SE7506725L - Effekthalvledarkomponent - Google Patents

Effekthalvledarkomponent

Info

Publication number
SE7506725L
SE7506725L SE7506725A SE7506725A SE7506725L SE 7506725 L SE7506725 L SE 7506725L SE 7506725 A SE7506725 A SE 7506725A SE 7506725 A SE7506725 A SE 7506725A SE 7506725 L SE7506725 L SE 7506725L
Authority
SE
Sweden
Prior art keywords
power semi
leader component
leader
component
semi
Prior art date
Application number
SE7506725A
Other languages
English (en)
Inventor
M Pellant
O Pokorny
P P Reichel
J Zuna
P Kafunek
J Kratina
Original Assignee
Praha C K D Oborovy Podnik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Praha C K D Oborovy Podnik filed Critical Praha C K D Oborovy Podnik
Publication of SE7506725L publication Critical patent/SE7506725L/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
SE7506725A 1974-09-05 1975-06-12 Effekthalvledarkomponent SE7506725L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS6116A CS169520B1 (sv) 1974-09-05 1974-09-05

Publications (1)

Publication Number Publication Date
SE7506725L true SE7506725L (sv) 1976-03-08

Family

ID=5407436

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7506725A SE7506725L (sv) 1974-09-05 1975-06-12 Effekthalvledarkomponent

Country Status (8)

Country Link
US (1) US4037246A (sv)
JP (1) JPS5138979A (sv)
CH (1) CH589360A5 (sv)
CS (1) CS169520B1 (sv)
DE (1) DE2525652A1 (sv)
GB (1) GB1482297A (sv)
PL (1) PL100320B1 (sv)
SE (1) SE7506725L (sv)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
DE3501732A1 (de) * 1984-01-19 1985-07-25 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Einrichtung zur verlustwaermeabfuhr von halbleiterelementen
US4897708A (en) * 1986-07-17 1990-01-30 Laser Dynamics, Inc. Semiconductor wafer array
US4954875A (en) * 1986-07-17 1990-09-04 Laser Dynamics, Inc. Semiconductor wafer array with electrically conductive compliant material
DE4025885C2 (de) * 1990-08-16 1994-09-08 Gewerk Auguste Victoria Halbleitersäule
JP2965729B2 (ja) * 1991-03-04 1999-10-18 日本石油化学株式会社 割繊具
DE4404035A1 (de) * 1994-02-09 1995-08-10 Sel Alcatel Ag Wärmeleitvorrichtung für elektrische Bauelemente
JP3259599B2 (ja) * 1995-06-20 2002-02-25 三菱電機株式会社 圧接型半導体装置
US7348665B2 (en) * 2004-08-13 2008-03-25 Intel Corporation Liquid metal thermal interface for an integrated circuit device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734154A (en) * 1953-07-27 1956-02-07 Semiconductor devices
US3475660A (en) * 1967-12-01 1969-10-28 Int Rectifier Corp Hollow cylindrical semiconductor device
US3812404A (en) * 1973-05-29 1974-05-21 Gen Electric Increasing the initial flow rate in a rectifier assembly employing electromagnetically-pumped liquid metal for cooling

Also Published As

Publication number Publication date
CS169520B1 (sv) 1976-07-29
US4037246A (en) 1977-07-19
CH589360A5 (sv) 1977-06-30
JPS5138979A (sv) 1976-03-31
GB1482297A (en) 1977-08-10
DE2525652A1 (de) 1976-03-25
PL100320B1 (pl) 1978-09-30

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