DE2804693A1 - Verfahren und vorrichtung zum bestuecken von traegerplatten mit halbleiterbauteilen - Google Patents

Verfahren und vorrichtung zum bestuecken von traegerplatten mit halbleiterbauteilen

Info

Publication number
DE2804693A1
DE2804693A1 DE19782804693 DE2804693A DE2804693A1 DE 2804693 A1 DE2804693 A1 DE 2804693A1 DE 19782804693 DE19782804693 DE 19782804693 DE 2804693 A DE2804693 A DE 2804693A DE 2804693 A1 DE2804693 A1 DE 2804693A1
Authority
DE
Germany
Prior art keywords
carrier plate
tools
carrier
devices
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19782804693
Other languages
German (de)
English (en)
Other versions
DE2804693C2 (en:Method
Inventor
Raymond Delorme
Maurice Devoille
Henri Grosjean
Joseph Hug
Pierre Sigel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull CP8 SA
Original Assignee
CII HONEYWELL BULL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CII HONEYWELL BULL filed Critical CII HONEYWELL BULL
Publication of DE2804693A1 publication Critical patent/DE2804693A1/de
Application granted granted Critical
Publication of DE2804693C2 publication Critical patent/DE2804693C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y10T29/5142—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to sever work from supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53004—Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply
    • Y10T29/53017—Web or strand-carried information supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048—Multiple station assembly or disassembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/081—With randomly actuated stopping means
    • Y10T83/088—Responsive to tool detector or work-feed-means detector
    • Y10T83/089—Responsive to tool characteristic

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
  • Drilling And Boring (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19782804693 1977-02-04 1978-02-03 Verfahren und vorrichtung zum bestuecken von traegerplatten mit halbleiterbauteilen Granted DE2804693A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7703271A FR2379909A1 (fr) 1977-02-04 1977-02-04 Procede et appareil de montage de dispositifs sur un substrat

Publications (2)

Publication Number Publication Date
DE2804693A1 true DE2804693A1 (de) 1978-08-10
DE2804693C2 DE2804693C2 (en:Method) 1992-05-21

Family

ID=9186345

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19782804693 Granted DE2804693A1 (de) 1977-02-04 1978-02-03 Verfahren und vorrichtung zum bestuecken von traegerplatten mit halbleiterbauteilen

Country Status (10)

Country Link
US (2) US4236306A (en:Method)
JP (1) JPS5397369A (en:Method)
BE (1) BE855977A (en:Method)
CA (1) CA1091818A (en:Method)
CH (1) CH628196A5 (en:Method)
DE (1) DE2804693A1 (en:Method)
FR (1) FR2379909A1 (en:Method)
GB (1) GB1590545A (en:Method)
NL (1) NL185966C (en:Method)
SE (1) SE422868B (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0020832A1 (en) * 1979-06-26 1981-01-07 Excellon Industries Pattern recognition system and method for using this system

