JPS5310425B2 - - Google Patents

Info

Publication number
JPS5310425B2
JPS5310425B2 JP10502174A JP10502174A JPS5310425B2 JP S5310425 B2 JPS5310425 B2 JP S5310425B2 JP 10502174 A JP10502174 A JP 10502174A JP 10502174 A JP10502174 A JP 10502174A JP S5310425 B2 JPS5310425 B2 JP S5310425B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10502174A
Other languages
Japanese (ja)
Other versions
JPS5133564A (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10502174A priority Critical patent/JPS5310425B2/ja
Priority to GB3767875A priority patent/GB1467208A/en
Priority to US05/613,542 priority patent/US4019669A/en
Publication of JPS5133564A publication Critical patent/JPS5133564A/ja
Publication of JPS5310425B2 publication Critical patent/JPS5310425B2/ja
Priority to HK308/79A priority patent/HK30879A/xx
Priority to MY7900224A priority patent/MY7900224A/xx
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP10502174A 1974-09-13 1974-09-13 Expired JPS5310425B2 (https=)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP10502174A JPS5310425B2 (https=) 1974-09-13 1974-09-13
GB3767875A GB1467208A (en) 1974-09-13 1975-09-12 Wire bonding apparatus
US05/613,542 US4019669A (en) 1974-09-13 1975-09-15 Wire bonding apparatus
HK308/79A HK30879A (en) 1974-09-13 1979-05-10 Wire bonding apparatus
MY7900224A MY7900224A (en) 1974-09-13 1979-12-30 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10502174A JPS5310425B2 (https=) 1974-09-13 1974-09-13

Publications (2)

Publication Number Publication Date
JPS5133564A JPS5133564A (https=) 1976-03-22
JPS5310425B2 true JPS5310425B2 (https=) 1978-04-13

Family

ID=14396392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10502174A Expired JPS5310425B2 (https=) 1974-09-13 1974-09-13

Country Status (5)

Country Link
US (1) US4019669A (https=)
JP (1) JPS5310425B2 (https=)
GB (1) GB1467208A (https=)
HK (1) HK30879A (https=)
MY (1) MY7900224A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS603350A (ja) * 1983-06-18 1985-01-09 ド−エイ外装有限会社 雨樋
JP2019139199A (ja) * 2018-02-11 2019-08-22 エーエーシー テクノロジーズ ピーティーイー リミテッド 撮像光学レンズ

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH592365A5 (https=) * 1975-12-23 1977-10-31 Esec Sales Sa
US4498638A (en) * 1983-06-24 1985-02-12 Fairchild Camera & Instrument Corporation Apparatus for maintaining reserve bonding wire
US4685631A (en) * 1983-06-24 1987-08-11 Fairchild Semiconductor Corporation Apparatus for feeding bonding wire
US4763826A (en) * 1986-05-14 1988-08-16 Kulicke And Soffa Ind., Inc. Automatic wire feed system
JPH088271B2 (ja) * 1988-11-01 1996-01-29 株式会社新川 ワイヤボンデイング装置
US5318234A (en) * 1992-08-25 1994-06-07 West Bond Inc. Automatic wire de-spooler for wire bonding machines
JP3180205B2 (ja) * 1994-04-07 2001-06-25 株式会社新川 ワイヤボンデイング装置
US5791550A (en) * 1996-08-02 1998-08-11 Shinkawa U.S.A. Incorporated Method and apparatus for wire bonding
JPH10163246A (ja) * 1996-11-29 1998-06-19 Shinkawa Ltd ワイヤボンディング装置
US6520400B2 (en) 2001-03-30 2003-02-18 Kulicke & Soffa Investments, Inc. Wire tensioning apparatus
US7004373B1 (en) * 2003-04-07 2006-02-28 West Bond, Inc. Wire bond fault detection method and apparatus
US20120152925A1 (en) * 2010-12-16 2012-06-21 Illinois Tool Works Inc. Welding wire feeder with improved wire guide
US9254984B2 (en) 2010-12-16 2016-02-09 Illinois Tool Works Inc. Welding wire feeder with improved wire guide
JP2014043336A (ja) * 2012-08-28 2014-03-13 Kanai Hiroaki 金属線条体の張力調整装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1140629A (fr) * 1955-01-29 1957-07-31 Int Standard Electric Corp Perfectionnements aux machines à bobiner
GB865022A (en) * 1958-11-13 1961-04-12 Standard Telephones Cables Ltd Improvements in or relating to apparatus for winding filamentary materials
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS603350A (ja) * 1983-06-18 1985-01-09 ド−エイ外装有限会社 雨樋
JP2019139199A (ja) * 2018-02-11 2019-08-22 エーエーシー テクノロジーズ ピーティーイー リミテッド 撮像光学レンズ

Also Published As

Publication number Publication date
HK30879A (en) 1979-05-18
US4019669A (en) 1977-04-26
MY7900224A (en) 1979-12-31
JPS5133564A (https=) 1976-03-22
GB1467208A (en) 1977-03-16

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