GB1467208A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
GB1467208A
GB1467208A GB3767875A GB3767875A GB1467208A GB 1467208 A GB1467208 A GB 1467208A GB 3767875 A GB3767875 A GB 3767875A GB 3767875 A GB3767875 A GB 3767875A GB 1467208 A GB1467208 A GB 1467208A
Authority
GB
United Kingdom
Prior art keywords
wire
capillary
clamp
spool
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3767875A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB1467208A publication Critical patent/GB1467208A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
GB3767875A 1974-09-13 1975-09-12 Wire bonding apparatus Expired GB1467208A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10502174A JPS5310425B2 (https=) 1974-09-13 1974-09-13

Publications (1)

Publication Number Publication Date
GB1467208A true GB1467208A (en) 1977-03-16

Family

ID=14396392

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3767875A Expired GB1467208A (en) 1974-09-13 1975-09-12 Wire bonding apparatus

Country Status (5)

Country Link
US (1) US4019669A (https=)
JP (1) JPS5310425B2 (https=)
GB (1) GB1467208A (https=)
HK (1) HK30879A (https=)
MY (1) MY7900224A (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH592365A5 (https=) * 1975-12-23 1977-10-31 Esec Sales Sa
JPS603350A (ja) * 1983-06-18 1985-01-09 ド−エイ外装有限会社 雨樋
US4498638A (en) * 1983-06-24 1985-02-12 Fairchild Camera & Instrument Corporation Apparatus for maintaining reserve bonding wire
US4685631A (en) * 1983-06-24 1987-08-11 Fairchild Semiconductor Corporation Apparatus for feeding bonding wire
US4763826A (en) * 1986-05-14 1988-08-16 Kulicke And Soffa Ind., Inc. Automatic wire feed system
JPH088271B2 (ja) * 1988-11-01 1996-01-29 株式会社新川 ワイヤボンデイング装置
US5318234A (en) * 1992-08-25 1994-06-07 West Bond Inc. Automatic wire de-spooler for wire bonding machines
JP3180205B2 (ja) * 1994-04-07 2001-06-25 株式会社新川 ワイヤボンデイング装置
US5791550A (en) * 1996-08-02 1998-08-11 Shinkawa U.S.A. Incorporated Method and apparatus for wire bonding
JPH10163246A (ja) * 1996-11-29 1998-06-19 Shinkawa Ltd ワイヤボンディング装置
US6520400B2 (en) 2001-03-30 2003-02-18 Kulicke & Soffa Investments, Inc. Wire tensioning apparatus
US7004373B1 (en) * 2003-04-07 2006-02-28 West Bond, Inc. Wire bond fault detection method and apparatus
US20120152925A1 (en) * 2010-12-16 2012-06-21 Illinois Tool Works Inc. Welding wire feeder with improved wire guide
US9254984B2 (en) 2010-12-16 2016-02-09 Illinois Tool Works Inc. Welding wire feeder with improved wire guide
JP2014043336A (ja) * 2012-08-28 2014-03-13 Kanai Hiroaki 金属線条体の張力調整装置
US10712534B2 (en) * 2018-02-11 2020-07-14 Aac Optics Solutions Pte. Ltd. Camera optical lens

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1140629A (fr) * 1955-01-29 1957-07-31 Int Standard Electric Corp Perfectionnements aux machines à bobiner
GB865022A (en) * 1958-11-13 1961-04-12 Standard Telephones Cables Ltd Improvements in or relating to apparatus for winding filamentary materials
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding

Also Published As

Publication number Publication date
HK30879A (en) 1979-05-18
US4019669A (en) 1977-04-26
MY7900224A (en) 1979-12-31
JPS5133564A (https=) 1976-03-22
JPS5310425B2 (https=) 1978-04-13

Similar Documents

Publication Publication Date Title
GB1467208A (en) Wire bonding apparatus
US4387283A (en) Apparatus and method of forming aluminum balls for ball bonding
GB1428295A (en) Apparatus and method for bedning tubing
GB1466711A (en) Automatic brazing soldering or welding apparatus
GB2002268A (en) Harness making apparatus
GB1076526A (en) Hot gas thermo-compression bonding
DE69532796D1 (de) Tragbare abwickelvorrichtung für einen schweissdraht
JPH0225044A (ja) ワイヤーボンダーの酸化防止システム
JPS648906A (en) Method and apparatus for supplying and sewing protective tape to end part of slide fastener
JPS5784144A (en) Bonding of fine metal wire
IE41391L (en) Method of coating
JPS55156334A (en) Wire bonding method and apparatus thereof
FR2355581A1 (fr) Procede et banc d'etirage de pieces cylindriques tubulaires
NO820329L (no) Fremgangsmaate og innretning for forming og stramming av en baandsloeyfe rundt en pakke
GB1371619A (en) Methods of and apparatus for feeding thin wire strip tape or like members through insulating or other tubes or sleeves into which they are required to be fitted
JPS58151038A (ja) ワイヤボンデイング装置
FR2097339A5 (en) Feed device - for supplying tape intermittently to a sewing machine
GB1176712A (en) Improvements in or relating to Strapping Machines.
JP2645014B2 (ja) ワイヤボンディング装置
SU132722A1 (ru) Способ припайки электродных выводов полупроводниковых приборов
JPS62216239A (ja) ワイヤボンデイング装置のテンシヨナ−
JPS62298014A (ja) ワイヤの端末処理方法
JPS5683042A (en) Wire clamping system of wire bonder
JPS57132335A (en) Wire bonding method
FR2362222A1 (fr) Procede et dispositifs pour transformer en fibres une matiere etirable

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years

Effective date: 19950911