DE2950450A1 - Auf gedruckter schaltungsplatte befestigte elektronische schaltungsanordnung - Google Patents
Auf gedruckter schaltungsplatte befestigte elektronische schaltungsanordnungInfo
- Publication number
- DE2950450A1 DE2950450A1 DE19792950450 DE2950450A DE2950450A1 DE 2950450 A1 DE2950450 A1 DE 2950450A1 DE 19792950450 DE19792950450 DE 19792950450 DE 2950450 A DE2950450 A DE 2950450A DE 2950450 A1 DE2950450 A1 DE 2950450A1
- Authority
- DE
- Germany
- Prior art keywords
- electronic circuit
- leadless
- arrangement according
- circuit arrangement
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 18
- 239000004840 adhesive resin Substances 0.000 claims description 7
- 229920006223 adhesive resin Polymers 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 230000010354 integration Effects 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 3
- 240000002834 Paulownia tomentosa Species 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- BHMLFPOTZYRDKA-IRXDYDNUSA-N (2s)-2-[(s)-(2-iodophenoxy)-phenylmethyl]morpholine Chemical compound IC1=CC=CC=C1O[C@@H](C=1C=CC=CC=1)[C@H]1OCCNC1 BHMLFPOTZYRDKA-IRXDYDNUSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101000927268 Hyas araneus Arasin 1 Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15781778A JPS5582487A (en) | 1978-12-18 | 1978-12-18 | Electronic circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2950450A1 true DE2950450A1 (de) | 1980-07-03 |
Family
ID=15657940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19792950450 Withdrawn DE2950450A1 (de) | 1978-12-18 | 1979-12-14 | Auf gedruckter schaltungsplatte befestigte elektronische schaltungsanordnung |
Country Status (6)
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0263943A1 (en) * | 1986-09-15 | 1988-04-20 | International Business Machines Corporation | A method of soldering leaded and surface-mountable components to a printed circuit board |
EP0249277A3 (en) * | 1986-06-07 | 1989-07-19 | Philips Patentverwaltung Gmbh | Passive electrical component |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5724775U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1980-07-17 | 1982-02-08 | ||
GB2129223A (en) * | 1982-10-09 | 1984-05-10 | Welwyn Electronics Ltd | Printed circuit boards |
GB2147148A (en) * | 1983-09-27 | 1985-05-01 | John Patrick Burke | Electronic circuit assembly |
JPS61210601A (ja) * | 1985-03-14 | 1986-09-18 | 進工業株式会社 | チツプ抵抗器 |
FR2584887A1 (fr) * | 1985-07-12 | 1987-01-16 | Thomson Semi Conducteurs | Boitier bipole pour composant en surface et conditionnement de boitiers selon l'invention |
US4801904A (en) * | 1986-01-14 | 1989-01-31 | Murata Manufacturing Co., Ltd. | Chip-like LC filter |
US4755785A (en) * | 1987-01-29 | 1988-07-05 | Bel Fuse Inc. | Surface mounted fuse assembly |
DE4126913A1 (de) * | 1991-08-14 | 1993-02-18 | Siemens Ag | Verfahren zum beloten und montieren von leiterplatten mit bauelementen |
JP3152834B2 (ja) * | 1993-06-24 | 2001-04-03 | 株式会社東芝 | 電子回路装置 |
JP7390969B2 (ja) | 2020-05-12 | 2023-12-04 | 株式会社豊田中央研究所 | 精紡機用リングおよびその製造方法 |
-
1978
- 1978-12-18 JP JP15781778A patent/JPS5582487A/ja active Granted
-
1979
- 1979-12-14 DE DE19792950450 patent/DE2950450A1/de not_active Withdrawn
- 1979-12-14 GB GB7943132A patent/GB2037489B/en not_active Expired
- 1979-12-17 IT IT42915/79A patent/IT1193457B/it active
- 1979-12-17 CA CA000342057A patent/CA1140680A/en not_active Expired
- 1979-12-18 NL NL7909108A patent/NL7909108A/nl not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0249277A3 (en) * | 1986-06-07 | 1989-07-19 | Philips Patentverwaltung Gmbh | Passive electrical component |
AU611082B2 (en) * | 1986-06-07 | 1991-06-06 | Philips Electronics N.V. | Passive electronic component |
EP0263943A1 (en) * | 1986-09-15 | 1988-04-20 | International Business Machines Corporation | A method of soldering leaded and surface-mountable components to a printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
NL7909108A (nl) | 1980-06-20 |
GB2037489B (en) | 1983-05-05 |
JPS5582487A (en) | 1980-06-21 |
JPS6149838B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-10-31 |
GB2037489A (en) | 1980-07-09 |
IT1193457B (it) | 1988-06-22 |
IT7942915A0 (it) | 1979-12-17 |
CA1140680A (en) | 1983-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE2843144C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
DE2752438C2 (de) | Träger für eine integrierte Schaltung | |
DE69800514T2 (de) | Leiterplatte mit primären und sekundären Durchgangslöchern | |
DE69207520T2 (de) | Elektrische Leiterplattenbaugruppe und Herstellungsverfahren für eine elektrische Leiterplattenbaugruppe | |
DE2354260B2 (de) | Anordnung zum dichten Packen von hochintegrierten Schaltungen | |
DE102015102528B4 (de) | Ein Verfahren zum Verbinden eines Halbleiter-Package mit einer Platine und ein Halbleiter-Package | |
DE1952569A1 (de) | Traeger fuer elektrische Bauteile und integrierte Schaltungen | |
DE2950450A1 (de) | Auf gedruckter schaltungsplatte befestigte elektronische schaltungsanordnung | |
DE4203605A1 (de) | Elektrischer verbinder | |
DE3014422A1 (de) | Auf gedruckter schaltungsplatine angeordnete elektronische schaltungsanordnung, sowie verfahren zu deren herstellung | |
DE2937886C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
DE3833329A1 (de) | Chipartige mikrosicherung | |
DE68908341T2 (de) | Verfahren zum Montieren eines elektronischen Bausteins und diesen verwendende Speicherkarte. | |
DE69206534T2 (de) | Musterstruktur einer Leiterplatte. | |
DE3689149T2 (de) | Integrierte schaltungspackungen für oberflächenmontierung mit löttragenden leitern. | |
DE2101028C2 (de) | Verfahren zum Herstellen einer Mehrzahl von Halbleiterbauelementen | |
EP0005727B1 (de) | Abfühlvorrichtung zum Feststellen des Ortes von elektrisch leitenden Punkten | |
DE69006114T2 (de) | Wicklungsträger und Verfahren zur Bildung eines Gefüges mit einer elektrischen Spule und einem elektronischen Bauteil mit Hilfe dieses Wicklungsträgers. | |
DE69609921T2 (de) | Herstellungsverfahren einer halbleiteranordnung geeignet zur oberflächenmontage | |
EP0171838B1 (de) | Umhülltes elektrisches Element | |
DE4402545A1 (de) | Verfahren zum Ausbilden diskreter Lötstellen auf entsprechenden Kontaktanschlußflächen einer Leiterplatte | |
DE3614087C2 (de) | Halbleitervorrichtungs-Baueinheit und Verfahren zum elektrischen Verbinden eines IC-Chips | |
DE2926516A1 (de) | Verfahren zur herstellung eines metallfolienwiderstandes und metallfolienwiderstand | |
DE2232794B1 (de) | Plättchenförmiges elektronisches Bauelement | |
DE3420497C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8141 | Disposal/no request for examination |