JPS5340095A - Low-shrinkable molding composition - Google Patents

Low-shrinkable molding composition

Info

Publication number
JPS5340095A
JPS5340095A JP11512876A JP11512876A JPS5340095A JP S5340095 A JPS5340095 A JP S5340095A JP 11512876 A JP11512876 A JP 11512876A JP 11512876 A JP11512876 A JP 11512876A JP S5340095 A JPS5340095 A JP S5340095A
Authority
JP
Japan
Prior art keywords
low
molding composition
shrinkable molding
shrinkable
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11512876A
Other languages
Japanese (ja)
Other versions
JPS5415911B2 (en
Inventor
Etsuji Iwami
Isao Uchigasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP11512876A priority Critical patent/JPS5340095A/en
Publication of JPS5340095A publication Critical patent/JPS5340095A/en
Publication of JPS5415911B2 publication Critical patent/JPS5415911B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To prepare a molding resin composition causing little cure shrinkage under any molding conditions of temperature and pressure by compounding a specific xylene-formaldehyde condensate-modified petroleum resin to an unsaturated polyester resin.
COPYRIGHT: (C)1978,JPO&Japio
JP11512876A 1976-09-24 1976-09-24 Low-shrinkable molding composition Granted JPS5340095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11512876A JPS5340095A (en) 1976-09-24 1976-09-24 Low-shrinkable molding composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11512876A JPS5340095A (en) 1976-09-24 1976-09-24 Low-shrinkable molding composition

Publications (2)

Publication Number Publication Date
JPS5340095A true JPS5340095A (en) 1978-04-12
JPS5415911B2 JPS5415911B2 (en) 1979-06-18

Family

ID=14654951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11512876A Granted JPS5340095A (en) 1976-09-24 1976-09-24 Low-shrinkable molding composition

Country Status (1)

Country Link
JP (1) JPS5340095A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100490A (en) * 1978-01-25 1979-08-08 Hitachi Chem Co Ltd Electrical insulating resin composition
JP2008036184A (en) * 2006-08-08 2008-02-21 Mantensha:Kk Acupressure instrument

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100490A (en) * 1978-01-25 1979-08-08 Hitachi Chem Co Ltd Electrical insulating resin composition
JPS5634963B2 (en) * 1978-01-25 1981-08-14
JP2008036184A (en) * 2006-08-08 2008-02-21 Mantensha:Kk Acupressure instrument

Also Published As

Publication number Publication date
JPS5415911B2 (en) 1979-06-18

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