DE2608427C2 - Verfahren zum Aufkitten von Halbleiterscheiben - Google Patents

Verfahren zum Aufkitten von Halbleiterscheiben

Info

Publication number
DE2608427C2
DE2608427C2 DE2608427A DE2608427A DE2608427C2 DE 2608427 C2 DE2608427 C2 DE 2608427C2 DE 2608427 A DE2608427 A DE 2608427A DE 2608427 A DE2608427 A DE 2608427A DE 2608427 C2 DE2608427 C2 DE 2608427C2
Authority
DE
Germany
Prior art keywords
semiconductor wafers
temperature
cementing
resin
carrier plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2608427A
Other languages
German (de)
English (en)
Other versions
DE2608427A1 (de
Inventor
Bruno Meissner
Heinz-Jörg Dipl.-Chem. Dr. Rath
Dieter Dipl.-Chem. Dr. Regler
Dietrich Dipl.-Phys. Dr. Schmidt
Jürgen Dipl.-Chem. Dr. 8263 Burghausen Voß
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Priority to DE2608427A priority Critical patent/DE2608427C2/de
Priority to NL7614209A priority patent/NL7614209A/xx
Priority to GB2317/77A priority patent/GB1505488A/en
Priority to US05/766,457 priority patent/US4300965A/en
Priority to CA271,285A priority patent/CA1075579A/en
Priority to IT48216/77A priority patent/IT1083481B/it
Priority to FR7705766A priority patent/FR2343330A1/fr
Priority to BE175315A priority patent/BE851892A/xx
Priority to JP2213677A priority patent/JPS52106683A/ja
Priority to SE7702273A priority patent/SE7702273L/xx
Publication of DE2608427A1 publication Critical patent/DE2608427A1/de
Application granted granted Critical
Publication of DE2608427C2 publication Critical patent/DE2608427C2/de
Expired legal-status Critical Current

Links

Classifications

    • H10P50/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
DE2608427A 1976-03-01 1976-03-01 Verfahren zum Aufkitten von Halbleiterscheiben Expired DE2608427C2 (de)

Priority Applications (10)

Application Number Priority Date Filing Date Title
DE2608427A DE2608427C2 (de) 1976-03-01 1976-03-01 Verfahren zum Aufkitten von Halbleiterscheiben
NL7614209A NL7614209A (nl) 1976-03-01 1976-12-21 Werkwijze voor het opbrengen door kitten van halfgeleiderschijven.
GB2317/77A GB1505488A (en) 1976-03-01 1977-01-20 Cementing semiconductor discs to carrier plates
US05/766,457 US4300965A (en) 1976-03-01 1977-02-07 Process for cementing semiconductor discs to carrier plates and product so obtained
CA271,285A CA1075579A (en) 1976-03-01 1977-02-08 Process for cementing semiconductor discs to carrier plates and product so obtained
IT48216/77A IT1083481B (it) 1976-03-01 1977-02-25 Procedimento per attaccare con mastice piastrine di semiconduttori
FR7705766A FR2343330A1 (fr) 1976-03-01 1977-02-28 Procede de masticage de disques semi-conducteurs
BE175315A BE851892A (fr) 1976-03-01 1977-02-28 Procede de masticage de disques semi-conducteurs
JP2213677A JPS52106683A (en) 1976-03-01 1977-03-01 Method of bonding semiconductor disk
SE7702273A SE7702273L (sv) 1976-03-01 1977-03-01 Forfarande for pakittning av halvledarskivor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2608427A DE2608427C2 (de) 1976-03-01 1976-03-01 Verfahren zum Aufkitten von Halbleiterscheiben

Publications (2)

Publication Number Publication Date
DE2608427A1 DE2608427A1 (de) 1977-09-08
DE2608427C2 true DE2608427C2 (de) 1984-07-19

Family

ID=5971267

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2608427A Expired DE2608427C2 (de) 1976-03-01 1976-03-01 Verfahren zum Aufkitten von Halbleiterscheiben

Country Status (10)

Country Link
US (1) US4300965A (index.php)
JP (1) JPS52106683A (index.php)
BE (1) BE851892A (index.php)
CA (1) CA1075579A (index.php)
DE (1) DE2608427C2 (index.php)
FR (1) FR2343330A1 (index.php)
GB (1) GB1505488A (index.php)
IT (1) IT1083481B (index.php)
NL (1) NL7614209A (index.php)
SE (1) SE7702273L (index.php)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2809274A1 (de) * 1978-03-03 1979-09-13 Wacker Chemitronic Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren
US4517041A (en) * 1982-09-30 1985-05-14 Magnetic Peripherals Inc. Method for attaching a workpiece to a workpiece carrier
US4530138A (en) * 1982-09-30 1985-07-23 Westinghouse Electric Corp. Method of making a transducer assembly
DE3670178D1 (de) * 1986-08-13 1990-05-10 Toshiba Kawasaki Kk Apparat zum zusammenfuegen von halbleiterscheiben.
JP3537688B2 (ja) * 1998-11-24 2004-06-14 富士通株式会社 磁気ヘッドの加工方法
DE10052293A1 (de) * 2000-10-20 2002-04-25 B L E Lab Equipment Gmbh Verfahren zum Aufbringen eines Substrats

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1950468A (en) * 1930-04-18 1934-03-13 Nat Aniline & Chem Co Inc Alkyd resinous composition
US2394689A (en) * 1944-01-07 1946-02-12 American Viscose Corp Method of dyeing
US3335087A (en) * 1965-12-20 1967-08-08 Pennsalt Chemical Corp Method of stripping resins
US3452133A (en) * 1966-03-07 1969-06-24 Schjeldahl Co G T Annealing of metal-plastic laminates
US3475867A (en) * 1966-12-20 1969-11-04 Monsanto Co Processing of semiconductor wafers
US3449870A (en) * 1967-01-24 1969-06-17 Geoscience Instr Corp Method and apparatus for mounting thin elements
US3586559A (en) * 1968-07-01 1971-06-22 Rohr Corp Method of temporarily securing a workpiece to a workholder
JPS5121334B2 (index.php) * 1971-08-27 1976-07-01
DE2247067C3 (de) * 1972-09-26 1979-08-09 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Verwendung einer Poliersuspension zum schleierfreien Polieren von Halbleiteroberflächen
US3888053A (en) * 1973-05-29 1975-06-10 Rca Corp Method of shaping semiconductor workpiece

Also Published As

Publication number Publication date
JPS5641167B2 (index.php) 1981-09-26
NL7614209A (nl) 1977-09-05
BE851892A (fr) 1977-08-29
JPS52106683A (en) 1977-09-07
IT1083481B (it) 1985-05-21
FR2343330A1 (fr) 1977-09-30
SE7702273L (sv) 1977-09-02
FR2343330B1 (index.php) 1978-10-20
GB1505488A (en) 1978-03-30
CA1075579A (en) 1980-04-15
DE2608427A1 (de) 1977-09-08
US4300965A (en) 1981-11-17

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Legal Events

Date Code Title Description
OD Request for examination
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee