DE2525652A1 - Leistungshalbleiterbauelement - Google Patents

Leistungshalbleiterbauelement

Info

Publication number
DE2525652A1
DE2525652A1 DE19752525652 DE2525652A DE2525652A1 DE 2525652 A1 DE2525652 A1 DE 2525652A1 DE 19752525652 DE19752525652 DE 19752525652 DE 2525652 A DE2525652 A DE 2525652A DE 2525652 A1 DE2525652 A1 DE 2525652A1
Authority
DE
Germany
Prior art keywords
heat pipes
semiconductor component
heat
power semiconductor
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19752525652
Other languages
German (de)
English (en)
Inventor
Pavel Kafunek
Jindrich Kratina
Michal Dipl Ing Pellant
Oldrich Dipl Ing Pokorny
Pavel Dipl Ing Reichel
Jaroslav Zuna
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CKD Praha DIZ AS
Original Assignee
CKD Praha DIZ AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CKD Praha DIZ AS filed Critical CKD Praha DIZ AS
Publication of DE2525652A1 publication Critical patent/DE2525652A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Resistance Heating (AREA)
  • Die Bonding (AREA)
DE19752525652 1974-09-05 1975-06-09 Leistungshalbleiterbauelement Pending DE2525652A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS6116A CS169520B1 (enEXAMPLES) 1974-09-05 1974-09-05

Publications (1)

Publication Number Publication Date
DE2525652A1 true DE2525652A1 (de) 1976-03-25

Family

ID=5407436

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752525652 Pending DE2525652A1 (de) 1974-09-05 1975-06-09 Leistungshalbleiterbauelement

Country Status (8)

Country Link
US (1) US4037246A (enEXAMPLES)
JP (1) JPS5138979A (enEXAMPLES)
CH (1) CH589360A5 (enEXAMPLES)
CS (1) CS169520B1 (enEXAMPLES)
DE (1) DE2525652A1 (enEXAMPLES)
GB (1) GB1482297A (enEXAMPLES)
PL (1) PL100320B1 (enEXAMPLES)
SE (1) SE7506725L (enEXAMPLES)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3501732A1 (de) * 1984-01-19 1985-07-25 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Einrichtung zur verlustwaermeabfuhr von halbleiterelementen
DE4025885A1 (de) * 1990-08-16 1992-02-20 Gewerk Auguste Victoria Kuehlvorrichtung fuer leistungs-halbleiterbauelemente, insbesondere thyristoren
DE4404035A1 (de) * 1994-02-09 1995-08-10 Sel Alcatel Ag Wärmeleitvorrichtung für elektrische Bauelemente

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
US4954875A (en) * 1986-07-17 1990-09-04 Laser Dynamics, Inc. Semiconductor wafer array with electrically conductive compliant material
US4897708A (en) * 1986-07-17 1990-01-30 Laser Dynamics, Inc. Semiconductor wafer array
JP2965729B2 (ja) * 1991-03-04 1999-10-18 日本石油化学株式会社 割繊具
JP3259599B2 (ja) * 1995-06-20 2002-02-25 三菱電機株式会社 圧接型半導体装置
US7348665B2 (en) * 2004-08-13 2008-03-25 Intel Corporation Liquid metal thermal interface for an integrated circuit device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734154A (en) * 1953-07-27 1956-02-07 Semiconductor devices
US3475660A (en) * 1967-12-01 1969-10-28 Int Rectifier Corp Hollow cylindrical semiconductor device
US3812404A (en) * 1973-05-29 1974-05-21 Gen Electric Increasing the initial flow rate in a rectifier assembly employing electromagnetically-pumped liquid metal for cooling

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3501732A1 (de) * 1984-01-19 1985-07-25 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Einrichtung zur verlustwaermeabfuhr von halbleiterelementen
DE4025885A1 (de) * 1990-08-16 1992-02-20 Gewerk Auguste Victoria Kuehlvorrichtung fuer leistungs-halbleiterbauelemente, insbesondere thyristoren
DE4404035A1 (de) * 1994-02-09 1995-08-10 Sel Alcatel Ag Wärmeleitvorrichtung für elektrische Bauelemente

Also Published As

Publication number Publication date
PL100320B1 (pl) 1978-09-30
SE7506725L (sv) 1976-03-08
CS169520B1 (enEXAMPLES) 1976-07-29
JPS5138979A (enEXAMPLES) 1976-03-31
US4037246A (en) 1977-07-19
CH589360A5 (enEXAMPLES) 1977-06-30
GB1482297A (en) 1977-08-10

Similar Documents

Publication Publication Date Title
DE3784130T2 (de) Kuehlung von objekten, zum beispiel halbleiteranordnungen.
EP0020981B1 (de) Anordnung für die Ableitung von Wärme von hochintegrierten Halbleiterschaltungen
DE2109116C3 (de) Halbleiteranordnung mit einem Halbleiterbauelement und einem Kühlmittelbehälter
DE102007046349B4 (de) Anordnung zum Kühlen eines Leistungshalbleitermoduls
DE2204589A1 (de) Kuehlanordnung fuer flache halbleiterbauelemente
DE2823296A1 (de) Kuehleinrichtung fuer ein elektronisches bauteil hoher verlustleistungsdichte
DE2825582A1 (de) Waermeabfuehreinrichtung fuer halbleitermodul
DE2555662A1 (de) Waermeableitendes halbleiterbauelement
EP0013362B1 (de) Vorrichtung zur Wärmeübertragung, insbesondere für integrierte Schaltungen
DE10049274B4 (de) Kühlvorrichtung und Verfahren zu deren Herstellung
DE1187285B (de) Halbleiter-Thermoelementanordnung mit loetfreien Druckkontakten
DE2711776A1 (de) Leistungshalbleiterbauelement
DE2525652A1 (de) Leistungshalbleiterbauelement
EP3823018A1 (de) Elektronikmodul mit einer pulsierenden heatpipe
DE1254251B (de) Halbleiterbauelement
DE2806099A1 (de) Halbleiter-baugruppe
DE2012440C3 (de) Halbleiteranordnung für gasdicht abgeschlossene scheibenförmige Halbleiterelemente
DE1601226A1 (de) Heizrohre
DE2015518A1 (de) Kühlvorrichtung für wärmeerzeugende Einrichtungen
DE1539638A1 (de) Halbleiteranordnung
DE2120477C3 (de) Elektrisch isolierende Wärmerohranordnung für hohe Wärmestromdichte
DE2423717A1 (de) Kuehlsystem fuer unterirdische elektrische energieleitungen
DE2947000C2 (de) Gehäuse für elektronische Vorrichtungen
EP1421618A2 (de) Leistungselektronikeinheit
DE3132112A1 (de) Kuehlvorrichtung fuer schaltungselemente, die waerme erzeugen