CS169520B1 - - Google Patents

Info

Publication number
CS169520B1
CS169520B1 CS6116A CS611674A CS169520B1 CS 169520 B1 CS169520 B1 CS 169520B1 CS 6116 A CS6116 A CS 6116A CS 611674 A CS611674 A CS 611674A CS 169520 B1 CS169520 B1 CS 169520B1
Authority
CS
Czechoslovakia
Application number
CS6116A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to CS6116A priority Critical patent/CS169520B1/cs
Priority to GB21641/75A priority patent/GB1482297A/en
Priority to DE19752525652 priority patent/DE2525652A1/de
Priority to CH748875A priority patent/CH589360A5/xx
Priority to SE7506725A priority patent/SE7506725L/xx
Priority to JP50082000A priority patent/JPS5138979A/ja
Priority to PL1975182031A priority patent/PL100320B1/xx
Priority to US05/596,437 priority patent/US4037246A/en
Publication of CS169520B1 publication Critical patent/CS169520B1/cs

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Resistance Heating (AREA)
  • Die Bonding (AREA)
CS6116A 1974-09-05 1974-09-05 CS169520B1 (cs)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CS6116A CS169520B1 (cs) 1974-09-05 1974-09-05
GB21641/75A GB1482297A (en) 1974-09-05 1975-05-20 Semiconductor power component
DE19752525652 DE2525652A1 (de) 1974-09-05 1975-06-09 Leistungshalbleiterbauelement
CH748875A CH589360A5 (cs) 1974-09-05 1975-06-10
SE7506725A SE7506725L (sv) 1974-09-05 1975-06-12 Effekthalvledarkomponent
JP50082000A JPS5138979A (cs) 1974-09-05 1975-07-04
PL1975182031A PL100320B1 (pl) 1974-09-05 1975-07-09 Polprzewodnikowy element mocy
US05/596,437 US4037246A (en) 1974-09-05 1975-07-16 High-power semiconductive devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS6116A CS169520B1 (cs) 1974-09-05 1974-09-05

Publications (1)

Publication Number Publication Date
CS169520B1 true CS169520B1 (cs) 1976-07-29

Family

ID=5407436

Family Applications (1)

Application Number Title Priority Date Filing Date
CS6116A CS169520B1 (cs) 1974-09-05 1974-09-05

Country Status (8)

Country Link
US (1) US4037246A (cs)
JP (1) JPS5138979A (cs)
CH (1) CH589360A5 (cs)
CS (1) CS169520B1 (cs)
DE (1) DE2525652A1 (cs)
GB (1) GB1482297A (cs)
PL (1) PL100320B1 (cs)
SE (1) SE7506725L (cs)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
DE3501732A1 (de) * 1984-01-19 1985-07-25 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Einrichtung zur verlustwaermeabfuhr von halbleiterelementen
US4954875A (en) * 1986-07-17 1990-09-04 Laser Dynamics, Inc. Semiconductor wafer array with electrically conductive compliant material
US4897708A (en) * 1986-07-17 1990-01-30 Laser Dynamics, Inc. Semiconductor wafer array
DE4025885C2 (de) * 1990-08-16 1994-09-08 Gewerk Auguste Victoria Halbleitersäule
JP2965729B2 (ja) * 1991-03-04 1999-10-18 日本石油化学株式会社 割繊具
DE4404035A1 (de) * 1994-02-09 1995-08-10 Sel Alcatel Ag Wärmeleitvorrichtung für elektrische Bauelemente
JP3259599B2 (ja) * 1995-06-20 2002-02-25 三菱電機株式会社 圧接型半導体装置
US7348665B2 (en) * 2004-08-13 2008-03-25 Intel Corporation Liquid metal thermal interface for an integrated circuit device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734154A (en) * 1953-07-27 1956-02-07 Semiconductor devices
US3475660A (en) * 1967-12-01 1969-10-28 Int Rectifier Corp Hollow cylindrical semiconductor device
US3812404A (en) * 1973-05-29 1974-05-21 Gen Electric Increasing the initial flow rate in a rectifier assembly employing electromagnetically-pumped liquid metal for cooling

Also Published As

Publication number Publication date
JPS5138979A (cs) 1976-03-31
CH589360A5 (cs) 1977-06-30
DE2525652A1 (de) 1976-03-25
SE7506725L (sv) 1976-03-08
US4037246A (en) 1977-07-19
GB1482297A (en) 1977-08-10
PL100320B1 (pl) 1978-09-30

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