DE2606963C3 - Verfahren zur Herstellung einer hartlötbaren Dickschichtschaltung auf ein vorzugsweise aus einer Oxidkeramik bestehendes Trägerplättchen - Google Patents
Verfahren zur Herstellung einer hartlötbaren Dickschichtschaltung auf ein vorzugsweise aus einer Oxidkeramik bestehendes TrägerplättchenInfo
- Publication number
- DE2606963C3 DE2606963C3 DE2606963A DE2606963A DE2606963C3 DE 2606963 C3 DE2606963 C3 DE 2606963C3 DE 2606963 A DE2606963 A DE 2606963A DE 2606963 A DE2606963 A DE 2606963A DE 2606963 C3 DE2606963 C3 DE 2606963C3
- Authority
- DE
- Germany
- Prior art keywords
- carrier plate
- silver
- copper
- thick
- conductor tracks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910052574 oxide ceramic Inorganic materials 0.000 title claims description 5
- 239000011224 oxide ceramic Substances 0.000 title claims description 5
- 239000004020 conductor Substances 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 229910052709 silver Inorganic materials 0.000 claims description 12
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 10
- 238000005219 brazing Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 238000007650 screen-printing Methods 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 239000000725 suspension Substances 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000005751 Copper oxide Substances 0.000 claims description 4
- 229910000431 copper oxide Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000005496 eutectics Effects 0.000 claims description 3
- 229910000108 silver(I,III) oxide Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- ASTZLJPZXLHCSM-UHFFFAOYSA-N dioxido(oxo)silane;manganese(2+) Chemical compound [Mn+2].[O-][Si]([O-])=O ASTZLJPZXLHCSM-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- -1 rutherium Chemical compound 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2606963A DE2606963C3 (de) | 1976-02-20 | 1976-02-20 | Verfahren zur Herstellung einer hartlötbaren Dickschichtschaltung auf ein vorzugsweise aus einer Oxidkeramik bestehendes Trägerplättchen |
| GB316/77A GB1508560A (en) | 1976-02-20 | 1977-01-06 | Thick-film circuits |
| FR7701307A FR2341947A1 (fr) | 1976-02-20 | 1977-01-18 | Procede pour la preparation d'un circuit a couches epaisses sur une plaquette de support, de preference en ceramique oxydee |
| JP1802477A JPS52110498A (en) | 1976-02-20 | 1977-02-21 | Method of manufacturing thckkfilm circuit |
| US05/770,368 US4084314A (en) | 1976-02-20 | 1977-02-22 | Producing thick film circuits having terminal elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2606963A DE2606963C3 (de) | 1976-02-20 | 1976-02-20 | Verfahren zur Herstellung einer hartlötbaren Dickschichtschaltung auf ein vorzugsweise aus einer Oxidkeramik bestehendes Trägerplättchen |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2606963A1 DE2606963A1 (de) | 1977-08-25 |
| DE2606963B2 DE2606963B2 (de) | 1979-11-08 |
| DE2606963C3 true DE2606963C3 (de) | 1981-07-23 |
Family
ID=5970474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2606963A Expired DE2606963C3 (de) | 1976-02-20 | 1976-02-20 | Verfahren zur Herstellung einer hartlötbaren Dickschichtschaltung auf ein vorzugsweise aus einer Oxidkeramik bestehendes Trägerplättchen |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4084314A (enExample) |
| JP (1) | JPS52110498A (enExample) |
| DE (1) | DE2606963C3 (enExample) |
| FR (1) | FR2341947A1 (enExample) |
| GB (1) | GB1508560A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2737227C2 (de) * | 1977-08-18 | 1987-05-14 | MTU Motoren- und Turbinen-Union München GmbH, 8000 München | Poröser Formkörper aus Keramik mit einer porendichten Beschichtung und Verfahren zu seiner Herstellung |
| US4312896A (en) * | 1978-08-07 | 1982-01-26 | Graham Magnetics, Inc. | Novel soldering process comprising coating a dielectric substrate with electroconductive metal protected by nickel carbide |
| US4521329A (en) * | 1983-06-20 | 1985-06-04 | E. I. Du Pont De Nemours And Company | Copper conductor compositions |
| US4623482A (en) * | 1985-10-25 | 1986-11-18 | Cts Corporation | Copper conductive paint for porcelainized metal substrates |
| US4908740A (en) * | 1989-02-09 | 1990-03-13 | Hudgins Richard D | Integral composite structure with predetermined electrically conductive networks and method for producing same |
| JP3026465B2 (ja) * | 1992-03-10 | 2000-03-27 | 株式会社日立製作所 | セラミック薄膜混成配線基板および製造方法 |
| DE4320910C1 (de) * | 1993-06-18 | 1994-09-08 | Siemens Ag | Verfahren zur Herstellung einer gasdichten Lötverbindung und Anwendung des Verfahrens bei der Herstellung von Bauelementen mit vakuumdichten Gehäuse |
| FR2791147B1 (fr) * | 1999-03-19 | 2002-08-30 | Saint Gobain Vitrage | Dispositif electrochimique du type dispositif electrocommandable a proprietes optiques et/ou energetiques variables |
| CN201888020U (zh) * | 2010-05-25 | 2011-06-29 | 景德镇正宇奈米科技有限公司 | 陶瓷印刷电路板结构 |
| CN114388169A (zh) * | 2021-12-28 | 2022-04-22 | 江苏云意电气股份有限公司 | 一种导体浆料及其制备方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3374110A (en) * | 1964-05-27 | 1968-03-19 | Ibm | Conductive element, composition and method |
| US3450545A (en) * | 1966-05-31 | 1969-06-17 | Du Pont | Noble metal metalizing compositions |
| DE1963286C3 (de) * | 1969-12-17 | 1974-03-14 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Paste zur Herstellung von Dickfilmverdrahtungen |
| US3714709A (en) * | 1970-07-06 | 1973-02-06 | Rca Corp | Method of manufacturing thick-film hybrid integrated circuits |
| US3904461A (en) * | 1972-10-02 | 1975-09-09 | Bendix Corp | Method of manufacturing solderable thin film microcircuit with stabilized resistive films |
| FR2234239B1 (enExample) * | 1973-06-25 | 1977-02-18 | Ishizuka Glass |
-
1976
- 1976-02-20 DE DE2606963A patent/DE2606963C3/de not_active Expired
-
1977
- 1977-01-06 GB GB316/77A patent/GB1508560A/en not_active Expired
- 1977-01-18 FR FR7701307A patent/FR2341947A1/fr active Granted
- 1977-02-21 JP JP1802477A patent/JPS52110498A/ja active Pending
- 1977-02-22 US US05/770,368 patent/US4084314A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| GB1508560A (en) | 1978-04-26 |
| JPS52110498A (en) | 1977-09-16 |
| DE2606963B2 (de) | 1979-11-08 |
| FR2341947A1 (fr) | 1977-09-16 |
| US4084314A (en) | 1978-04-18 |
| FR2341947B1 (enExample) | 1979-03-23 |
| DE2606963A1 (de) | 1977-08-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| 8339 | Ceased/non-payment of the annual fee |