IT1141373B - Dispositivo a semiconduttore - Google Patents

Dispositivo a semiconduttore

Info

Publication number
IT1141373B
IT1141373B IT20125/80A IT2012580A IT1141373B IT 1141373 B IT1141373 B IT 1141373B IT 20125/80 A IT20125/80 A IT 20125/80A IT 2012580 A IT2012580 A IT 2012580A IT 1141373 B IT1141373 B IT 1141373B
Authority
IT
Italy
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
IT20125/80A
Other languages
English (en)
Italian (it)
Other versions
IT8020125A0 (it
Inventor
Hiromichi Suzuki
Susumu Okikawa
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8020125A0 publication Critical patent/IT8020125A0/it
Application granted granted Critical
Publication of IT1141373B publication Critical patent/IT1141373B/it

Links

Classifications

    • H10W70/421—
    • H10W40/778—
    • H10W70/20—
    • H10W70/433—
    • H10W74/114—
    • H10W74/127—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/932—
    • H10W90/756—
IT20125/80A 1979-02-23 1980-02-22 Dispositivo a semiconduttore IT1141373B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983079A JPS55113349A (en) 1979-02-23 1979-02-23 Semiconductor device

Publications (2)

Publication Number Publication Date
IT8020125A0 IT8020125A0 (it) 1980-02-22
IT1141373B true IT1141373B (it) 1986-10-01

Family

ID=12010196

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20125/80A IT1141373B (it) 1979-02-23 1980-02-22 Dispositivo a semiconduttore

Country Status (5)

Country Link
US (1) US4326215A (enExample)
JP (1) JPS55113349A (enExample)
DE (1) DE3006763A1 (enExample)
GB (1) GB2043343B (enExample)
IT (1) IT1141373B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133655A (en) * 1981-02-10 1982-08-18 Pioneer Electronic Corp Lead frame
JPS58187172U (ja) * 1982-06-08 1983-12-12 三菱電機株式会社 混成集積回路
IT8224533A0 (it) * 1982-12-01 1982-12-01 Ora Sgs Microelettronica Spa S Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore.
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
IT1201836B (it) * 1986-07-17 1989-02-02 Sgs Microelettronica Spa Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico
IT1250405B (it) * 1991-01-31 1995-04-07 Sgs Thomson Microelectronics Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa
KR930009031A (ko) * 1991-10-18 1993-05-22 김광호 반도체 패키지
US5444909A (en) * 1993-12-29 1995-08-29 Intel Corporation Method of making a drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
TW265430B (en) * 1994-06-30 1995-12-11 Intel Corp Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
JP7607430B2 (ja) * 2020-10-12 2024-12-27 株式会社マキタ 作業機

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
DE1764382A1 (de) * 1967-06-21 1971-07-08 Nippon Denso Co Halbleitergleichrichter
US3679946A (en) * 1970-07-06 1972-07-25 Gen Motors Corp Strip mounted semiconductor device
US3729573A (en) * 1971-01-25 1973-04-24 Motorola Inc Plastic encapsulation of semiconductor devices
US3751724A (en) * 1972-04-28 1973-08-07 C Mcgrath Encapsulated electrical component
US3836825A (en) * 1972-10-06 1974-09-17 Rca Corp Heat dissipation for power integrated circuit devices
US3786317A (en) * 1972-11-09 1974-01-15 Bell Telephone Labor Inc Microelectronic circuit package
US4125740A (en) * 1973-09-26 1978-11-14 Sgs-Ates Componenti Elettronici S.P.A. Resin-encased microelectronic module
US4048670A (en) * 1975-06-30 1977-09-13 Sprague Electric Company Stress-free hall-cell package
JPS5253665A (en) * 1975-10-29 1977-04-30 Hitachi Ltd Semiconductor device
JPS52129379A (en) * 1976-04-23 1977-10-29 Hitachi Ltd Plastic molded semiconductor device
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby

Also Published As

Publication number Publication date
JPS6150387B2 (enExample) 1986-11-04
IT8020125A0 (it) 1980-02-22
GB2043343B (en) 1983-02-02
JPS55113349A (en) 1980-09-01
US4326215A (en) 1982-04-20
GB2043343A (en) 1980-10-01
DE3006763A1 (de) 1980-09-04

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19950224