (en) 1984-09-07 1984-09-07 Resin seal type semiconductor device
JP18630884A Division JPS60105258A (en) 1984-09-07 1984-09-07 Resin seal type semiconductor device

Publications (1)

Publication Number Publication Date
JPS52129379A true JPS52129379A (en) 1977-10-29

Family

ID=12721058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4549876A Pending JPS52129379A (en) 1976-04-23 1976-04-23 Plastic molded semiconductor device

Country Status (1)

Country Link
JP (1) JPS52129379A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113349A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Semiconductor device
JPS59132155A (en) * 1982-12-01 1984-07-30 エス・ジ−・エス−アテス・コンポネンチ・エレツトロニシ・ソシエタ・ペル・アチオニ Vessel for semiconductor device
JPS6169154A (en) * 1985-09-20 1986-04-09 Hitachi Ltd Resin mold type power electronic device
WO1996036074A1 (en) * 1995-05-11 1996-11-14 Rohm Co., Ltd. Semiconductor device
US6373124B1 (en) 1998-08-24 2002-04-16 Matsushita Electric Industrial Co., Ltd. Lead frame and method of producing the same, and a semiconductor device using the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113349A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Semiconductor device
JPS6150387B2 (en) * 1979-02-23 1986-11-04 Hitachi Ltd
JPS59132155A (en) * 1982-12-01 1984-07-30 エス・ジ−・エス−アテス・コンポネンチ・エレツトロニシ・ソシエタ・ペル・アチオニ Vessel for semiconductor device
JPS6169154A (en) * 1985-09-20 1986-04-09 Hitachi Ltd Resin mold type power electronic device
WO1996036074A1 (en) * 1995-05-11 1996-11-14 Rohm Co., Ltd. Semiconductor device
US6242801B1 (en) 1995-05-11 2001-06-05 Rohm Co., Ltd. Semiconductor device
US6373124B1 (en) 1998-08-24 2002-04-16 Matsushita Electric Industrial Co., Ltd. Lead frame and method of producing the same, and a semiconductor device using the same

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