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FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
NL8001114A (nl) * 1980-02-25 1981-09-16 Philips Nv Inrichting voor de montage van aansluitdraadloze plaat- of blokvormige elektronische onderdelen op een substraat.
FR2479641A1 (fr) * 1980-03-25 1981-10-02 Numergo Sa Atelier flexible permettant la digitalisation et le cablage de circuits electroniques hybrides
CH638072A5 (fr) * 1980-05-19 1983-08-31 Far Fab Assortiments Reunies Procede et dispositif de report d'un composant electronique sur un substrat.
FR2495836A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Machine automatique de cambrage des pattes de connexion de plaquettes de circuits integres
JPS5718392A (en) * 1980-12-29 1982-01-30 Ikegami Tsushinki Kk Position detector
JPS57128175U (en:Method) * 1981-02-03 1982-08-10
US4460421A (en) * 1982-11-29 1984-07-17 At&T Technologies, Inc. Methods of and apparatus for indexing a repetitively patterned strip past a plurality of work stations
JPS6021535A (ja) * 1983-06-30 1985-02-02 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体装置を相互接続する方法
SE454439B (sv) * 1983-07-06 1988-05-02 Tetra Pak Ab Sett och anordning att med fotoelektriska medel detektera och behorighetskontrollera gjorda styrmarkeringar pa en med tryck dekorerad lopande materialbana
US4868978A (en) * 1985-11-12 1989-09-26 Siemens Aktiengesellschaft Method and apparatus for equipping substrates with micropacks
KR910001118B1 (ko) * 1985-11-13 1991-02-23 후지쓰 가부시끼가이샤 Ic 시이트 절단 프레스 및 이를 이용한 ic 시이트 가공장치
US4787143A (en) * 1985-12-04 1988-11-29 Tdk Corporation Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor
US4731923A (en) * 1986-03-15 1988-03-22 Tdk Corporation Apparatus and method for mounting circuit element on printed circuit board
US4629420A (en) * 1986-03-26 1986-12-16 Dynapert-Htc Corp. Vapor level control for vapor processing system
JPH0636393B2 (ja) * 1987-04-15 1994-05-11 松下電器産業株式会社 電子部品の製造方法
US5251372A (en) * 1988-08-03 1993-10-12 Houghton Jon C Method and apparatus for framing a film mounted integrated circuit
US5084962A (en) * 1988-08-24 1992-02-04 Tdk Corporation Apparatus for and method of automatically mounting electronic component on printed circuit board
JPH02303100A (ja) * 1989-05-17 1990-12-17 Matsushita Electric Ind Co Ltd 部品装着方法
US5113565A (en) * 1990-07-06 1992-05-19 International Business Machines Corp. Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames
US5410124A (en) * 1993-04-01 1995-04-25 Micron Technology, Inc. Tracking sensor fixture and method for tracking reference locations on a moving semiconductor leadframe strip
US5503895A (en) * 1993-09-20 1996-04-02 Bi-Link Metal Specialties Supply feedstock for workpiece finishing machine
EP0665706A1 (en) * 1994-01-28 1995-08-02 Molex Incorporated Method of fabricating flat flexible circuits
FR2733553B1 (fr) * 1995-04-25 1997-07-11 Pem Sa Protection Electrolytiq Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant
US6405430B1 (en) * 1996-02-07 2002-06-18 Micron Technology, Inc. Workpiece moving methods
JP3422645B2 (ja) * 1997-02-14 2003-06-30 富士通株式会社 回路素子配置装置
TW396474B (en) * 1997-07-11 2000-07-01 Hitachi Ltd Method for forming bump bondings
KR100319198B1 (ko) * 1999-11-17 2001-12-29 윤종용 반도체 모듈에 히트 싱크를 조립하는 설비 및 그 조립 방법
US6629631B2 (en) * 2001-06-04 2003-10-07 Sony Corporation Solder iron pressure monitor and method of using same in manufacturing a cathode ray tube
US7296727B2 (en) * 2001-06-27 2007-11-20 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting electronic components
KR100490700B1 (ko) * 2002-09-26 2005-05-19 주식회사 풍산마이크로텍 전자부품 조립용 리벳팅 머신.
GB2437999B (en) 2006-05-10 2009-07-29 Dek Int Gmbh Workpiece carrier and workpiece positioning system and method
JP5083158B2 (ja) * 2008-10-03 2012-11-28 パナソニック株式会社 電子部品実装用装置および電子部品実装用装置における操作指示方法
AT523710B1 (de) * 2020-04-24 2021-11-15 Trotec Laser Gmbh Verfahren zum Betreiben und Steuern einer Laservorrichtung für das Gravieren, Markieren, Beschriften und/oder Schneiden eines vorzugsweiser flachen Werkstückes

