DE2654471A1 - Kontaktierkopf fuer die herstellung einer drahtverbindung an einem mikroschaltkreis - Google Patents

Kontaktierkopf fuer die herstellung einer drahtverbindung an einem mikroschaltkreis

Info

Publication number
DE2654471A1
DE2654471A1 DE19762654471 DE2654471A DE2654471A1 DE 2654471 A1 DE2654471 A1 DE 2654471A1 DE 19762654471 DE19762654471 DE 19762654471 DE 2654471 A DE2654471 A DE 2654471A DE 2654471 A1 DE2654471 A1 DE 2654471A1
Authority
DE
Germany
Prior art keywords
wire
contacting
guide
head according
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762654471
Other languages
German (de)
English (en)
Inventor
Karl Nicklaus
Miroslav Dipl Ing Dr Tresky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Esec Sales SA
Original Assignee
Esec Sales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sales SA filed Critical Esec Sales SA
Publication of DE2654471A1 publication Critical patent/DE2654471A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Wire Bonding (AREA)
  • Media Introduction/Drainage Providing Device (AREA)
DE19762654471 1975-12-23 1976-12-01 Kontaktierkopf fuer die herstellung einer drahtverbindung an einem mikroschaltkreis Withdrawn DE2654471A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1675175A CH592365A5 (https=) 1975-12-23 1975-12-23

Publications (1)

Publication Number Publication Date
DE2654471A1 true DE2654471A1 (de) 1977-07-07

Family

ID=4419901

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762654471 Withdrawn DE2654471A1 (de) 1975-12-23 1976-12-01 Kontaktierkopf fuer die herstellung einer drahtverbindung an einem mikroschaltkreis

Country Status (4)

Country Link
US (1) US4069961A (https=)
CH (1) CH592365A5 (https=)
DE (1) DE2654471A1 (https=)
FR (1) FR2336814A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101862897A (zh) * 2010-02-11 2010-10-20 深圳市贵鸿达电子有限公司 一种功率器件的铜线键合方法

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3023772A1 (de) * 1979-06-29 1981-01-15 Texas Instruments Inc Vorrichtung zum andruecken eines werkzeugs gegen eine arbeitsflaeche
CH636291A5 (fr) * 1980-07-15 1983-05-31 Charmilles Sa Ateliers Procede et dispositif pour introduire le bout d'une electrode-fil dans l'orifice de depart d'une piece a decouper par etincelage erosif.
US4475681A (en) * 1982-05-24 1984-10-09 The Micromanipulator Co., Inc. Bonder apparatus
JPS5950536A (ja) * 1982-09-16 1984-03-23 Toshiba Corp ワイヤボンデイング装置
DE3672530D1 (de) * 1985-05-31 1990-08-16 Dynapert Delvotec Sa Verbindungskopf.
US4645118A (en) * 1985-08-29 1987-02-24 Biggs Kenneth L Method and means for threading wire bonding machines
US4747814A (en) * 1986-07-23 1988-05-31 American Filtrona Corporation Fiber separator
DE3805584A1 (de) * 1988-02-23 1989-08-31 Dynapert Delvotec Gmbh Vorrichtung und verfahren zur gesteuerten zufuehrung eines bonddrahtes zum "wedge" oder zur kapillare eines bondkopfes
DE58908123D1 (de) * 1988-02-23 1994-09-08 F&K Delvotec Bondtechnik Gmbh Vorrichtung und Verfahren zur gesteuerten Zuführung eines Bonddrahtes zum wedge oder zur Kapillare eines Bondkopfes.
WO1994003036A1 (en) * 1992-07-24 1994-02-03 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
US6054756A (en) * 1992-07-24 2000-04-25 Tessera, Inc. Connection components with frangible leads and bus
US5977618A (en) 1992-07-24 1999-11-02 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
US5390844A (en) * 1993-07-23 1995-02-21 Tessera, Inc. Semiconductor inner lead bonding tool
JP3075100B2 (ja) * 1994-10-06 2000-08-07 松下電器産業株式会社 ワイヤボンディング装置およびワイヤボンディング方法
US20020151111A1 (en) * 1995-05-08 2002-10-17 Tessera, Inc. P-connection components with frangible leads and bus
JPH0945721A (ja) * 1995-08-03 1997-02-14 Kaijo Corp ワイヤ案内装置及びワイヤ案内方法並びに該装置を具備したワイヤボンディング装置
US6329607B1 (en) 1995-09-18 2001-12-11 Tessera, Inc. Microelectronic lead structures with dielectric layers
US5868301A (en) * 1996-04-10 1999-02-09 Tessera, Inc. Semiconductor inner lead bonding tool
JPH10163246A (ja) * 1996-11-29 1998-06-19 Shinkawa Ltd ワイヤボンディング装置
US5937276A (en) * 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
WO2008057091A1 (en) * 2006-11-09 2008-05-15 Kulicke And Soffa Industries, Inc. Wire feed system for a wire bonding machine and configured to apply a variable tension to the wire; method of operating the same
US7954689B2 (en) * 2007-05-04 2011-06-07 Asm Technology Singapore Pte Ltd Vacuum wire tensioner for wire bonder
TWI566875B (zh) * 2014-02-24 2017-01-21 新川股份有限公司 線張力器
CN112917062B (zh) * 2021-03-11 2022-08-02 河南省锅炉压力容器安全检测研究院 一种密封面堆焊送丝装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL142018B (nl) * 1964-11-26 1974-04-16 Philips Nv Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze.
US3319859A (en) * 1965-03-04 1967-05-16 Basic Products Corp Capillary wire feed device
US3342396A (en) * 1965-03-08 1967-09-19 Basic Products Corp Air spindle for bonding machines
US3776447A (en) * 1969-06-30 1973-12-04 Texas Instruments Inc Automatic semiconductor bonding machine
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding
US3672556A (en) * 1970-07-13 1972-06-27 John C Diepeveen Wire clamp
US3727822A (en) * 1970-10-05 1973-04-17 Gen Electric Electromagnetic force system for integrated circuit fabrication
JPS5310425B2 (https=) * 1974-09-13 1978-04-13

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101862897A (zh) * 2010-02-11 2010-10-20 深圳市贵鸿达电子有限公司 一种功率器件的铜线键合方法
CN101862897B (zh) * 2010-02-11 2013-07-03 深圳市贵鸿达电子有限公司 一种功率器件的铜线键合方法

Also Published As

Publication number Publication date
FR2336814A1 (fr) 1977-07-22
US4069961A (en) 1978-01-24
CH592365A5 (https=) 1977-10-31
FR2336814B1 (https=) 1982-11-19

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Legal Events

Date Code Title Description
8141 Disposal/no request for examination