FR2336814B1 - - Google Patents

Info

Publication number
FR2336814B1
FR2336814B1 FR7638742A FR7638742A FR2336814B1 FR 2336814 B1 FR2336814 B1 FR 2336814B1 FR 7638742 A FR7638742 A FR 7638742A FR 7638742 A FR7638742 A FR 7638742A FR 2336814 B1 FR2336814 B1 FR 2336814B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7638742A
Other languages
French (fr)
Other versions
FR2336814A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Esec Sales SA
Original Assignee
Esec Sales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sales SA filed Critical Esec Sales SA
Publication of FR2336814A1 publication Critical patent/FR2336814A1/fr
Application granted granted Critical
Publication of FR2336814B1 publication Critical patent/FR2336814B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
FR7638742A 1975-12-23 1976-12-22 Tete de formation de contacts dans un microcircuit Granted FR2336814A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1675175A CH592365A5 (https=) 1975-12-23 1975-12-23

Publications (2)

Publication Number Publication Date
FR2336814A1 FR2336814A1 (fr) 1977-07-22
FR2336814B1 true FR2336814B1 (https=) 1982-11-19

Family

ID=4419901

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7638742A Granted FR2336814A1 (fr) 1975-12-23 1976-12-22 Tete de formation de contacts dans un microcircuit

Country Status (4)

Country Link
US (1) US4069961A (https=)
CH (1) CH592365A5 (https=)
DE (1) DE2654471A1 (https=)
FR (1) FR2336814A1 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3023772A1 (de) * 1979-06-29 1981-01-15 Texas Instruments Inc Vorrichtung zum andruecken eines werkzeugs gegen eine arbeitsflaeche
CH636291A5 (fr) * 1980-07-15 1983-05-31 Charmilles Sa Ateliers Procede et dispositif pour introduire le bout d'une electrode-fil dans l'orifice de depart d'une piece a decouper par etincelage erosif.
US4475681A (en) * 1982-05-24 1984-10-09 The Micromanipulator Co., Inc. Bonder apparatus
JPS5950536A (ja) * 1982-09-16 1984-03-23 Toshiba Corp ワイヤボンデイング装置
DE3672530D1 (de) * 1985-05-31 1990-08-16 Dynapert Delvotec Sa Verbindungskopf.
US4645118A (en) * 1985-08-29 1987-02-24 Biggs Kenneth L Method and means for threading wire bonding machines
US4747814A (en) * 1986-07-23 1988-05-31 American Filtrona Corporation Fiber separator
DE3805584A1 (de) * 1988-02-23 1989-08-31 Dynapert Delvotec Gmbh Vorrichtung und verfahren zur gesteuerten zufuehrung eines bonddrahtes zum "wedge" oder zur kapillare eines bondkopfes
DE58908123D1 (de) * 1988-02-23 1994-09-08 F&K Delvotec Bondtechnik Gmbh Vorrichtung und Verfahren zur gesteuerten Zuführung eines Bonddrahtes zum wedge oder zur Kapillare eines Bondkopfes.
WO1994003036A1 (en) * 1992-07-24 1994-02-03 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
US6054756A (en) * 1992-07-24 2000-04-25 Tessera, Inc. Connection components with frangible leads and bus
US5977618A (en) 1992-07-24 1999-11-02 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
US5390844A (en) * 1993-07-23 1995-02-21 Tessera, Inc. Semiconductor inner lead bonding tool
JP3075100B2 (ja) * 1994-10-06 2000-08-07 松下電器産業株式会社 ワイヤボンディング装置およびワイヤボンディング方法
US20020151111A1 (en) * 1995-05-08 2002-10-17 Tessera, Inc. P-connection components with frangible leads and bus
JPH0945721A (ja) * 1995-08-03 1997-02-14 Kaijo Corp ワイヤ案内装置及びワイヤ案内方法並びに該装置を具備したワイヤボンディング装置
US6329607B1 (en) 1995-09-18 2001-12-11 Tessera, Inc. Microelectronic lead structures with dielectric layers
US5868301A (en) * 1996-04-10 1999-02-09 Tessera, Inc. Semiconductor inner lead bonding tool
JPH10163246A (ja) * 1996-11-29 1998-06-19 Shinkawa Ltd ワイヤボンディング装置
US5937276A (en) * 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
WO2008057091A1 (en) * 2006-11-09 2008-05-15 Kulicke And Soffa Industries, Inc. Wire feed system for a wire bonding machine and configured to apply a variable tension to the wire; method of operating the same
US7954689B2 (en) * 2007-05-04 2011-06-07 Asm Technology Singapore Pte Ltd Vacuum wire tensioner for wire bonder
CN101862897B (zh) * 2010-02-11 2013-07-03 深圳市贵鸿达电子有限公司 一种功率器件的铜线键合方法
TWI566875B (zh) * 2014-02-24 2017-01-21 新川股份有限公司 線張力器
CN112917062B (zh) * 2021-03-11 2022-08-02 河南省锅炉压力容器安全检测研究院 一种密封面堆焊送丝装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL142018B (nl) * 1964-11-26 1974-04-16 Philips Nv Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze.
US3319859A (en) * 1965-03-04 1967-05-16 Basic Products Corp Capillary wire feed device
US3342396A (en) * 1965-03-08 1967-09-19 Basic Products Corp Air spindle for bonding machines
US3776447A (en) * 1969-06-30 1973-12-04 Texas Instruments Inc Automatic semiconductor bonding machine
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding
US3672556A (en) * 1970-07-13 1972-06-27 John C Diepeveen Wire clamp
US3727822A (en) * 1970-10-05 1973-04-17 Gen Electric Electromagnetic force system for integrated circuit fabrication
JPS5310425B2 (https=) * 1974-09-13 1978-04-13

Also Published As

Publication number Publication date
FR2336814A1 (fr) 1977-07-22
US4069961A (en) 1978-01-24
DE2654471A1 (de) 1977-07-07
CH592365A5 (https=) 1977-10-31

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Legal Events

Date Code Title Description
ST Notification of lapse