DE2618022A1 - Verfahren zur fluessigkeitsbehandlung im rahmen der herstellung von integrierten halbleiterschaltungen - Google Patents

Verfahren zur fluessigkeitsbehandlung im rahmen der herstellung von integrierten halbleiterschaltungen

Info

Publication number
DE2618022A1
DE2618022A1 DE19762618022 DE2618022A DE2618022A1 DE 2618022 A1 DE2618022 A1 DE 2618022A1 DE 19762618022 DE19762618022 DE 19762618022 DE 2618022 A DE2618022 A DE 2618022A DE 2618022 A1 DE2618022 A1 DE 2618022A1
Authority
DE
Germany
Prior art keywords
wafer
liquid
etching
photoresist
meniscus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762618022
Other languages
German (de)
English (en)
Inventor
Roderuc Jermit Hood
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2618022A1 publication Critical patent/DE2618022A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photographic Processing Devices Using Wet Methods (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE19762618022 1975-04-28 1976-04-24 Verfahren zur fluessigkeitsbehandlung im rahmen der herstellung von integrierten halbleiterschaltungen Withdrawn DE2618022A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/572,570 US3953265A (en) 1975-04-28 1975-04-28 Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers

Publications (1)

Publication Number Publication Date
DE2618022A1 true DE2618022A1 (de) 1976-11-11

Family

ID=24288426

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762618022 Withdrawn DE2618022A1 (de) 1975-04-28 1976-04-24 Verfahren zur fluessigkeitsbehandlung im rahmen der herstellung von integrierten halbleiterschaltungen

Country Status (5)

Country Link
US (1) US3953265A (cg-RX-API-DMAC7.html)
JP (1) JPS5931853B2 (cg-RX-API-DMAC7.html)
DE (1) DE2618022A1 (cg-RX-API-DMAC7.html)
FR (1) FR2312113A1 (cg-RX-API-DMAC7.html)
GB (1) GB1490828A (cg-RX-API-DMAC7.html)

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JP4700117B2 (ja) 2009-02-25 2011-06-15 東京エレクトロン株式会社 現像処理方法
KR20110106178A (ko) * 2010-03-22 2011-09-28 삼성전자주식회사 기판 처리 장치 및 방법
JP5815967B2 (ja) * 2011-03-31 2015-11-17 東京エレクトロン株式会社 基板洗浄装置及び真空処理システム
KR101290527B1 (ko) * 2011-05-31 2013-07-30 주식회사 테스 기판처리시스템 및 이를 이용한 기판처리방법
JP5829082B2 (ja) * 2011-09-09 2015-12-09 オリンパス株式会社 洗浄装置
KR20140139131A (ko) 2011-12-15 2014-12-04 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 폐 전기 및 전자 장비의 재활용 동안 땜납 금속의 스트리핑을 위한 장치 및 방법
JP6234736B2 (ja) * 2013-08-30 2017-11-22 芝浦メカトロニクス株式会社 スピン処理装置
CN106546088A (zh) * 2015-09-16 2017-03-29 泰科电子(上海)有限公司 风干系统
FR3154956A1 (fr) 2023-11-08 2025-05-09 Stellantis Auto Sas Pièce d’ornement pour planche de bord et ensemble comprenant une telle pièce d’ornement

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Also Published As

Publication number Publication date
FR2312113A1 (fr) 1976-12-17
US3953265A (en) 1976-04-27
JPS51132972A (en) 1976-11-18
FR2312113B1 (cg-RX-API-DMAC7.html) 1978-05-19
JPS5931853B2 (ja) 1984-08-04
GB1490828A (en) 1977-11-02

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