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DE1054379B (de) * 1956-04-05 1959-04-02 Gen Electric Co Ltd Vorrichtung fuer das absatzweise und lagerichtige Zufuehren einer Reihe von Werkstuecken gleicher Laenge zu nacheinander zu durchlaufenden Bearbeitungsstellen
DE2356140A1 (de) * 1972-11-09 1974-05-22 Cii Honeywell Bull Vorrichtung zum anloeten von integrierten schaltungsplaettchen an einem substrat
FR2225977A5 (en) * 1973-04-13 1974-11-08 Honeywell Bull Soc Ind Feeding mechanism for perforated flexible strip - claws feed strip intermittently under control of double slide mechanism

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US3412451A (en) * 1966-02-10 1968-11-26 Amp Inc Force limiting tool
US3508315A (en) * 1967-07-26 1970-04-28 Essington Metal Works Inc Apparatus for inserting and for securing preformed electronic components to printed circuit boards
US3597824A (en) * 1968-03-19 1971-08-10 Matsushita Electric Industrial Co Ltd Full-automatic electric part mounting apparatus
US3744361A (en) * 1971-02-08 1973-07-10 Lummus Industries Process and apparatus for cutting elongated material
US3710479A (en) * 1971-03-01 1973-01-16 Ibm Component insertion apparatus
US3735911A (en) * 1971-04-30 1973-05-29 Ibm Integrated circuit chip repair tool
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US3742574A (en) * 1971-12-03 1973-07-03 Gte Automatic Electric Lab Inc Wire braid forming apparatus
US3765075A (en) * 1972-01-03 1973-10-16 Honeywell Inf Systems Method and apparatus for inserting pins into a circuit board
US3783488A (en) * 1972-07-05 1974-01-08 Universal Instruments Corp Film mounted electronic component insertion machine
FR2238247B1 (en:Method) * 1973-06-27 1976-11-12 Honeywell Bull Soc Ind
US3893232A (en) * 1973-08-16 1975-07-08 Ibm Electronic component assembly apparatus
JPS51116968A (en) * 1975-04-07 1976-10-14 Matsushita Electric Industrial Co Ltd Device for inserting electric parts
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1054379B (de) * 1956-04-05 1959-04-02 Gen Electric Co Ltd Vorrichtung fuer das absatzweise und lagerichtige Zufuehren einer Reihe von Werkstuecken gleicher Laenge zu nacheinander zu durchlaufenden Bearbeitungsstellen
DE2356140A1 (de) * 1972-11-09 1974-05-22 Cii Honeywell Bull Vorrichtung zum anloeten von integrierten schaltungsplaettchen an einem substrat
FR2225977A5 (en) * 1973-04-13 1974-11-08 Honeywell Bull Soc Ind Feeding mechanism for perforated flexible strip - claws feed strip intermittently under control of double slide mechanism

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0020832A1 (en) * 1979-06-26 1981-01-07 Excellon Industries Pattern recognition system and method for using this system

Also Published As

Publication number Publication date
CH628196A5 (fr) 1982-02-15
BE855977A (fr) 1977-10-17
NL185966B (nl) 1990-03-16
JPS6337520B2 (en:Method) 1988-07-26
JPS5397369A (en) 1978-08-25
CA1091818A (fr) 1980-12-16
NL185966C (nl) 1990-08-16
US4236306A (en) 1980-12-02
FR2379909A1 (fr) 1978-09-01
DE2804693C2 (en:Method) 1992-05-21
SE7709735L (sv) 1978-08-05
NL7712371A (nl) 1978-08-08
SE422868B (sv) 1982-03-29
US4236301A (en) 1980-12-02
GB1590545A (en) 1981-06-03
FR2379909B1 (en:Method) 1980-06-13

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8128 New person/name/address of the agent

Representative=s name: PRINZ, E., DIPL.-ING. LEISER, G., DIPL.-ING. SCHWE

8127 New person/name/address of the applicant

Owner name: BULL CP8, TRAPPES, FR

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee